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Synthetic Resins Or Natural Rubbers -- Part Of The Class 520 Series > Involving Inert Gas, Steam, Nitrogen Gas, Or Carbon Dioxide > Processes Of Preparing A Desired Or Intentional Composition Of At Least One Nonreactant Material And At Least One Solid Polymer Or Specified Intermediate Condensation Product, Or Product Thereof > Process Of Forming A Composition Containing A Nonreactive Material (nrm) And A Polymer Containing More Than One 1,2-epoxy Group, Or A Preformed Polymer Derived From Or Admixed With A Reactant Containing More Than One 1,2-epoxy Group, Or With A Polymer Derived From An Epihalohydrin And A Polyhydric Phenol Or Polyol; Or Composition Or Product Thereof Process Of Forming A Composition Containing A Nonreactive Material (nrm) And A Polymer Containing More Than One 1,2-epoxy Group, Or A Preformed Polymer Derived From Or Admixed With A Reactant Containing More Than One 1,2-epoxy Group, Or With A Polymer Derived From An Epihalohydrin And A Polyhydric Phenol Or Polyol; Or Composition Or Product ThereofProcess Of Forming A Composition Containing A Nonreactive Material (nrm) And A Polymer Containing More Than One 1,2-epoxy Group, Or A Preformed Polymer Derived From Or Admixed With A Reactant Containing More Than One 1,2-epoxy Group, Or With A Polymer Derived From An Epihalohydrin And A Polyhydric Phenol Or Polyol; Or Composition Or Product Thereof patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.11/02/06 - 20060247333 - Epoxy resin composition A composition comprising (A) an epoxide containing at least two epoxy groups per molecule, (B) a polyol containing at least two hydroxy groups per molecule or a primary or secondary amine containing at least two amino-hydrogen atoms per molecule, and (C) a solid compound containing at least two isocyanate groups, ... 08/24/06 - 20060189721 - Epoxy resin composition, process for providing latency to the composition and semiconductor device (c) A silane compound represented by general formula [3]: ... 08/24/06 - 20060189720 - Rubber composition, crosslinkable rubber compositions, and crosslinked articles A rubber composition includes (1) a diene rubber, (2) a silica and (3) an epoxidized liquid diene rubber having a number-average molecular weight of 10000 to 100000, wherein based on 100 parts by mass of the diene rubber (1), the rubber composition comprises 0.1 to 150 parts by mass of ... 06/29/06 - 20060142427 - Epoxy resin composition containing reactive flame retardant phosphonate oligomer and filler An epoxy resin composition is disclosed that comprises an epoxy resin, a reactive phosphonate curing agent, an inorganic filler, whose presence allows for reduced amounts of phosphonate as compared to a composition not containing the filler, an optional polybenzoxazine resin, and an optional co-curing agent. ... 06/01/06 - 20060116444 - Resin compositions for press-cured mica tapes for high voltage insulation Resin composition comprising an epoxy resin having an epoxide functionality of at least 2.5, a cycloaliphatic epoxy resin, a phenol-formaldehyde novolac and aluminum acetylacetonate. The resin is heat stable and is suitable for fabrication of resin-rich mica tapes having low reactivity at ambient temperatures for good shelf life stability combined ... 05/11/06 - 20060100315 - Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device The present invention provides an adhesive composition which comprises (a) an epoxy resin, (b) a curing agent and (c) a polymer compound incompatible with said epoxy resin, and further optionally comprises (d) a filler and/or (e) a curing accelerator; a process for producing an adhesive composition, comprising: mixing (a) the ... 05/04/06 - 20060094797 - Epoxy resin composition and semiconductor device The present invention is to provide an epoxy resin composition for encapsulating a semiconductor having a high flame resistance without using a flame retarder and having an excellent solder reflow resistance, and a semiconductor device using the same for encapsulating a semiconductor element. An epoxy resin composition for encapsulating a ... 04/13/06 - 20060079609 - Heat curable resin composition having a low elastic modulus, heat curable film using same, and cured products A heat curable resin composition having a low elastic modulus comprising (A) an epoxy resin, (B) crosslinked fine particles, and (C) a curing agent, which when cured with heat, produces a cured product having a elastic modulus of less than 1 GPa is provided. A cured product excelling in characteristics ... 04/06/06 - 20060074150 - Encapsulating epoxy resin molding material and semiconductor device An encapsulating epoxy resin molding material comprising (A) an epoxy resin, (B) a curing agent, and (C) a silane coupling agent having a secondary amino group or (D) a phosphate, and semiconductor devices encapsulated therein. The encapsulating epoxy resin molding material for thin semiconductor devices according to this invention is ... 04/06/06 - 20060074149 - Process for manufacturing an alpha-dihydroxy derivative and epoxy resins prepared therefrom A process for manufacturing an α-dihydroxy derivative from an aryl allyl ether wherein such α-dihydroxy derivative can be used to prepare an α-halohydrin intermediate and an epoxy resin prepared therefrom including epoxidizing an α-halohydrin intermediate produced from a halide substitution of an α-dihydroxy derivative which has been obtained by a ... 03/23/06 - 20060063862 - Base paints containing fatty acid-modified epoxy esters and/or fatty acid-modified alkyd resins, methods for the production thereof and their use The present invention relates to basecoat materials comprising one or more water soluble, fatty acid modified epoxy esters and/or one or more fatty acid modified alkyd resins, to processes for preparing them, and to their use. ... 03/16/06 - 20060058428 - Fluorinated compounds having epoxy and vinyl ether functional groups wherein X and Y are independently H, a halogen, or a linear or branched C1 to C12 fluoroalkyl group; and Rf is a linear or branched C1 to C12 fluoroalkyl group or a halogen. ... 