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Abrading > Abrading Process > Glass Or Stone Abrading Glass Or Stone AbradingGlass Or Stone Abrading patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.04/05/07 - 20070077868 - Cerium-based abrasive, abrasive slurry, and production of cerium-based abrasive There is provided a cerium-based abrasive containing cerium oxide as a main component, in which the abrasive particles composing the abrasive are coated with a coating layer containing at least either one of a silicon component of silicon or a silicon compound and an aluminum component of aluminum or an ... 04/05/07 - 20070077867 - Polishing pad and polishing apparatus A polishing pad according to the invention includes a plate-like pad body having one surface serving as a polishing surface and the other surface serving as a support surface, and a plurality of hole parts which extend from the polishing surface to the support surface, the each hole part containing ... 04/05/07 - 20070077866 - Method and apparatus for chemical mechanical polishing A chemical mechanical polishing apparatus prevents scratches caused by a direct friction between a polishing pad and a wafer. The apparatus includes a polishing pad, in which grooves are regularly formed, for generating a dynamic pressure by rotation; a polishing table to which the polishing pad is adhered; a wafer ... 04/05/07 - 20070077865 - Method for controlling polysilicon removal The invention is directed to a method of chemically-mechanically polishing a substrate comprising polysilicon and a material selected from silicon oxide and silicon nitride with a chemical-mechanical polishing system comprising an abrasive, a polyethylene oxide/polypropylene oxide copolymer, water, and a polishing pad. ... 03/22/07 - 20070066188 - Cutting method and cutting apparatus The invention provides a cutting method and a cutting apparatus that cuts without chipping a composite material consisting of laminated layers of crystal material and amorphous material, in which the amorphous material is cut with an ultrasonically vibrated cutting blade and the crystal material is cut with a cutting blade ... 03/22/07 - 20070066187 - Chemical mechanical polishing device including a polishing pad and cleaning method thereof and method for planarization A chemical mechanical polishing device used to polish a wafer according to the present invention includes a polishing table, a polishing pad, a slurry supply device, a wafer carrier and a high-pressure liquid cleaning device. The polishing pad is disposed on the polishing table to polish the wafer. The slurry ... 03/22/07 - 20070066186 - Flexible abrasive article and methods of making and using the same Flexible abrasive article comprising a compressible backing having first and second opposed major surfaces; an elastic polyurethane film affixed to at least a portion of the first major surface of the compressible backing; an optional extensible tie layer affixed to at least a portion of the elastic polyurethane film; and ... 03/22/07 - 20070066185 - Conformable abrasive articles and methods of making and using the same Conformable abrasive article comprising: a backing having a first major surface; a deformable material contacting a central portion of the first major surface; an elastic member affixed to the first major surface of the backing and together with the backing enclosing the deformable material; and an abrasive member affixed to ... 03/22/07 - 20070066184 - Surface-protecting sheet and semiconductor wafer lapping method It is an object of the present invention to provide a surface protective sheet and a method for grinding a semiconductor wafer, by the use of which any dimple is not formed, nor occurs breakage and fouling of a wafer even when a wafer having high bumps which are highly ... 03/15/07 - 20070060024 - Polishing machine, workpiece supporting table pad, polishing method and manufacturing method of semiconductor device A pedestal pad (workpiece supporting table pad) is arranged on the top of a pedestal (workpiece supporting table) for temporarily placing and holding a pre-polished or post-polished wafer (workpiece). This pedestal pad is formed of resin, and at least a surface of the pedestal pad which comes into contact with ... 03/08/07 - 20070054603 - Wafer carrier with pressurized membrane and retaining ring actuator A wafer carrier for controlling downward force and edge effect during chemical mechanical planarization. A retaining ring actuator is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. An inflatable membrane is disposed across the bottom surface ... 03/08/07 - 20070054602 - Platen endpoint window with pressure relief A polish pad (40, 42) and platen (50) assembly for use in chemical mechanical polishing of semiconductor devices includes a platen (50) having a vented endpoint window (62, 72, 82) with one or more venting passageways (e.g., 64, 66) and/or a grooved or channeled platen surface (176) to prevent air ... 