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Data Processing: Design And Analysis Of Circuit Or Semiconductor Mask > Design Of Semiconductor Mask > Mesh Generation

Mesh Generation

Mesh Generation patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

11/15/07 - 20070266364 - Method and system for context-specific mask writing
A method for generating lithography masks includes generating integrated circuit design data and using context information from the integrated circuit design data to write a mask. ...

11/15/07 - 20070266363 - System and method of automatically generating kerf design data
A method and system is provided to use the same design manipulation processes for both chip design and kerf design. Concurrent generation of kerf designs and chip designs provides a consistent, accurate, and repeatable process. Improved quality of wafer testing results because the data in the kerf matches data in ...

06/21/07 - 20070143734 - Method and system for improving aerial image simulation speeds
A method and system for improving aerial image simulation speeds. The method includes receiving a mask; generating a matrix of node values based on the mask, wherein each node value corresponds to a node of a plurality of nodes in a lattice; performing a one-dimensional (1-D) approximation of a plurality ...

05/31/07 - 20070124720 - Program for causing a computer to execute a method of generating mesh data and apparatus for generating mesh data
A method of generating mesh data by orthogonally dividing a target object into a mesh of elements by a plurality of grid lines orthogonally crossing each other includes the steps of (a) detecting vertexes of the target object; and (b) dividing the target object orthogonally by the grid lines passing ...

03/01/07 - 20070050749 - Method for identifying and using process window signature patterns for lithography process control
A method for identifying process window signature patterns in a device area of a mask is disclosed. The signature patterns collectively provide a unique response to changes in a set of process condition parameters to the lithography process. The signature patterns enable monitoring of associated process condition parameters for signs ...

01/11/07 - 20070011646 - Parallel decoupled mesh generation
A method of mesh generation processing for a bounded domain is provided. The bounded domain is divided into constituent sub-domains with a portion of the sub-domains being assigned to each of a plurality of processors. The processors are operated independently and in parallel. Each processor (i) discretizes the closed boundary ...

11/02/06 - 20060248496 - Apparatus and method for segmenting edges for optical proximity correction
An apparatus and method for modifying a mask data set includes calculating a derivative of a figure-of-merit, indicative of a data set defined by a plurality of polygon edges and then segmenting polygon edges in response to said step of calculating. ...

10/19/06 - 20060236296 - Method and apparatus for identifying assist feature placement problems
One embodiment of the present invention provides a system that identifies an area in a mask layout which is likely to cause manufacturing problems due to a missing or an improperly placed assist feature. During operation, the system receives an uncorrected or corrected mask layout. The system then dissects the ...

05/04/06 - 20060095888 - Statistical optimization and design method for analog and digital circuits
A computer implemented method of performing projection based polynomial fitting. The method includes generating a plurality of sampling points as a function of variables. The method also includes forming a polynomial model template representative of the plurality of sampling points. According to embodiments of the present invention, the polynomial model ...

04/06/06 - 20060075378 - Calculating etch proximity-correction using image-precision techniques
One embodiment of the present invention provides a system that calculates etch proximity-correction during an OPC (Optical Proximity Correction) process. During operation, the system receives a layout for an integrated circuit. Next, the system selects a target point on an edge in the layout. The system then casts a plurality ...

03/16/06 - 20060059452 - Pattern component analysis and manipulation
A method for determining component patterns of a raw substrate map. A subset of substrate patterns is selected from a set of substrate patterns, and combined into a composite substrate map. The substrate patterns are weighted. The composite substrate map is compared to the raw substrate map, and a degree ...

03/09/06 - 20060053406 - Healing algorithm
An aspect of the present invention includes a method for reshaping sub-objects in at least one object in pattern design data to be presented to a mask writer or a direct writer for producing a pattern onto a workpiece, where said object comprises a plurality of slivers in a first ...

02/02/06 - 20060026551 - Accurate density calculation with density views in layout databases
Generating a density abstraction view for an integrated circuit design by dividing each block in the design that is larger than a predetermined size into a grid of rectangles; calculating a sum of metal area in each rectangle in the grid; creating an object in each rectangle having an area ...

11/24/05 - 20050262469 - Method of calculating predictive shape of wiring structure, calculating apparatus, and computer-readable recording medium
In a calculating apparatus for calculating a predictive shape of a wire structure using a finite element model, a predictive shape of the finite element model which is in a physically balanced condition based on physical properties and restriction conditions is calculated. When it is determined that the predictive shape ...

10/13/05 - 20050229146 - Data storage method and data storage device
In a data storage method and device, input data having a pattern are divided into a plurality of fields. A first number of rectangles contained in each field of an original image of the pattern is calculated by dividing the field of the original image into one or plurality of ...

09/08/05 - 20050198608 - Conductor stack shifting
A method for integrating a first integrated circuit design having first layers and a second integrated circuit design having second layers into a common reticle set. The second integrated circuit design has a given number of second layers and the first integrated circuit design has less than the given number ...

08/04/05 - 20050172256 - Mask set for measuring an overlapping error and method of measuring an overlapping error using the same
A mask set for measuring an overlapping error according to the invention comprises a first mask consisted of a mask substrate on which a plurality of unit patterns are formed: The plurality of unit patterns are arranged in radial shape round a given center. The mask set of the present ...

07/28/05 - 20050166174 - System and method for lithography simulation
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a technique of, and system for simulating, verifying, inspecting, characterizing, determining and/or evaluating the lithographic designs, techniques and/or systems, and/or individual functions performed thereby or components used therein. In one embodiment, the present ...

07/07/05 - 20050149901 - Resolution enhancing technology using phase assignment bridges
In one embodiment, a spacing is determined for each edge of a number of features in a photolithographic design. The edges have at least a partially predictable layout. Based on the spacing and the predictable layout, a bridge structure is generated. Each bridge of the bridge structure connects one of ...

06/23/05 - 20050138598 - Method for providing layout design and photo mask
A method for providing the layout design of semiconductor integrated circuit that is capable of promoting the reduction of the circuit pattern area is provided. A hole pattern is disposed at the mesh point which is an intersecting point of mutually orthogonal virtual grid lines and another hole pattern is ...

06/23/05 - 20050138597 - Method and apparatus for optimizing fragmentation of boundaries for optical proximity correction (opc) purposes
The present invention is directed to a method and apparatus for optimizing fragmentation of integrated circuit boundaries for optical proximity correction (OPC) purposes. The present invention may balance the number of vertices and the “flexibility” of the boundary and may recover fragmentation according to the process intensity profile along the ...

06/02/05 - 20050120327 - System and method for lithography simulation
There are many inventions described and illustrated herein. In one aspect, the present invention is directed to a technique of, and system for simulating, verifying, inspecting, characterizing, determining and/or evaluating the lithographic designs, techniques and/or systems, and/or individual functions performed thereby or components used therein. In one embodiment, the present ...



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