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Abrading > Abrading Process > With Tool Treating Or Forming With Tool Treating Or FormingWith Tool Treating Or Forming patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.04/12/07 - 20070082587 - Method of manufacturing chemical mechanical polishing pad The present invention relates to a method of manufacturing a chemical mechanical polishing pad which provides a chemical mechanical polishing pad which fully suppresses the occurrence of a scratch on the polished surface and has an excellent polishing rate. The method comprising either one of a group of steps (A) ... 04/05/07 - 20070077871 - Chemical mechanical polishing devices, pad conditioner assembly and polishing pad conditioning method thereof Chemical mechanical polishing (CMP) devices, a pad conditioner assembly and a polishing pad conditioning method thereof are provided. The CMP device planarizes a wafer by rotating a carrier, which has a wafer mounted on a lower surface of the carrier, over a rotating polishing table while supplying a slurry onto ... 04/05/07 - 20070077870 - Pad conditioner, pad conditioning method, and polishing apparatus The present invention provides a pad conditioner for dressing a surface of a polishing pad which is used in a polishing apparatus for polishing works, comprising: a substrate disposed opposite to the polishing pad; a plurality of pellets removably attached to the substrate; and a plurality of linear elastic members ... 03/22/07 - 20070066189 - Off-line tool for breaking in multiple pad conditioning disks used in a chemical mechanical polishing system An off-line tool for breaking in pad conditioning disks used in a chemical mechanical polishing (CMP) system. The off-line tool comprises a platen having a first surface for -holding a polishing pad and a motor for rotating the polishing pad. The motor is coupled to the platen via a first ... 03/15/07 - 20070060026 - Methods of bonding superabrasive particles in an organic matrix Superabrasive tools and their methods of manufacture are disclosed. In one aspect, a method of improving retention of superabrasive particles held in a solidified organic material layer of an abrading tool, a portion of each of said superabrasive particles protruding out of the solidified organic material layer is provided. The ... 03/08/07 - 20070054607 - Lapping plate resurfacing abrasive member and method A lapping machine includes a lapping plate, and a workpiece carrier with a workpiece-holding hole disposed on the plate, a workpiece being fitted within the hole in the carrier. The workpiece is lapped while the plate and the carrier are individually rotated and loose abrasive grains are fed onto the ... 03/08/07 - 20070054606 - Method of adhering polishing pads and jig for adhering the same The method of adhering polishing pads is capable of easily adhering the polishing pads without damages. The method comprises the steps of: tentatively adhering the polishing pads to polishing plates; attaching a roller unit having a shaft and a roller member, which is capable of rotating about the shaft and ... 03/01/07 - 20070049183 - Chemical-mechanical polishing apparatus and method of conditioning polishing pad A chemical-mechanical polishing apparatus comprising at least a polishing platen, a polishing pad, a slurry supplying piping, a polishing pad conditioner, a chemical reagent supplying piping and a splitting piping is provided. The polishing platen has a plurality of slurry outlets disposed thereon and the polishing pad is disposed on ... 02/15/07 - 20070037493 - Pad conditioner for conditioning a cmp pad and method of making such a pad conditioner The invention provides a pad conditioner for conditioning a CMP pad. The pad conditioner includes a substrate, a plurality of cavities on the substrate, a bonding agent filling in the cavities, and a plurality of abrasive particles securely placed and fixed in the cavities separately. The cavities are arranged in ... 01/25/07 - 20070021041 - Dressing method in vertical duplex-head surface grinding machine A dressing method capable of dressing the grinding stone of a vertical duplex-head surface grinding machine without incorporating a special dressing device therein. The vertical duplex-head surface grinding machine comprises a pair of upper and lower grinding wheels (2) and (3) rotated around the vertical axis thereof and a work ... 12/28/06 - 20060292969 - Dressing tool, dressing device, dressing method, processing device and semiconductor device producing method A dressing apparatus DA is constructed from a pad holding mechanism 10 which holds a polishing pad 15 that has a doughnut disk-form pad surface 15a, and which causes this polishing pad 15 to rotate, a dressing tool 2 which has a substantially rectangular dressing surface 3, and a dressing ... 