03/08/07 - 20070054601 - Grooved platen with channels or pathway to ambient air A polish pad (120) and platen (130) assembly for use in chemical mechanical polishing of semiconductor devices includes a platen (130) having a grooved or channeled surface (136) which is sealed from the processing environment by an ungrooved portion (131) at the periphery of the platen (130). In addition, the ... 03/01/07 - 20070049180 - Aqueous dispersion for chemical mechanical polishing, kit for preparing the aqueous dispersion, chemical mechanical polishing process, and process for producing semiconductor devices An aqueous dispersion for chemical mechanical polishing contains water, a polyvinylpyrrolidone having a weight-average molecular weight exceeding 200,000, an oxidant, a protective film-forming agent and abrasive grains, the protective film-forming agent containing a first metal compound-forming agent which forms a water-insoluble metal compound, and a second metal compound-forming agent which ... 03/01/07 - 20070049179 - Retaining rings, and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces Retaining rings and associated planarizing apparatuses, and related methods for planarizing micro-device workpieces are disclosed herein. A carrier head configured in accordance with one embodiment of the invention can be used to retain a micro-device workpiece during mechanical or chemical-mechanical polishing. In this embodiment, the carrier head can include a ... 02/22/07 - 20070042687 - Method and device for feeding a chemical-mechanical polishing machine with a polishing product In a chemical-mechanical polishing machine, polishing product comprising abrasive particles suspended in a reactive liquid is fed to the machine for use in a polishing operation that is divided into at least a first step and a second step. During the second step, the polishing machine is fed via a ... 02/22/07 - 20070042686 - Method and apparatus for cleaning slurry depositions from a water carrier Disclosed herein is a process for diminishing contamination of an integrated circuit wafer caused by residual slurry components disposed on a back side of a carrier for engaging an integrated circuit wafer. Also disclosed is a CMP machine configured to wash a back side of a carrier. ... 02/22/07 - 20070042685 - System and method for cutting granite or similar materials An improved frame saw system has multiple blades for cutting slabs of masonry materials. The improved systems and methods allow for cutting masonry materials into slabs having surface small deviations. A frame saw system may include a support structure of unifying material bonded to at least one of the blades ... 02/15/07 - 20070037491 - Chemically modified chemical mechanical polishing pad, process of making a modified chemical mechanical polishing pad and method of chemical mechanical polishing A method of CMP of a substrate surface includes providing a polishing pad having a polishing layer, that may be substantially free of abrasive particles, with a functional group chemically bonded (covalent or ionic) to the polishing layer. The functional group acts as an activator or catalyst for a compound ... 02/08/07 - 20070032176 - Method for polishing diamond wafers A method for polishing diamond wafers. At least a diamond wafer is mounted onto a ceramic plate with wax disposed therebetween and is pressed onto the ceramic plate. The ceramic plate is fixed on a first transmission device of a polishing machine by a vacuum. The ceramic plate is driven ... 02/08/07 - 20070032175 - Polishing cloth, polishing cloth processing method, and substrate manufacturing method using same The present invention is a polishing pad used for polishing a semiconductor substrate, wherein, at least, grooves having a radial pattern are formed on a surface of the polishing pad, and (an average value of the sum totals of the groove volumes in parts immediately below the substrate/area of the ... 02/08/07 - 20070032174 - Polishing apparatus The present invention relates to a polishing apparatus for polishing a workpiece such as a semiconductor wafer to form a flat surface thereon. The polishing apparatus includes a polishing table (20), a polishing tool (1) attached to an upper surface of the polishing table (20), and a fluid passage (40) ... 02/01/07 - 20070026770 - Abrasive agglomerate polishing method Provided is a method of polishing comprising providing a workpiece, providing a fixed abrasive article, providing conditioning particles, and relatively moving the workpiece and the fixed abrasive article in the presence of the conditioning particles to modify the surface of the workpiece and to condition the fixed abrasive. The fixed ... 02/01/07 - 20070026769 - Chemical mechanical polishing apparatus and a method for planarizing/polishing a surface The present invention provides a method for planarizing/polishing a surface, a method for manufacturing an integrated circuit and a chemical mechanical polishing apparatus. The method for planarizing/polishing a surface, among other elements, includes providing a chemical mechanical polishing apparatus (200, 300, 400) having a polishing platen (210, 310, 410), a ... 