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Abrading > Flexible-member Tool, Per Se > Interrupted Or Composite Work Face (e.g., Cracked, Nonplanar, Etc.)

Interrupted Or Composite Work Face (e.g., Cracked, Nonplanar, Etc.)

Interrupted Or Composite Work Face (e.g., Cracked, Nonplanar, Etc.) patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

03/22/07 - 20070066197 - Abrasive article and methods of making same
An abrasive article with an integral dust collection system. The abrasive article comprises a porous abrasive layer with openings, a first filter media with channels, a second filter media, and an attachment interface layer. The openings of the porous abrasive layer cooperate with the channels to allow the flow of ...

02/22/07 - 20070042693 - Polishing pad and method of manufacture
The present invention relates to a method of manufacturing a polishing pad with embedded polymeric capsules useful for planarizing a substrate in a CMP process using a polishing composition. The method reduces non-uniformity of the polishing pad due to capsule floating, differential heating and capsule expansion by the use of ...

02/22/07 - 20070042692 - Grinding ring having grinding segments
A grinding ring having grinding covers for grinding profiled strips or profiled edges. The grinding ring includes a row of carrier segments, each carrier segment having grinding segments thereon. The grinding segments are connected with one another to form a one-piece grinding ring. ...

02/08/07 - 20070032182 - Polishing pad and method of fabricating semiconductor substrate using the pad
It is provided a polishing pad of novel construction capable of controlling actively and efficiently a slurry flow during polishing a surface of a semiconductor substrate, such as a wafer, thus making it possible to precisely and stably performing a desired polishing process. Onto a surface of a pad substrate ...

01/25/07 - 20070021045 - Polyurethane urea polishing pad with window
The present invention relates to an article for altering a surface of a work piece, or a polishing pad having a window. In particular, the polishing pad includes a polyurethane urea material wherein the polyurethane urea material contains cells which are at least partially filled with gas. The polyurethane urea ...

12/21/06 - 20060286912 - Hybrid burnishing head design for improved burnishing of disk media
A hybrid burnishing head for processing of surfaces of hard disk media comprises a solid body including a first major surface and a second, opposed major surface comprising a burnishing surface including first and second surface portions, wherein the first surface portion is configured for providing air bearing stability and ...

11/30/06 - 20060270328 - Method of producing polishing cloth
A polishing cloth to be produced has a surface layer stacked over a base material. The surface layer is made of a foamed layer and a non-foamed layer, the foamed layer including air bubble cells and the non-foamed layer having an externally exposed surface where linear cuts are formed. These ...

11/16/06 - 20060258277 - Single-layer polishing pad and method of producing the same
A foamed plastic is cut to form a single-layer polishing pad having a desired rigidity and compressibility. A polishing surface of the polishing pad has a higher density than a mounting surface of the polishing pad. The polishing surface and the mounting surface may have different areas having different densities ...

11/16/06 - 20060258276 - Superhard cutters and associated methods
A cutting device comprises a base having a working side that is oriented to face a workpiece from which material is to be removed. A plurality of individual cutting elements are arranged on the working side of the base, with each cutting element having a peak that comprises at least ...

11/02/06 - 20060246831 - Materials for chemical mechanical polishing
A polishing article and method for manufacturing a polishing article for use in a chemical mechanical polishing process is disclosed. The polishing article has a plurality of polishing material tiles separated by grooves formed in or through a polishing material and may be adhesively bound to a base film. The ...

08/31/06 - 20060194530 - Polishing pad for use in polishing work pieces
A polishing/lapping pad for use in CMP and other polishing and lapping operations is presented that comprises multiple channels designed to facilitate in the manipulation of slurry into specific locations on the wafer being planarized. ...

06/15/06 - 20060128291 - Cmp polishing pad having grooves arranged to improve polishing medium utilization
A polishing pad (104, 304, 404, 504) having an annular polishing track (152, 312, 412, 512) for polishing a wafer (120, 316, 416, 516). A plurality of grooves (112, 320, 420, 520) are arranged within the wafer track so that they are spaced from one another both radially and circumferentially ...

