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Abrading > Abrading Process > Combined Abrading

Combined Abrading

Combined Abrading patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

03/15/07 - 20070060027 - Equipment and method for polishing both sides of a rectangular substrate
Double-sided polishing equipment configured to polish a rectangular substrate, comprising a carrier having a pocket configured to accommodate a rectangular substrate, a lateral linear moving mechanism configured to move the carrier, first and second polishing pads with first and second rotational axes, respectively, offset from centers of the pads, the ...

02/22/07 - 20070042688 - Apparatus for treating edges of panels and method
An apparatus for treating edge surfaces of panels, comprises conveyor tables to displace panels in sequence, two of the conveyor tables being configured such that panels are sequentially displaced in longitudinal alignment between the two conveyor tables with a longitudinal edge first. Two other of the conveyor tables are configured ...

02/08/07 - 20070032177 - Wafer processing apparatus and wafer processing method using the same
A wafer processing apparatus and a wafer processing method using the same are provided. A grinding wheel may include a wheel body having a plurality of wheel blades to remove a backside of a wafer, each of the plurality of wheel blades in an annular array with respect to each ...

12/14/06 - 20060281394 - Apparatus and process for cylindrically grinding workpieces
An apparatus for cylindrically grinding workpieces includes a first holding tool (100) for positioning pre-grinding workpieces (60) and a second holding tool (200) for positioning partially ground workpieces (i.e. workpieces which have been ground on one side only). The first holding tool defines a first groove (12) for containing the ...

05/11/06 - 20060099891 - Method of chemical mechanical polishing, and a pad provided therefore
In a chemical mechanical polishing for removing a barrier and subsequent buffing a polyurethane polishing pad is used which is composed of for removal a barrier and buffing after a bulk copper removal to the barrier in a chemical mechanical polishing of a copper film deposited on a surface of ...

04/20/06 - 20060084369 - Polishing apparatus
A polishing apparatus for polishing a surface of a workpiece includes a housing unit, a partition wall partitioning an interior of the housing unit into a first chamber and a second chamber, a polishing section disposed in the first chamber and having a turntable with an abrasive cloth mounted on ...

02/02/06 - 20060025057 - Method for fabricating a magnetic transducer using a slurry with spherical particles for cmp-assisted photoresist lift-off
A method is described which uses a CMP slurry with an abrasive of spherical particles to lift-off photoresist used in the patterning of the sensor for a magnetic transducer. The spherical particles, preferably less than 0.015 microns, are preferably silica, alumina, titania or zirconia with colloidal silica being preferred. An ...

11/24/05 - 20050260937 - Method of probe tip shaping and cleaning
Methods are provided for shaping, maintaining the shape of, and cleaning a probe tip using a pad such as a multi-layer adhesive and abrasive pad. The multi-layer adhesive and abrasive pad may be formed from layers of adhesive material having abrasive particles in-between each layer. Using the pad, probe tips ...

11/03/05 - 20050245177 - Wafer holding plate for wafer grinding apparatus and method for manufacturing the same
A method for manufacturing a wafer holding plate for a wafer grinding apparatus wherein the plate includes a substrate having a wafer adhering surface to which a semiconductor wafer is adhered by an adhesive. The wafer adhering surface includes a mirror-like surface portion and a groove pattern, which anchors the ...

10/13/05 - 20050227594 - Method of and apparatus for producing roll
A belt grinding is integrated with an electroerosion machine for contouring the working surface of a mill roll and providing a texture thereon. The belt grinder can superfinish the roll and remove peaks in the surface without significantly affecting the mean surface roughness produced by the electroerosion. ...



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