01/25/07 - 20070021040 - Polishing composition and polishing method A first polishing composition includes abrasive grains and an iodine compound and has a pH of 6 or more. The first polishing composition can suitably polish the Si [0001] plane of a single crystal silicon carbide substrate. A second polishing composition includes an iodine compound and has a pH of ... 01/18/07 - 20070015444 - Smoothing pad for bare semiconductor wafers One embodiment of the present invention is a smoothing pad for bare semiconductor wafers the smoothing pad for bare semiconductor wafers. The smoothing pad comprises a smoothing body having a closed-cell thermoplastic foam comprising an ethylene vinyl acetate block copolymer comprising a vinyl acetate content ranging from about 1 to ... 01/11/07 - 20070010176 - Fixed abrasive pad having different real contact areas and fabrication method thereof Disclosed is a method for fabricating a fixed abrasive pad in use of a chemical mechanical polishing process. The method includes: forming one or more etching molds providing a plurality of different real contact areas; attaching the etching mold(s) to a roller or press; and forming a fixed abrasive pad ... 01/11/07 - 20070010175 - Polishing pad and method of producing same The present invention relates to a method of producing a polishing pad, comprising steps of: (a) providing a base material comprising a plurality of fibers; said base material having a surface for polishing a substrate; (b) impregnating the surface of the base material with an elastomer solution; (c) curing the ... 01/04/07 - 20070004323 - Polishing composition and polishing method A polishing composition of the present invention contains silicon dioxide, an acid, and water. Silicon dioxide is, for example, colloidal silica, fumed silica, or precipitated silica. The acid is, for example, hydrochloric acid, phosphoric acid, sulfuric acid, phosphonic acid, nitric acid, phosphinic acid, boric acid, acetic acid, itaconic acid, succinic ... 01/04/07 - 20070004322 - Polishing composition and polishing method A polishing composition contains silicon dioxide, an alkaline compound, and water. Silicon dioxide is, for example, colloidal silica, fumed silica, or precipitated silica. The alkaline compound is, for example, ammonium carbonate, potassium carbonate, sodium carbonate, ammonium hydrogen carbonate, potassium hydrogen carbonate, sodium hydrogen carbonate, ammonium phosphate, potassium phosphate, sodium phosphate, ... 12/21/06 - 20060286906 - Polishing pad comprising magnetically sensitive particles and method for the use thereof The invention provides polishing pads comprising a deformable polishing pad body and magnetically sensitive particles dispersed therein, wherein one or more properties of the polishing pad are altered when in the presence of an applied magnetic field. The invention further provides a polishing system and a method for polishing a ... 12/14/06 - 20060281393 - Chemical mechanical polishing tool, apparatus and method A chemical mechanical polishing tool, apparatus and method. The polishing tool includes a central polishing assembly comprised of a central pad mount on a central shaft. That central pad mount beneficially retains a center polishing pad. Also included is a ring polishing assembly comprised of a ring pad mount with ... 12/07/06 - 20060276109 - Customized polishing pads for cmp and methods of fabrication and use thereof The present application relates to polishing pads for chemical mechanical planarization (CMP) of substrates, and methods of fabrication and use thereof. The pads described in this invention are customized to polishing specifications where specifications include (but not limited to) to the material being polished, chip design and architecture, chip density ... 12/07/06 - 20060276108 - Methods and materials for making a monolithic porous pad cast onto a rotatable base The present invention includes methods and materials for making a brush or pad for removing materials, particles, or chemicals from a substrate. The brush or pad includes a rotatable base for supporting a porous pad material. The base include an inner surface and an outer surface and a plurality of ... 11/23/06 - 20060264159 - Lens production method and process A method for processing a first optical face and a second optical face of a lens, where a lens blank is positioned and gripped by a gripping device relying on reference datum indications rendering it possible to obtain topographic orientation for processing both faces of the lens, and wherein not ... 11/23/06 - 20060264158 - Apparatus for polishing wafer and process for polishing wafer An apparatus for polishing wafers and a process for polishing wafers are provided. The apparatus for polishing a wafer which polishes the wafer W held by a carrier plate which rotates around an axis, by pressing and rubbing the wafer to a polishing pad disposed to a polishing platen 12 ... 