06/15/06 - 20060128290 - Cmp pad having an overlapping stepped groove arrangement
A polishing pad (104, 300) having an annular polishing track (152, 320) and a plurality of groups (160, 308) of grooves (112, 304) repeated circumferentially about the rotational center (128) of the pad. The plurality of grooves in each group are arranged along a trajectory (164, 312) in an offset ...

04/27/06 - 20060089094 - Polyurethane urea polishing pad
The present invention relates to an article for altering a surface of a workpiece, or a polishing pad having a window. In particular, the polishing pad includes a polyurethane urea material wherein the polyurethane urea material contains cells which are at least partially filled with gas. The polyurethane urea material ...

03/02/06 - 20060046626 - Optimized grooving structure for a cmp polishing pad
A polishing pad for a chemical mechanical polishing has a body rotatable in a predetermined direction and having a working surface, the working surface being provided with grooves, the grooves being formed so that over the course of a single revolution of the pad said grooves extend in all directions ...

02/02/06 - 20060025061 - Polishing pad having grooves configured to promote mixing wakes during polishing
A polishing pad (104, 300, 400, 500) for polishing a wafer (112, 516), or other article. The polishing pad includes a polishing layer (108) containing a plurality of grooves ((148, 152, 156)(304, 308, 324)(404, 408, 424)(520, 524, 528)) having orientations largely parallel to one or more corresponding respective velocity vectors ...

01/26/06 - 20060019588 - Polishing pad, polishing apparatus having the same, and bonding apparatus
A plurality of projections and grooves are formed on a polishing member. The grooves are formed in grid pattern. A portion on which the grooves and the projections are formed (polishing portion) has a substantially circular shape in a plane view. Around the polishing portion, an outer peripheral portion having ...

12/22/05 - 20050282479 - Polishing pad having grooves configured to promote mixing wakes during polishing
A polishing pad (104, 300, 400, 500) for polishing a wafer (112, 516), or other article. The polishing pad includes a polishing layer (108) containing a plurality of grooves ((148, 152, 156)(304, 308, 324)(404, 408, 424)(520, 524, 528)) having orientations largely parallel to one or more corresponding respective velocity vectors ...

11/24/05 - 20050260942 - Chemical mechanical polishing pad
A chemical mechanical polishing pad which can be advantageously used for the polishing of a metal film or the polishing of an insulating film, provides a flat polished surface, enables slurry to be efficiently removed, has sufficiently long service life, can provide a high polishing rate and has the effect ...

11/17/05 - 20050255801 - Abrasive material and method of forming same
The present invention provides an abrasive material comprising a base surface having a plurality of pyramidal shapes protruding therefrom the base surface and the protrusions being formed of the same material, each protrusion having a substantially triangular, square, or polygonal base and triangular sides which meet at an apex which ...

11/10/05 - 20050250431 - Single-layer polishing pad and method of producing the same
A foamed plastic is cut to form a single-layer polishing pad having a desired rigidity and compressibility. A polishing surface of the polishing pad has a higher density than a mounting surface of the polishing pad. The polishing surface and the mounting surface may have different areas having different densities ...

10/06/05 - 20050221741 - Polymeric polishing pad having continuously regenerated work surface
The polishing pad is useful for polishing a surface of an electronic substrate. The pad comprises a polymeric matrix and polymeric microelements within the polymeric matrix. The polymeric microelements have a mean diameter of less than 150 μm (0.0059″). The pad has grooves forming artifacts and a depth less than ...

09/15/05 - 20050202769 - Grinding disc structure
A grinding disc structure including an integrally formed main disc adapted to a dust-sucking cover body of a grinder. The main disc has multiple through holes nearly in parallel to an axis of the main disc. The main disc is further formed with multiple internal passages which are horizontally formed ...

06/30/05 - 20050142996 - Polishing pad and method of producing same
A transparent pad having a polishing surface with an average surface roughness of 5 μm or less is used as a polishing pad. An indentation is formed on the back surface of the transparent pad such that its rate of light transmission is locally changed. The transparent pad has a ...

06/02/05 - 20050118939 - Abrasive bead coated sheet and island articles
Flexible abrasive sheet articles having precision thickness flat-topped raised island structures that are coated with a monolayer of equal sized abrasive agglomerate are described. Methods of producing high quality equal-sized spherical shaped composite abrasive agglomerate beads containing small diamond abrasive particles are described. Beads are produced by level-filling fine mesh ...



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