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Abrading > Machine > Combined > With Nonabrading Means With Nonabrading MeansWith Nonabrading Means patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.04/12/07 - 20070082588 - Methods and apparatus for coupling semiconductor device manufacturing equipment to the facilities of a manufacturing location In a first aspect, an apparatus is provided for coupling a semiconductor device manufacturing tool to facilities. The apparatus includes (1) a docking station adapted to mount to a raised floor and having a thickness approximately equal to the raised floor; (2) a plurality of tool point of connection (POC) ... 09/07/06 - 20060199480 - Apparatus and method for feeding slurry A slurry feeding apparatus includes closed slurry bottle, piping, wet nitrogen generator, wet nitrogen supply pipe, suction and spray nozzles, temperature regulator, flow rate control valves, slurry delivery pump and controller for controlling the operation and flow rate of the slurry delivery pump. While a wafer is being polished by ... 06/15/06 - 20060128280 - Grinding method and grinding device To grind a peripheral surface of a rotated work (10), by a rotary grindstone (22) rotated by a wheel spindle 21, a rotary brush (40) is mounted to one side of the rotary grindstone (22), so that it is rotated along with the rotary grindstone (22). Subsequently to the grinding ... 02/16/06 - 20060035569 - Integrated system for processing semiconductor wafers An integrated system for processing a plurality of wafers, having a conductive front surface, is provided. The system includes a plurality of processing subsystems for depositing on or removing metal from the front surfaces of the wafers. Each processing subsystem includes a process chamber and a cleaning chamber. The system ... 06/23/05 - 20050136810 - Apparatus for removing burrs from a compact disc The present invention discloses a burr removing apparatus including a base for placing the compact disc on, and a pressing apparatus equipped on the base and corresponding to the inner circle of the compact disc for moving up and down to eliminate a bur at the inner circle of the ... 06/23/05 - 20050136809 - Wafer grinding apparatus A wafer grinding apparatus includes a wafer-transporting device for transporting a wafer, a first nozzle, and a second nozzle. The wafer-transporting device includes at least a suction pad having a first surface and a second surface that is flexible for sucking the wafer, and a transporting mechanism connected to the ... ### FreshPatents.com Support |