11/23/06 - 20060264157 - Wafer polishing apparatus and method for polishing wafers This wafer polishing apparatus includes: a polishing plate having a polishing pad; a carrier plate which is placed facing the polishing pad and which slides and presses wafers against the polishing pad, while rotating in a state of holding the wafers; and an abrasive slurry supply device, wherein the abrasive ... 11/16/06 - 20060258269 - Wafer carrier and chemical mechanical polishing apparatus including the same Disclosed are a wafer carrier assembly and a chemical mechanical polishing apparatus including the same. The present wafer carrier for a chemical mechanical polishing apparatus comprises: a wafer carrier head rotatably mounted on the apparatus, having a lower surface for contacting a wafer; a retaining ring attached to the lower ... 11/16/06 - 20060258268 - Manufacturing method for semiconductor wafers, slicing method for slicing work and wire saw used for the same In order to omit a lapping process or a double disk grinding process by performing slicing operation so as not to generate long period waviness on the surface of the wafer in a slicing process and by completely removing short period waviness remaining in the surface of the sliced wafer ... 11/16/06 - 20060258267 - Polishing composition and polishing method using same A polishing composition of the present invention contains cerium oxide abrasive grains with surfaces having an adsorption layer formed by adsorption of silicon oxide fine grains. The polishing composition is used in an application for polishing a polishing subject including a laminated body and a silicon oxide film arranged on ... 10/26/06 - 20060240749 - Chemical mechanical polishing apparatus and methods using a polishing surface with non-uniform rigidity A chemical mechanical polishing apparatus includes a platen, a polishing pad affixed to a surface of the platen, and a polishing head configured to retain and rotate a wafer while pressing a surface of the rotating wafer against the polishing pad. A first portion of the polishing pad that engages ... 10/26/06 - 20060240748 - Method of manufacturing abrasive composition A process for producing a polishing composition excelling in dispersion stability wherein the amount of agglomerated particles is reduced. In step 1-1 thereof, ultrapure water is adjusted so as to have a pH value of 1.0 to 2.7. Under shearing force given by a high shear disperser, fumed silica powder ... 10/12/06 - 20060229000 - Polishing pad A polishing pad for planarizing the surface of a wafer has a planar main body of a non-foamed synthetic resin, having Shore D hardness of 66.0-78.5, preferably 70.0-78.5, or more preferably 70.0-78.0, compressibility of 4% or less or preferably 2% or less, and compression recovery rate of 50% or greater ... 10/12/06 - 20060228999 - Slurry composition and method for polishing organic polymer-based ophthalmic substrates The present invention provides a slurry composition and method for polishing organic polymer-based ophthalmic substrates. The slurry composition according to the invention includes an aqueous dispersion of abrasive particles and a pyrrolidone compound. The abrasive particles can be alumina, zirconia, silica, titania or combinations of the foregoing. Slurry compositions according ... 10/05/06 - 20060223425 - Semiconductor processing methods of removing conductive material The invention includes a semiconductive processing method of electrochemical-mechanical removing at least some of a conductive material from over a surface of a semiconductor substrate. A cathode is provided at a first location of the wafer, and an anode is provided at a second location of the wafer. The conductive ... 10/05/06 - 20060223424 - Polishing pad An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component. ... 09/28/06 - 20060217042 - Method of manufacturing a thin-film magnetic head slider A method of manufacturing a thin-film magnetic head slider suppresses the production of damaged areas during lapping, reduces the lapping time, produces high-quality products, and is suited to mass production. The method of manufacturing a thin-film magnetic head slider laps an end surface of a row bar, which has been ... 09/28/06 - 20060217041 - Yellow headlight begone A process for removing the cloudy yellowish tint from automotive headlamps, which will improve the transparency, optical quality and appearance. More specifically, the process will restore a plastic headlamp which has become so cloudy that the transparency and optical quality will be restored to an appearance which may be close ... 09/21/06 - 20060211340 - Method and tool for maintenance of hard surfaces, and a method for manufacturing such a tool A method is disclosed for maintaining a hard surface, the method comprising treating the surface with a flexible pad (1), in the presence of abrasive particles, bonded to the pad, on a contact surface between the pad (1) and the hard surface. The abrasive particles comprise diamond particles, and the ... 