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Abrading > Abrading Process > Abradant Supplying

Abradant Supplying

Abradant Supplying patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

03/15/07 - 20070060028 - Cmp slurry delivery system and method of mixing slurry thereof
A CMP slurry delivery system includes a delivery pipe, a first slurry supply reservoir coupled to the delivery pipe for supplying an abrasive, a second slurry supply reservoir coupled to the delivery pipe for supplying a clean chemical, a third slurry supply reservoir coupled to the delivery pipe for supplying ...

10/05/06 - 20060223426 - System, method, and apparatus for wetting slurry delivery tubes in a chemical mechanical polishing process to prevent clogging thereof
A moisturizing process for slurry delivery tubes in chemical mechanical polishing is disclosed. A mist of deionized water is dispensed directly into the tubes each time a high pressure spray bar automatically cycles. The tips of the tubes are kept wet enough to prevent the slurry from drying in and ...

09/21/06 - 20060211344 - Chemical dilution system for semiconductor device processing system
A dilution stage is adapted to supply a dilute chemistry to a semiconductor device processing apparatus. The dilution stage includes a first vessel adapted to store the chemistry after dilution and a second vessel adapted to store the chemistry prior to dilution. The dilution stage may also include a control ...

10/27/05 - 20050239382 - Planarizing solutions including abrasive elements, and methods for manufacturing and using such planarizing solutions
A planarizing slurry for mechanical and/or chemical-mechanical polishing of microfeature workpieces. In one embodiment, the planarizing slurry comprises a liquid solution and a plurality of abrasive elements mixed in the liquid solution. The abrasive elements comprise a matrix material having a first hardness and a plurality of abrasive particles at ...

09/15/05 - 20050202763 - Multi-function slurry delivery system
A method and system for delivering a mixed slurry for use chemical mechanical polishing operation. A first slurry may be mixed with a second slurry to provide a mixed slurry thereof. A flow rate and a mixing ratio associated with the mixed slurry can be controlled to provide an accurate ...

07/21/05 - 20050159088 - Method for polishing hard surfaces
The present invention relates to a method for polishing hard surfaces. The method includes applying a composition including an alkoxylate to a hard surface to be polished. ...

06/09/05 - 20050124267 - Rinse apparatus and method for wafer polisher
An apparatus for polishing a wafer comprising a rotatable polishing pad having a center of rotation and a rinse delivery conduit positioned adjacent to the polishing pad and substantially in radial alignment with the center. The rinse delivery conduit includes a plurality of nozzles to dispense a rinsing liquid. In ...

06/02/05 - 20050118937 - Polishing apparatus, polishing method, and semiconductor device fabrication method
According to the present invention, there is provided a polishing apparatus comprising: a rotatable turntable; a polishing cloth attached on said turntable; a slurry supply pipe which supplies a slurry onto said polishing cloth; and a polishing member which presses an object to be polished against a surface of said ...



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