12/07/06 - 20060276111 - Conditioning element for electrochemical mechanical processing Embodiments of a conditioning element for conditioning a processing pad are provided herein. In one embodiment, a conditioning element for conditioning a processing pad includes a body having a face. A plurality of diamond particles are disposed on the face and define a conditioning surface. The diamond particles are of ... 10/12/06 - 20060229002 - Radial-biased polishing pad The polishing pad is useful for polishing magnetic, optical and semiconductor substrates. The pad includes a polishing layer having a rotational center and an annular polishing track concentric with the rotational center and has a width. The width of the annular polishing track is free of non-radial grooves. And the ... 08/31/06 - 20060194523 - Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates Methods and apparatuses for planarizing a microelectronic substrate. In one aspect of the invention, a first portion of an energy-sensitive, non-sacrificial planarizing pad material is exposed to a selected energy without exposing a second portion of the material to the selected energy source. The planarizing pad material is exposed to ... 08/31/06 - 20060194522 - Method and apparatus for forming and using planarizing pads for mechanical and chemical-mechanical planarization of microelectronic substrates Methods and apparatuses for planarizing a microelectronic substrate. In one aspect of the invention, a first portion of an energy-sensitive, non-sacrificial planarizing pad material is exposed to a selected energy without exposing a second portion of the material to the selected energy source. The planarizing pad material is exposed to ... 08/31/06 - 20060194521 - Polishing apparatus The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring ... 08/24/06 - 20060189264 - Apparatus and method for conditioning polishing surface, and polishing apparatus and method of operation A chemical-mechanical polishing apparatus is provided with a downstream device for conditioning a web-shaped polishing pad. The device may be used to condition a glazed portion of the pad, and then the conditioned pad portion may be used again for polishing. The conditioning device is preferably arranged to apply different ... 08/17/06 - 20060183410 - Diamond conditioning of soft chemical mechanical planarization/polishing (cmp) polishing pads Conditioning of chemical mechanical planarization (CMP) using conventional diamond-embedded abrasive strips are well suited to condition conventional “hard” polishing but not soft polishing pads because the diamonds not only remove waste material, but they also damage the polishing surface of the pad. Embodiments of the present invention condition soft polishing ... 08/10/06 - 20060178090 - Abrasive cleaning article and method of making The present invention provides an abrasive cleaning article, a method of making an abrasive cleaning article, and a method of cleaning a surface with an abrasive cleaning article. In one aspect, the abrasive cleaning articles comprises a substrate, a water-soluble binder having a weight average molecular weight less than 200,000, ... 07/20/06 - 20060160477 - Cmp conditioner, method for arranging hard abrasive grains for use in cmp conditioner, and process for producing cmp conditioner Disclosed are CMP conditioners which can suppress microscratching of the surface of a semiconductor substrate and can realize stable CMP conditioner properties. The CMP conditioner according to the first aspect of the present invention comprises a support member and a plurality of hard abrasive grains provided on a surface of ... 07/20/06 - 20060160476 - Porous abrasive articles with agglomerated abrasives and method for making the agglomerated abrasives A bonded abrasive tool, having a structure permeable to fluid flow, comprises sintered agglomerates of a plurality of abrasive grains and a binding material, the binding material being characterized by a melting temperature between 500 and 1400° C, and the sintered agglomerates having a loose packing density of ≦1.6 g/cc ... 07/13/06 - 20060154577 - Method of producing polishing pad A method of manufacturing a grooved polishing pad wherein a large number of grooves, extending parallel to each other, are fabricated at specific intervals on at least one of a front surface and a back surface of a polishing pad substrate through a groove cutting process on the polishing pad ... 