09/14/06 - 20060205327 - Polishing apparatus and method The present invention provides a polishing apparatus and a polishing method, which are particular for the non-spherical lens. The polishing apparatus includes a base for carrying an object; and a polishing head, wherein the polishing head has a polishing layer made of a resin, a diamond and a graphite for ... 08/31/06 - 20060194519 - Wafer carrier with pressurized membrane and retaining ring actuator A wafer carrier for controlling downward force and edge effect during chemical mechanical planarization. A retaining ring actuator is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. An inflatable membrane is disposed across the bottom surface ... 08/31/06 - 20060194518 - Methods for planarization of group viii metal-containing surfaces using a fixed abrasive article A planarization method includes providing a Group VIII metal-containing surface (preferably, a platinum-containing surface) and positioning it for contact with a fixed abrasive article in the presence of a planarization composition, wherein the fixed abrasive article comprises a plurality of abrasive particles having a hardness of no greater than about ... 08/31/06 - 20060194517 - Method for precision alignment during a blocking process of lens manufacturing A blocking apparatus and a blocking method allow precise alignment of an axis of a button with an axis of a block for a blocking process of lens manufacturing. According to another aspect, the invention provides a blocking apparatus and a blocking method for automatically compensating variations in button geometry ... 08/31/06 - 20060194516 - Processing apparatus and processing method A processing apparatus according to the present invention, which conditions a substrate placed on a table equipped with a heater by radiating an electron beam onto the substrate while heating the substrate with the heater, includes at least three projecting portions for holding the substrate at a predetermined distance from ... 08/10/06 - 20060178089 - Wafer-retaining carrier, double-side grinding device using the same, and double-side grinding method for wafer The present invention is a wafer-holding carrier 1 wherein the carrier has polishing agent-passing holes 3, 4 for passing the polishing agent through as well as wafer-holding holes 2 for containing and holding wafers, and the total area of the polishing agent-passing holes occupies 15% or more of a main ... 08/10/06 - 20060178088 - Stone sawing without acute noise The invention relates to stone sawing without acute noise. Acute noise, which is produced by the direct friction between the metal bands and the stones, reaches levels greater than 90 db at a distance of 1.5 m between said bands and the measuring apparatus. By increasing the concentration of grit ... 07/27/06 - 20060166609 - System and method for ophthalmic lens manufacture A method and system for the manufacture of ophthalmic lenses comprising a computer (102) and a CNC machining platform (104) in operative connection with the computer. The CNC machining platform includes a mounting stage (110), a block (106) in releasable connection with the mounting stage, and a machining tool (112). ... 07/20/06 - 20060160475 - Chemical mechanical polishing compositions for metal and associated materials and method of using same A chemical mechanical polishing slurry composition and method for using the slurry composition for polishing copper, barrier material and dielectric material that comprises first and second-step slurries. The first-step slurry has a high removal rate on copper and a low removal rate on barrier material. The second-step slurry has a ... 07/20/06 - 20060160474 - Magnetically secured retaining ring A retaining ring having a bottom portion that is removable from the ring's upper portion is described. The upper and lower portions of the retaining ring include one or more magnetic bodies and/or one or more bodies formed of a material that is attracted to magnets. ... 07/20/06 - 20060160473 - Fixture for slider lapping, lapping device and lapping method A fixture for slider lapping includes a holding portion for holding the object with its surface to be lapped toward the lapping surface of the lapping device; a main body for mounting the lapping fixture to the lapping device; a plurality of load-applied portions which are arranged along said longitudinal ... 07/13/06 - 20060154575 - Method of making solar cell A method of manufacturing a solar cell including a silicon wafer is provided. In certain example instances, the method may include flattening fine roughness existing on a side face of a silicon block or a silicon stack used for manufacturing the silicon wafer for use in the solar cell. ... 