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Abrading > Machine > Rotary Tool > Rotary Disk > Work Rotating > Rotary Work Holder Rotary Work HolderRotary Work Holder patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.03/01/07 - 20070049184 - Retaining ring structure for enhanced removal rate during fixed abrasive chemical mechanical polishing A retaining ring structure for a chemical mechanical polishing (CMP) apparatus includes a plurality of protrusions formed on a bottom surface of a retaining ring configured for retaining a workpiece to be polished, the protrusions disposed so as to be in contact with a polishing pad during a polishing operation ... 02/08/07 - 20070032180 - Slurry residence time enhancement system A slurry residence time enhancement system for a chemical mechanical polishing apparatus having a base, a platen on the base, a polishing pad on the platen and a polishing head over the polishing pad is disclosed. The system includes at least one slurry distribution unit having a slurry distribution member ... 01/04/07 - 20070004324 - Polishing apparatus A polishing apparatus includes a polishing object holding mechanism for holding an object to be polished, and a table having a polishing surface. The polishing object held by the polishing object holding mechanism is pressed against the polishing surface of the table and polished by relative movement between the polishing ... 11/30/06 - 20060270325 - Polishing pad and chemical mechanical polishing apparatus using the same A polishing pad for chemically mechanically polishing a semiconductor wafer comprises a first groove pattern circularly formed on the surface of the polishing pad, and a second groove pattern formed on the surface of the polishing pad while spirally extending from the circular center of the polishing pad to the ... 11/23/06 - 20060264160 - Methods and apparatus for providing fluid to a semiconductor device processing apparatus In a first aspect, a valve assembly is provided that includes a valve assembly output adapted to output at least one of DI water and a chemical. A first valve of the valve assembly includes (1) a first input adapted to receive the chemical; (2) a first output adapted to ... 11/16/06 - 20060258273 - Process for producing improved membranes The present invention relates generally to the field of chemical/mechanical polishing of substrates. In particular the invention relates to methods of producing improved membranes for use in chemical/mechanical polishing systems. The present invention provides a method of improving the properties of a flexible membrane for use in chemical/mechanical polishing, the ... 10/26/06 - 20060240750 - Composite retaining ring A two part retaining ring is described that has a lower ring and an upper ring. The lower ring contacts a polishing surface during chemical mechanical polishing. The upper surface and the lower surface of the lower ring have matching grooves formed therein to increase the flexibility of the lower ... 09/07/06 - 20060199482 - Pad conditioner for chemical mechanical polishing apparatus A pad conditioner may include a surface having a first region including a portion having relatively irregular shaped and friable polishing particles, and a second region including a portion having relatively regular shaped and tough polishing particles. The relatively regular shaped and tough polishing particles may be provided on the ... 09/07/06 - 20060199481 - Polishing disk for a tool for the fine machining of optically active surfaces on spectacle lenses in particular A polishing disk for a tool for the fine machining of optically active surfaces on spectacle lenses in particular is disclosed, which comprises a support body, to which a foam layer is attached, wherein a polishing film bears against the foam layer. The polishing film is provided with at least ... 08/10/06 - 20060178095 - Polishing media stabilizer A polishing apparatus that employs a polishing media retention arrangement to prevent slippage or wrinkles in the polishing media during polishing. The polishing media is drawn against a support surface by a vacuum applied between the polishing media and the support surface. Also, a porous layer may be placed between ... 07/27/06 - 20060166611 - Back pressure control system for cmp and wafer polishing A wafer carrier with a back pressure applicator system adapted to provide high resolution back pressure control. A plurality of millimeter scale distensible elements are disposed between the wafer carrier pressure plate and a process wafer, and selectively distended to provide excess backpressure to select small areas of a wafer ... 07/27/06 - 20060166610 - Optical disk polishing device An apparatus for polishing an optical disk according to the present invention includes a flange 24 holding a polishing body 20 such as sandpaper, a backup member 21 interposed between the polishing body 20 and the flange 24, a rotation table 12 holding an optical disk 10 as a polished ... 