06/29/06 - 20060141910 - Methods and systems for conditioning polishing pads Methods for conditioning polishing pads that are to be used in abrasive semiconductor substrate treatment processes, such as chemical-mechanical polishing or chemical-mechanical planarization processes, include abrading at least a portion of a polishing surface with a conditioner including abrasive elements formed from a material that is etchable selectively with respect ... 06/15/06 - 20060128279 - Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces Conditioning devices, systems and methods for conditioning a contact surface of a processing pad used in processing microelectronic workpieces. One embodiment of a conditioning device comprises an end-effector having a conditioning surface configured to engage the contact surface of the processing pad and a plurality of microstructures on the conditioning ... 06/08/06 - 20060121837 - Dressing method for polishing pad The present invention provides a dressing method for a polishing pad in a polishing apparatus which performs work with a work piece contacting a polishing pad while supplying a slurry, comprising the steps of performing dressing of the polishing pad by pressing a pad dresser against the polishing pad and ... 05/18/06 - 20060105686 - Platen structure of polishing apparatus for processing semiconductor wafer and method for exchanging polishing pad affixed to the same A platen structure of a polishing apparatus for semiconductor wafer and a method for exchanging a polishing pad affixed to the same are provided in which the polishing pad supported by the platen is exchanged with convenience within a short time. The platen structure of the polishing apparatus in which ... 04/06/06 - 20060073774 - Cmp pad dresser with oriented particles and associated methods CMP pad dressers with superabrasive particles oriented into an attitude that controls CMP pad performance, and methods associated therewith are disclosed and described. The controlled CMP pad performance may be selected to optimize CMP pad dressing rate and dresser wear. ... 04/06/06 - 20060073773 - High pressure pad conditioning An apparatus for conditioning a polishing pad. A turntable is mounted to a frame, where the turntable is adapted to receive and rotate the polishing pad. A conditioning head is also mounted to the frame, where the conditioning head is adapted to spray a liquid from the conditioning head against ... 03/02/06 - 20060046623 - Method and apparatus for reduced wear polishing pad conditioning Embodiments of a conditioning head for in-situ conditioning and/or cleaning a processing pad of a CMP, ECMP, or other processing system are provided. In one embodiment, the conditioning head includes a brush disposed in a central cavity. A cleaning fluid is provided through the central cavity of the conditioning head ... 02/23/06 - 20060040595 - Method and system for chemical mechanical polishing pad cleaning In one embodiment, a method for cleaning a chemical mechanical polishing (CMP) pad is provided. The CMP pad surface has a residue thereon. Chemicals are applied onto the surface of the CMP pad and the pad surface is rinsed so as to substantially remove by-product produced by the chemicals. A ... 02/16/06 - 20060035568 - Polishing pad conditioners having abrasives and brush elements, and associated systems and methods Systems and methods for conditioning polishing pads are disclosed. A system in accordance with one embodiment of the invention includes a polishing support configured to carry a microfeature workpiece polishing pad, and a conditioner positioned at least proximate to the support to condition a polishing pad carried by the support. ... 02/02/06 - 20060025056 - End effectors and methods for manufacturing end effectors with contact elements to condition polishing pads used in polishing micro-device workpieces End effectors, apparatuses including end effectors for conditioning planarizing pads, and methods for manufacturing end effectors with contact elements to condition planarizing pads used in polishing micro-device workpieces are disclosed herein. In one embodiment, an end effector includes a member having a first surface and a plurality of generally uniformly ... 01/26/06 - 20060019584 - Method and apparatus for conditioning a polishing pad A method and apparatus for polishing a thin film on a semiconductor substrate is described. A polishing pad is rotated and a wafer to be polished is placed on the rotating polishing pad. The polishing pad has grooves that channels slurry between the wafer and polishing pad and rids excess ... 