07/13/06 - 20060154574 - Cmp pad having a radially alternating groove segment configuration A polishing pad (104) having an annular polishing track (122) and including a plurality of grooves (148) that each traverse the polishing track. Each groove includes a plurality of flow control segments (CS1-CS3) and at least two discontinuities in slope (D1, D2) located within the polishing track. ... 07/13/06 - 20060154573 - Gentle chemical mechanical polishing (cmp) liftoff process A method for chemical mechanical polishing (CMP) wafers having high aspect ratio surface topography. A wafer is positioned on a plate. A polishing pad is coupled to a platen. A polishing solution (e.g., slurry) is added between the polishing pad and the wafer. CMP is performed on the wafer by ... 07/13/06 - 20060154572 - High-pressure polishing apparatus and method A high-pressure polishing apparatus and method comprising a condenser having high-pressure nozzles for ejecting a solution on the polishing pad to perform a conditioning, thereby preventing damage to the wafer and destruction of the diamond condenser due to a larger force applied on the diamond condenser in order to obtain ... 07/06/06 - 20060148385 - Retaining structure for edge control during chemical-mechanical polishing An improved design for a retaining ring for a chemical mechanical poling machine is described which provides superior flexibility and instantaneous in-situ control of the polishing rate in the edge region of a wafer. The design has a plurality of straight slurry delivery groves, angled in the direction of rotation ... 07/06/06 - 20060148384 - Polishing apparatus, method of manufacturing semiconductor device using the same, and semiconductor device manufactured by this method The present invention provides a polishing apparatus for a semiconductor wafer in which a slide member and a swing holding member are provided in a polishing member that is provided so as to block an opening in a head housing, a slide guide member and a ring member are provided ... 06/29/06 - 20060141909 - Chemical mechanical polishing apparatus A “black belt” phenomenon that may be caused by an eddy of a slurry may be prevented when a wafer is polished by a chemical mechanical polishing (CMP) apparatus that includes a polishing pad to be supplied with the slurry, a polishing head including a top ring adapted to hold ... 06/22/06 - 20060135047 - Method and apparatus for clamping a substrate in a high pressure processing system Pressure biased wafer holding of a semiconductor wafer is provided for use in high pressure processing. The use of vacuum chucking for holding a semiconductor wafer during processing is applied to high pressure systems. Adverse effects of high pressure biases are prevented by a valve arrangement that reduces or limits ... 06/22/06 - 20060135046 - Multi-platen multi-slurry chemical mechanical polishing process A multi-platen, multi-slurry chemical mechanical polishing method comprises providing a substrate having a surface that includes at least one nitride structure and an oxide layer atop the nitride structure, performing a first CMP process on the substrate using a first platen with a silica based slurry to remove a bulk ... 06/15/06 - 20060128277 - Apparatus and method for chemical-mechanical polishing (cmp) head having direct pneumatic wafer polishing pressure A resilient pneumatic annular sealing bladder is coupled for fluid communication to a first pressurized pneumatic fluid to define a first pneumatic zone and is attached to a first surface of the wafer stop plate adjacent the retaining ring interior cylindrical surface to receive the wafer and to support the ... 06/15/06 - 20060128276 - Carrier for double side polishing In a carrier of the invention, a thick ring-shaped support frame is provided at an outer periphery of a carrier body in which a workpiece housing hole for holding a workpiece is opened. An outer periphery of the support frame is provided with a teeth portion for engaging with driving ... 06/08/06 - 20060121835 - Polishing method The polished object is prevented from sticking to the upper polishing mechanism wherein the sticking is a cause for the damages to the polished object and reduction of the yield. There is provided a double side polishing method comprising steps of: inserting an object between a pair of upper and ... 06/08/06 - 20060121834 - Polishing method, polishing device, glass substrate for magnetic recording medium, and magnetic recording medium There are disclosed a polishing method and a polishing device in which cleaning of a glass substrate surface can be achieved to a high level. A glass substrate (MD substrate 1) in the shape of a circular disc having a circular hole in a center portion is polished with an ... 06/01/06 - 20060116056 - Apparatus and methods for polishing a semiconductor wafer An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a ... 06/01/06 - 20060116055 - Resin bond grindstone and method of manufacturing a semiconductor chip using the grindstone The present invention provides a resin bond grindstone and method of manufacturing a semiconductor chip using the grindstone that provide a semiconductor device with high reliability even when a thickness of the semiconductor chip is thinned, and specifically provides followings: [1] A resin bond grindstone which comprises grains coated with ... 