07/20/06 - 20060160478 - Chemical mechanical polishing pad for controlling polishing slurry distribution A polishing pad for a chemical mechanical polishing apparatus has a body with a polishing surface having a radius, a central region, and a peripheral region. The polishing surface has a plurality of main radial-line channels extending radially outwardly from the central region to the peripheral region, each main radial-line ... 07/13/06 - 20060154579 - Thermoplastic chemical mechanical polishing pad and method of manufacture The present invention is directed, in general, to a chemical mechanical polishing pad comprising a closed-cell thermoplastic foam polishing body. The polishing body comprises an ethylene vinyl acetate block copolymer. The ethylene vinyl acetate block copolymer comprises a vinyl acetate content ranging from about 1 to about 18 wt %. ... 06/29/06 - 20060141913 - Wafer planarization composition and method of use A wafer polishing solution and method for polishing a wafer comprising an amino acid and calcium ions or barium ions. The wafer polishing solution can be adjusted to control cut rate and selectivity for modifying semiconductor wafers using a fixed abrasive CMP process. ... 06/01/06 - 20060116057 - Method and apparatus for cleaning a web-based chemical mechanical planarization system A method and apparatus for cleaning a web-based chemical-mechanical planarization (CMP) system. Specifically, a fluid spray bar is coupled to a frame assembly which may be mounted on a CMP system. The fluid spray bar will move along the frame assembly. As the fluid spray bar traverses the length of ... 05/11/06 - 20060099892 - Substrate holding apparatus and polishing apparatus The present invention relates to a substrate holding apparatus for holding a substrate such as a semiconductor wafer in a polishing apparatus for polishing the substrate to a flat finish. The substrate holding apparatus according to the present invention comprises a top ring body having a receiving space therein, and ... 04/13/06 - 20060079160 - Polishing pad conditioner with shaped abrasive patterns and channels A polishing pad conditioner comprises a base and a pad conditioning face on the base. The conditioning face comprises central and peripheral regions. Abrasive spokes having a substantially constant width of abrasive particles, extend from the central to the peripheral region. The spokes are symmetric and radially spaced apart from ... 04/13/06 - 20060079159 - Chemical mechanical polish with multi-zone abrasive-containing matrix Chemical mechanical polish (CMP) devices, CMP systems, methods of CMP, and methods of manufacturing CMP devices. A CMP device comprises a plurality of zones, with each zone having a matrix of fixed abrasive features disposed therein. The abrasive-containing matrix within each zone has material removal properties that differ from the ... 03/16/06 - 20060057947 - Apparatus for chemical mechanical polishing Apparatus for chemical mechanical polishing are disclosed. A disclosed apparatus includes a polishing station having a polishing pad, a gas supplier to generate pressurized gas to press a wafer toward the polishing pad, and a polishing head assembly including a planar member having a plurality of fine holes in communication ... 02/16/06 - 20060035571 - Polishing apparatus An upper polishing plate is moved downward until facing a lower polishing plate to polish a work piece. The upper polishing plate is rotated in a horizontal plane together with a first elastic member, a second elastic member, an outer member and a connecting member. A pressure difference between a ... 01/05/06 - 20060003678 - System and method for reducing surface defects in integrated circuits The fabrication of integrated circuits entails the repeated application of many basic processing steps, for instance, planarization—the process of making a surface flat, or planar. One specific technique for making surfaces flat is chemical-mechanical planarization, which typically entails applying slurry onto a surface of an integrated circuit and polishing the ... 01/05/06 - 20060003677 - Polishing pad and chemical mechanical polishing apparatus comprising the same A polishing pad for use in chemically mechanically polishing a semiconductor substrate enhances the uniformity of the rate at which material is removed from the surface of the semiconductor substrate, thereby ensuring the reproducibility of the chemical mechanical polishing process. The polishing pad has main grooves that divide an upper ... 