02/09/06 - 20060030642 - Phenolic resin and method of producing the same wherein the dihydroxy compound is partially dehydrated. ... 12/29/05 - 20050288395 - Epoxy resin curing agent for enhanced wear resistance and weatherability of cured materials Hardener for curing of epoxy resins which produces materials with high abrasion resistance, photostability and chemical resistance, comprising a sol prepared by controlled hydrolysis and condensation of compounds of the type: (X—B—)nSi(—Y)4-n where n=1 or 2, X═SH, —N═C═O, or NR1R2, R1, R2 being chosen from hydrogen, saturated or unsaturated C1-C18-alkyl, ... 12/01/05 - 20050267236 - Semiconductor encapsulating epoxy resin composition and semiconductor device In an epoxy resin composition comprising (A) an epoxy resin, (B) a curing agent, (C) an inorganic compound, and (D) an inorganic filler, the inorganic compound (C) is an oxide of metal elements at least one of which is a metal element of Group II in the Periodic Table having ... 11/24/05 - 20050261397 - Epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device which uses the same (B) a curing agent, and (C) a curing accelerator. ... 11/03/05 - 20050245644 - High thermal conductivity materials with grafted surface functional groups In one embodiment the present invention provides for high thermal conductivity materials 30 that have surface functional groups grafted thereto. These grafted surface functional groups then form a continuous bond with a host resin matrix 32 that the high thermal conductivity materials 30 are added to. ... 11/03/05 - 20050245643 - Photo-induced cation curable epoxy resin composition This invention relates to a photocurable resin, in particular, to an epoxy resin composition curable by cation polymerization induced by photoirradiation. ... 10/27/05 - 20050239922 - Curable compositions having a reduced enthalpy output The present invention provides a curable composition selected from the group consisting of adhesives, sealants and coatings. The composition includes: (i) a curable component; (ii) a curing agent component for curing the curable component, the cure reaction being exothermic; and (iii) an inert heat absorbing component dispersed within the composition ... 10/13/05 - 20050228078 - Compositions and method for surface treatment of pigments wherein R1, R2, R3, R4 and R5 are each, independently, hydrogen, or substituted or unsubstituted alkyl, or R2 and R4 may be taken together to form a 5-7 membered ring, and R6 is hydrogen, —OOCR7, —OR8, —OOC—CR9═CR10R11, monoepoxy or polyepoxy group containing diphenyl, phenyl, or substituted or unsubstituted alkyl or ... 09/22/05 - 20050209371 - Polymerization of a reactive diluent in the presence of an epoxy-amine material, and coating compositions prepared thereby A process including the polymerization of a reactive diluent, which is present in an aqueous dispersion that further includes an epoxy-amine material, is disclosed. The resulting composition is useful as a coating composition. ... 07/14/05 - 20050154090 - Polymer composition and method of rapid preparation in situ A polymer composition in a thermosetting resin admixture having a subcomponent gelled phase or polyurea. The gelled phase or polyurea is capable of trapping particles of widely differing particle densities within the polymer composition, thereby preventing these particles from either sinking or floating. The polymer composition can be cured in ... 07/14/05 - 20050154089 - Metallic acrylate curing agents and usage thereof in intermediate compositions The disclosure relates to using metallic acrylate compounds such as zinc diacrylate (ZDA), zinc dimethacrylate (ZDMA), among others for curing epoxy functional (and other cross-linking compounds), and to compositions containing such compounds for use in powder coat, film, adhesive, among other applications. ZDA and ZDMA containing compounds can also be ... 07/07/05 - 20050148694 - Actinic radiation hardenable resin composition and hardening product thereof In Formula (1), R1 denotes an optionally branched alkyl group having 6 to 30 carbons, or a phenyl group substituted with an alkyl group having 4 to 30 carbons, and R2 denotes a hydrogen atom or an optionally branched alkyl group having 1 to 6 carbons. ... 06/30/05 - 20050143496 - Adhesives for car body assembly Two-component epoxide resin compositions are described in which the epoxy component A contains at least one epoxide resin with an epoxy functionality greater than 1 and as second component B there is used a liquid or pasty hardener component containing amines, polyetheramines, polyaminoamides, Mannich bases and/or compounds containing mercapto groups, ... 06/23/05 - 20050137292 - Adhesive composition The present invention provides an adhesive composition comprising a main adhesive composed of 50 to 100% by weight of BPA epoxy resin, 0.5 to 5% by weight of a dispersant and 0.5 to 5% by weight of a fluidity adjusting agent as additives, and 0 to 50% by weight of ... 06/02/05 - 20050119372 - Two component (epoxy/amine) structural foam-in-place material The present invention relates to methods, materials, and products for forming a foamed product, comprising the steps of combining an epoxy-based component with an amine-based component. The epoxy component is cross-linked through a polymerization reaction catalyzed by the amine formulation. In this regard, an reactive mixture or exothermic reaction is ... 06/02/05 - 20050119371 - Bio-based epoxy, their nanocomposites and methods for making those Precursor epoxidized vegetable oil or ester derivatives of the oil is mixed and cured with a biodegradation resistant epoxy resin precursor to provide a cured composition. The composition preferably includes a filler as a composite and/or continuous carbon fibers as a mat or strand. Novel epoxidized linseed/soybean oil compositions are ... ### FreshPatents.com Support |