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Compositions: Ceramic > Ceramic Compositions > Carbide Or Oxycarbide Containing > Silicon Carbide > And Carbonaceous Material And Carbonaceous MaterialAnd Carbonaceous Material patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.02/22/07 - 20070042895 - Heat sink made from diamond-copper composite material containing boron, and method of producing a heat sink A heat sink that is particularly suitable for semiconductor components is made from a diamond-containing composite material. In addition to a diamond fraction amounting to 40-90% by volume, the composite material also contains 7 to 59% by volume copper or a copper-rich phase (with Cu>80 at. %) and 0.01 to ... 09/28/06 - 20060217258 - Diamond-silicon carbide composite and method Uniformly dense, diamond-silicon carbide composites having high hardness, high fracture toughness, and high thermal stability are prepared by consolidating a powder mixture of diamond and amorphous silicon. A composite made at 5 GPa/1673K had a measured fracture toughness of 12 MPa·m1/2. By contrast, liquid infiltration of silicon into diamond powder ... 01/26/06 - 20060019816 - Composite silicon carbide body and method for its preparation A method for manufacturing a silicon carbide composite body and includes the steps of forming a slurry including silicon carbide and a carbonaceous precursor, adding to the slurry composite granules containing a carbonaceous binder and carbon black, drying the slurry, shaping the dried slurry and sintering the dried and shaped ... 09/22/05 - 20050209089 - Diamond-silicon carbide composite Fully dense, diamond-silicon carbide composites are prepared from ball-milled microcrystalline diamond/amorphous silicon powder mixture. The ball-milled powder is sintered (P=5-8 GPa, T=1400K-2300K) to form composites having high fracture toughness. A composite made at 5 GPa/1673K had a measured fracture toughness of 12 MPa.m1/2. By contrast, liquid infiltration of silicon into ... ### FreshPatents.com Support |