01/26/06 - 20060019583 - Method and apparatus for conditioning a polishing pad A method and apparatus for polishing a thin film on a semiconductor substrate is described. A polishing pad is rotated and a wafer to be polished is placed on the rotating polishing pad. The polishing pad has grooves that channels slurry between the wafer and polishing pad and rids excess ... 12/22/05 - 20050282476 - Off-line tool for breaking in multiple pad conditioning disks used in a chemical mechanical polishing system An off-line tool for breaking in pad conditioning disks used in a chemical mechanical polishing (CMP) system. The off-line tool comprises a platen having a first surface for holding a polishing pad and a motor for rotating the polishing pad. The motor is coupled to the platen via a first ... 12/22/05 - 20050282475 - Apparatus and method for breaking in multiple pad conditioning disks for use in a chemical mechanical polishing system An apparatus for breaking in new pad conditioning disks for use in a chemical mechanical polishing (CMP) system that polishes a semiconductor wafer by pressing the semiconductor wafer against a moving polishing pad. The apparatus comprises a break-in head that is removably attached to a drive shaft to which a ... 12/15/05 - 20050277369 - Roller shaft for a vegetable peeler An improved roller shaft for a food peeling machine that allows for an improved method of changing abrasive sections that are on the shaft, the improved shaft having a first and second end with removable retaining elements and the method involving the use of a hydrostatic cylinder to place a ... 11/24/05 - 20050260936 - Dynamic atomizer on conditioner assemblies using high velocity water A conditioner assembly is disclosed for conditioning a polishing pad used in chemical mechanical polishing of planar semiconductor wafer components. One embodiment of the conditioner assembly comprises a plate-type conditioner plate comprising a circular edge, having a first side and a second side, where on the first side is provided ... 11/10/05 - 20050250425 - Chemical mechanical polishing equipment and conditioning thereof A chemical mechanical polishing equipment has a polishing pad, a holder, a slurry supply and a conditioner. The holder is disposed above the polishing pad and carries a wafer for polishing the surface of wafer. The slurry supply is disposed above the polishing pad for supplying slurry onto the polishing ... 11/03/05 - 20050245176 - Process and dressing tool for the dressing of cylindrical grinding worms for the continuous generation grinding of gears A rotating dressing tool (2) coated with abrasive grains for profiling a multi-start grinding worm (4) for the continuous generation grinding of preferably small moduled gear teeth is provided with a stripping zone (6), a pre-profiling zone (7) and a finish profiling zone (8). After being swivelled into their dressing ... 10/13/05 - 20050227593 - Method of making valve guide having textured external surface A cylindrical valve guide having a roughened external surface texture from about 50 to about 100 microinches permits effective amounts of lubricating oil to become trapped or contained by such roughened external surface and thereby facilitates subsequent press fitting of the valve guide into an internal combustion engine. Centerless grinding ... 10/06/05 - 20050221732 - Method for dressing a grinding worm A method for dressing an essentially cylindrical grinding worm on a machine suitable for continuous generation grinding in the diagonal method. The dressing tool is an essentially cylindrical gear wheel, having an abrasive coating on the surface that effects the dressing, which is brought into engagement with the grinding worm ... 10/06/05 - 20050221731 - Polishing pad conditioning system A pad conditioning system for conditioning a polishing pad in conjunction with a workpiece polishing operation includes a pad conditioning head coupled with a positioning unit. The pad conditioning head includes a plurality of abrasive particles protruding from a surface of the pad conditioning head. The positioning unit is configured ... 10/06/05 - 20050221730 - Polishing pad conditioning and polishing liquid dispersal system A pad conditioning system for conditioning a polishing pad in conjunction with polishing of a workpiece includes a pad conditioning head coupled with a positioning unit. The pad conditioning head includes a conditioning surface that is configured to be moved into contact with a polishing pad to condition the polishing ... 