12/15/05 - 20050277372 - Zone polishing using variable slurry solid content A slurry dispensing apparatus for use with a chemical mechanical polishing tool for planarizing semiconductor substrates having irregular topology. The apparatus includes a slurry dispensing manifold with a first end suspended over a polishing pad, and a second end for mounting to the chemical mechanical polishing tool. The slurry dispensing ... 12/15/05 - 20050277371 - Transparent microporous materials for cmp The invention is directed to a chemical-mechanical polishing pad substrate comprising a microporous closed-cell foam characterized by a narrow pore size distribution in the range of about 0.01 microns to about 10 microns. The polishing pad is produced by foaming a solid polymer sheet with a supercritical gas under an ... 12/08/05 - 20050272355 - Carrier head for chemical mechanical polishing apparatus Disclosed is a carrier head of a chemical mechanical polishing apparatus for planarizing a semiconductor wafer. An adjustment chamber is provided in a space section formed between a membrane lower holder and a membrane upper holder of a wafer support assembly. Pressure applied to the adjustment chamber is transferred to ... 11/24/05 - 20050260938 - Table of wafer polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer A table for a wafer polishing apparatus having superior heat-resistant, anti-thermal-shock, and anti-abrasion characteristics and capable of increasing the diameter of a semiconductor wafer while improving the quality of the wafer. The table includes a plurality of superimposed bases each of which is formed of silicide ceramic or carbide ceramic. ... 11/03/05 - 20050245181 - Vibration damping during chemical mechanical polishing A carrier head for chemical mechanical polishing is described. The carrier head includes a backing assembly, a housing and a damping material. The backing assembly includes a substrate support surface. The housing is connectable to a drive shaft to rotate with the drive shaft about a rotation axis. In one ... 10/13/05 - 20050227596 - Polishing apparatus This invention pertains to a polishing apparatus for polishing a semiconductor wafer. The apparatus comprises a storage section that is capable of receiving a workpiece to be polished and a polished workpiece. The polishing unit that polishes the workpiece includes a primary polishing table and a secondary polishing table, wherein ... 10/13/05 - 20050227595 - Cmp apparatus and load cup mechanism In accordance with one embodiment of the invention, a load cup mechanism is provided for loading and unloading apparatus such as a CMP apparatus. The load cup mechanism, configured to load a work piece into and to unload a work piece from the apparatus, comprises a load cup arm configured ... 10/06/05 - 20050221733 - Polishing apparatus The polishing apparatus is capable of precisely controlling polishing pressure, correctly positioning a press plate and uniformly polishing a workpiece. In the polishing apparatus, a holding head comprises: first pressing means for introducing a pressurized fluid into a first fluid chamber and pressing a main head section downward; second pressing ... 09/15/05 - 20050202765 - Independent edge control for cmp carriers A wafer carrier for controlling the edge effect during chemical mechanical planarization. A first bladder is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. A second bladder is disposed within the carrier such that if the ... 08/25/05 - 20050186892 - Profile control platen A platen for chemical mechanical polishing of a substrate includes a surface upon which a polishing pad can be placed, a support structure, and a controller. The surface has a first region and a second region and is operable to exert force against the polishing pad during polishing. The support ... 08/11/05 - 20050176354 - Flexible membrane for a polishing head and chemical mechanical polishing (cmp) apparatus having the same A flexible membrane for a polishing head and a chemical mechanical polishing (CMP) apparatus having the same are provided. The flexible membrane for a polishing head includes a compressing plate having a first face and a second face opposite to the first face. The first face of the compressing plate ... 07/14/05 - 20050153635 - Polishing head of chemical mechanical polishing apparatus and polishing method using the same A chemical mechanical polishing (CMP) apparatus includes a polishing head that is composed of a carrier and a membrane, and is positioned on a polishing pad of a supporting part. The polishing head has a supporter installed at an internal center of the carrier, a chucking ring positioned between the ... 06/09/05 - 20050124269 - Polishing head and polishing apparatus A polishing head includes a head body, a first recessed portion formed in the lower surface of the head body, a support plate which can be moved up and down in the first recessed portion, a first film-like member in which a first space is formed between the upper surface ... ### FreshPatents.com Support |