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Synthetic Resins Or Natural Rubbers -- Part Of The Class 520 Series > Natural Rubber Compositions Having Nonreactive Materials (dnrm) Other Than: Carbon, Silicon Dioxide, Glass Titanium Dioxide, Water, Hydrocarbon, Halohydrocarbon > Ethylenically Unsaturated Reactant Admixed With A Preformed Reaction Product Derived From: (a) At Least One Polycarboxylic Acid, Ester, Or Anhydride; (b) At Least One Polyhydroxy Compound; And (c) At Least One Fatty Acid Glycerol Ester, Or A Fatty Acid Or Salt Derived From A Naturally Occurring Glyceride, Tall Oil, Or A Tall Oil Fatty Acid > Solid Polymer Contains More Than One 1,2-epoxy Group Or Is Derived From Reactant Containing At Least One 1,2-epoxy Group Solid Polymer Contains More Than One 1,2-epoxy Group Or Is Derived From Reactant Containing At Least One 1,2-epoxy GroupSolid Polymer Contains More Than One 1,2-epoxy Group Or Is Derived From Reactant Containing At Least One 1,2-epoxy Group patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.01/11/07 - 20070010636 - Latent hardener A latent curing agent that can cure a thermosetting epoxy resin in a relatively short period of time and at a relatively low temperature has a structure in which an aluminum chelating agent is held by a porous resin carrier obtained through interfacial polymerization of a polyfunctional isocyanate compound. The ... 11/16/06 - 20060258822 - Curing accelerator, epoxy resin composition, and semiconductor device A curing accelerator which is suitable for various curable resin compositions, an epoxy resin composition having excellent curability, storage stability and fluidity, and a semiconductor device having excellent solder cracking resistance and moisture resistance reliability are provided. The epoxy resin composition includes a compound (A) having two or more epoxy ... 11/02/06 - 20060247393 - Flame retardant epoxy resin composition and semiconductor device using the same An epoxy resin composition which can be used as a semiconductor encapsulating resin and in which the improvement of flame retardancy can be attained by suitably adapting a crosslinked structure itself of a cured article without using any flame retardant material and without particularly highly filling an inorganic filler. The ... 11/02/06 - 20060247392 - Epoxy resin composition, process for producing epoxy resin, novel epoxy resin, novel phenol resin In the technical field where a difunctional epoxy resin having increased molecular weight is used to impart flexibility or improving dielectric properties, the present invention has remarkably improved moisture resistance and water resistance when used to produce a cured epoxy resin article. The epoxy resin composition comprises a difunctional epoxy ... 10/26/06 - 20060241251 - Coherent insert A coherent insert, in particular for filling a three-dimensional cavity, especially a cavity in the core of a sandwich-type composite, which insert is solid at ambient temperature, characterized in that the insert consists of a solid curable composition, which expands and is able to adhesively bond when heat-cured. ... 10/12/06 - 20060229418 - Low-cure powder coatings and methods for using the same each R3 and R4 are independently alkyl or aryl groups having 1 to 8 carbon atoms; each Z is independently oxygen or nitrogen; R5 is absent when Z is oxygen and R5 is hydrogen, an alkyl or aryl group having 1 to 20 carbon atoms, or (Y)a—R2—when Z is nitrogen; ... 05/18/06 - 20060106177 - Fluorocarbon-modified epoxy resin The present invention is a fluorocarbon-modified epoxy resin obtained by allowing 4-vinylcyclohexene 1-oxide to react with a fluorocarbon compound having an active-hydrogen-containing group and epoxidizing the vinyl group of the resultant fluorocarbon-modified polyether compound, which is a polyfunctional alicyclic epoxy resin improved in heat resistance and hygroscopicity and having an ... 01/12/06 - 20060009593 - Polyaddition compound and cationic electrodeposition paint which contains polyaddition compound This invention provides a polyaddition compound of a glycidyl ether compound (a1) having a polyoxyalkylene chain with an amine compound (a2) having at least one active hydrogen, which has a weight average molecular weight of 250-10,000, said polyaddition compound, when used for cationic electrodeposition paint, giving a coating film which ... 12/29/05 - 20050288455 - Curable epoxy resin composition A curable epoxy resin composition containing a modified polymer (A) modified with a TEMPO derivative having a nitroxide radical with an epoxy reactive group in the molecule thereof, an epoxy resin (B) and an epoxy curing agent (C). ... 12/29/05 - 20050288454 - Low coefficient of thermal expansion (cte) thermosetting resins for integrated circuit applications An embodiment of the present invention is a technique to form a resin. A mixture is formed by a curing agent dissolved in the epoxy resin. The epoxy resin contains a first rigid rod mesogen. The curing agent contains a second rigid rod mesogen and one of a hydroxyl, amine, ... 12/08/05 - 20050272882 - Polymer and epoxy resin compositions The present invention provides a vinyl polymer with an epoxy group terminally introduced therein and an epoxy resin composition comprising (A) an epoxy resin and (B) a vinyl polymer which has a main chain produced by living radical polymerization and has a reactive functional group at a main chain terminus. ... 11/17/05 - 20050256277 - Polyepoxy compounds having an amide linkage The present invention provides compounds that have an amide linkage and at least two epoxy groups. The compounds are preferably aliphatic. ... 09/22/05 - 20050209416 - Isolatable, water soluble, and hydrolytically stable active sulfones of poly(ethylene glycol) and related polymers for modification of surfaces and molecules A poly(ethylene glycol) derivative is disclosed that is activated with a sulfone moiety for selective attachment to thiol moieties on molecules and surfaces. The activated PEG is water soluble, hydrolytically stable for extended periods, and forms hydrolytically stable linkages with thiol moieties. The linkages generally are not reversible in reducing ... 07/21/05 - 20050159561 - Copolymer of ethylene oxide and at least one substituted oxirane carrying a cross-linkable function, process for preparation thereof, and use thereof for producing ionically conductive materials The invention concerns a copolymer of ethylene oxide and at least one substituted oxirane carrying a cross-linkable function. The copolymer comprises ethylene oxide, —O—CH2—CHR— units in which R is a substituent containing a reactive function which is cross-linkable by free radical process, and possibly —O—CH2—CHR′— units in which R′ is ... 06/16/05 - 20050131166 - Process for producing high speed transmitting dielectric material A process for producing high speed transmitting dielectric materials comprises essentially mixing and reacting a proportion of polyphenylene ether (PPE) with a proportion of an epoxy resin of the type of low bromine content in a non-polar solvent in the presence of a catalyst in a reactor at a temperature ... ### FreshPatents.com Support |