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Synthetic Resins Or Natural Rubbers -- Part Of The Class 520 Series > Natural Rubber Compositions Having Nonreactive Materials (dnrm) Other Than: Carbon, Silicon Dioxide, Glass Titanium Dioxide, Water, Hydrocarbon, Halohydrocarbon > Ethylenically Unsaturated Reactant Admixed With A Preformed Reaction Product Derived From: (a) At Least One Polycarboxylic Acid, Ester, Or Anhydride; (b) At Least One Polyhydroxy Compound; And (c) At Least One Fatty Acid Glycerol Ester, Or A Fatty Acid Or Salt Derived From A Naturally Occurring Glyceride, Tall Oil, Or A Tall Oil Fatty Acid > Solid Polymer Derived Solely From Phenolic Reactants Wherein None Of The Reactants Contains A Plurality Of Methylol Groups Or Derivatives Thereof > Mixed With Ethylenically Unsaturated Reactant Or Polymer Derived Therefrom Mixed With Ethylenically Unsaturated Reactant Or Polymer Derived TherefromMixed With Ethylenically Unsaturated Reactant Or Polymer Derived Therefrom patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.11/16/06 - 20060258816 - Flame-retardant styrenic resin composition The present invention provides a fire-retarding styrenic resin composition comprising (A) 100 parts by weight of a styrenic resin having a residue after thermal weight loss below 20% at 500° C., and (B) 0.5 to 50 parts by weight of a halogen compound-free fire retardant component, wherein the component (B) ... 06/22/06 - 20060135705 - Curable encapsulant composition, device including same, and associated method An encapsulant for encapsulating electronic components and a method of making and/or using the encapsulant may be provided. An electronic device that includes the encapsulant may be provided. The curable encapsulant composition may include a mixture of a functionalized polymer and at least one reactive monomer composition. The reactive monomer ... 06/22/06 - 20060135704 - Tack free compositions useful for electronic encapsulation A tack-free composition comprising a functionalized polymer having a having a glass transition temperature greater than about 24° C., a reactive monomer, said reactive monomer having a melting point or softening point greater than about 24° C., a reinforcing filler, and an initiator (curing agent) is provided. The tack-free composition ... 02/23/06 - 20060041086 - Functionalized poly(arylene ether) composition and method A curable composition includes an olefinically unsaturated monomer and a poly(arylene ether) having two polymerizable groups and an intrinsic viscosity of about 0.05 to about 0.30 deciliters per gram. The composition exhibits an improved combination of high flow during molding and high post-cure stiffness and impact strength. The composition is ... ### FreshPatents.com Support - Terms & Conditions |