10/06/05 - 20050221729 - Method of repairing a pedestal surface A method of repairing a pedestal heater uses a diamond film stuck onto a silicon wafer to polish the surface of the heater and so remove distortion, coating or surface scratches. ... 09/22/05 - 20050208884 - Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces Conditioning devices, systems and methods for conditioning a contact surface of a processing pad used in processing microelectronic workpieces. One embodiment of a conditioning device comprises an end-effector having a conditioning surface configured to engage the contact surface of the processing pad and a plurality of microstructures on the conditioning ... 09/15/05 - 20050202762 - Dresser for polishing cloth and method for producing the same A dresser for a polishing cloth includes a base 1 and a dressing part disposed on the surface of the base. The dressing part includes a plurality of abrasive grains 2 and a plate-shaped holding component 3 that holds the abrasive grains 2. The holding component 3 is composed of ... 09/15/05 - 20050202761 - Chemical mechanical polishing pad with grooves alternating between a larger groove size and a smaller groove size A chemical mechanical polishing (CMP) pad is provided. The CMP pad includes a groove pattern disposed on a polishing surface of the pad. The groove pattern is formed of an alternating sequence of spaced apart grooves. The alternating sequence of grooves comprises a groove of a first size and a ... 09/15/05 - 20050202760 - Undulated pad conditioner and method of using same A pad conditioner having an abrasive disk and an undulating disk and methods for using the same. The undulating disk has at least one raised portion and at least one recessed portion. The abrasive disk is releasably affixed to at least a portion of the recessed portion to form an ... 09/01/05 - 20050191949 - Polishing apparatus The present invention relates to a polishing apparatus for polishing a workpiece, such as a semiconductor wafer, to a flat mirror finish. The polishing apparatus comprises a polishing table having a polishing surface, and a top ring, and the workpiece is interposed between the polishing table and the top ring ... 08/25/05 - 20050186891 - Multi-step, in-situ pad conditioning system and method for chemical mechanical planarization An arrangement for performing a multi-step polishing process on a single stage chemical mechanical planarization (CMP) apparatus utilizes an in-situ conditioning operation to continuously clean and evacuate debris and spent polishing slurry from the surface of the polishing pad. By presenting a clean, virtually “new” polishing pad surface at the ... 08/18/05 - 20050181712 - Apparatus and method for conditioning a contact surface of a processing pad used in processing microelectronic workpieces Conditioning devices, systems and methods for conditioning a contact surface of a processing pad used in processing microelectronic workpieces. One embodiment of a conditioning device comprises an end-effector having a conditioning surface configured to engage the contact surface of the processing pad and a plurality of microstructures on the conditioning ... 08/04/05 - 20050170761 - Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces Apparatuses and methods for conditioning polishing pads used in polishing micro-device workpieces are disclosed herein. In one embodiment, an end effector for conditioning a polishing pad includes a member having a first surface and a plurality of contact elements projecting from the first surface. The member also includes a plurality ... 07/28/05 - 20050164613 - Method of conditioning polishing pad for semiconductor wafer Dressing is performed by spraying a cleaning liquid onto a polishing pad and after that abrasive slurry injected from a nozzle is supplied to the polishing pad. Provided is a method of conditioning a polishing pad for semiconductor wafer which is suitable for keeping the polishing performance of a polishing ... 06/23/05 - 20050136808 - Apparatus, systems, and methods for conditioning chemical-mechanical polishing pads A conditioner includes abrasive elements for conditioning a polishing pad to be used in abrasive semiconductor substrate treatment processes, such as chemical-mechanical polishing or chemical-mechanical planarization processes. The abrasive elements are formed from a material that may be degraded or dissolved by at least one chemical that will not substantially ... 06/02/05 - 20050118936 - Integrated pad and belt for chemical mechanical polishing An integrated pad and belt for polishing a surface comprising a belt integrated with a polishing pad that forms a seamless polishing surface. ... ### FreshPatents.com Support |