06/01/06 - 20060116054 - Polishing body An object of the present invention is to provide a polishing body, wherein the abrasive in the polishing body are extremely dispersed well, which provides stable polishing performance in the polishing process, and which can effectively reduce the occurrence of scratches even in a case a large quantity of the ... 05/25/06 - 20060111024 - Cellulose-containing polishing compositions and methods relating thereto An aqueous composition is useful for chemical mechanical polishing of a patterned semiconductor wafer containing a nonferrous metal. The composition comprises an oxidizer, an inhibitor for the nonferrous metal, 0.001 to 15 weight percent of a water soluble modified cellulose, non-saccaride water soluble polymer, 0 to 15 weight percent phosphorus ... 05/18/06 - 20060105685 - System and method for cmp having multi-pressure zone loading for improved edge and annular zone material removal control In one aspect, the invention provides a method for planarizing a circular disc-type semiconductor wafer or other substrate. The method includes the steps of pressing a retaining ring surrounding the wafer against a polishing pad at a first pressure; pressing a first peripheral edge portion of the wafer against the ... 05/18/06 - 20060105684 - Fiber polishing apparatus and method for field terminable optical connectors A polishing apparatus for an optical fiber connector that includes an optical fiber ferrule and a connector housing, comprises a polishing puck having an aperture to permit passage of the ferrule therethrough and a mount to hold the connector housing at a predetermined angle. The polishing apparatus further includes a ... 05/11/06 - 20060099890 - Simultaneous planarization of pole piece and coil materials for write head applications A method for simultaneously planarizing to relatively equal smoothness a thin film magnetic head hardbaked resist structure having relatively low surface energy and one or more additional thin film magnetic head structures containing other materials having comparatively higher surface energy, such as copper, hardbaked resist, alumina and NiFe. The method ... 05/11/06 - 20060099889 - Elastic polishing tool and lens polishing method An elastic polishing tool that comes into contact with a surface to be polished of a lens and rotates to polish the surface, includes: an elastic polishing body which has a cylindrical shape and whose shape can be changed according to the surface to be polished; and a polishing pad ... 05/04/06 - 20060094341 - Polishing tool with several pressure zones The invention refers to a polishing tool 1 for optical lenses 10 with at least one polishing pad 7 adaptable at least partially to the shape of a lens surface 10.1 of said lenses 10 and drivable by means of a drive shaft 3, said polishing pad 7 having a ... 05/04/06 - 20060094340 - Process for manufacturing optical and semiconductor elements A method for fabricating an array of precisely shaped and located shaped elements utilizes a precisely shaped patterned abrasive to form channels in a workpiece. One or more patterned abrasives contact and abrade along one or more intersecting axes to define the shaped elements. The shaped elements may include optical ... 04/20/06 - 20060084365 - Polishing pad A polishing pad having a polishing layer which has specific composition and a ratio of the storage elastic modulus at 30° C. to the storage elastic modulus at 60° C. of 2 to 15 and a ratio of the storage elastic modulus at 30° C. to the storage elastic modulus ... 04/13/06 - 20060079156 - Method for processing a substrate using multiple fluid distributions on a polishing surface A polishing fluid delivery apparatus has been provided that in one embodiment includes a support member, a dispense arm, a polishing fluid delivery tube and a variable restricting device. The dispense arm extends from an upper portion of the support member and has an outlet of the delivery tube coupled ... 04/13/06 - 20060079155 - Wafer grinding method A wafer grinding method for grinding the surface to be ground of a wafer having an arcuatedly chamfered outer peripheral surface, comprising an outer peripheral portion removal step for removing the outer peripheral portion of the wafer by applying a laser beam from one surface side of the wafer along ... 04/13/06 - 20060079154 - Chemical mechanical polishing process for manufacturing semiconductor devices A chemical-mechanical polishing (CMP) process for the manufacturing of semiconductor devices is disclosed. The process includes removing a first portion of a first layer of interconnect materials using a first platen and a first slurry, removing a second portion of the first layer using a second platen and a second ... 04/06/06 - 20060073770 - Vapor deposition crucible A polishing apparatus includes a polishing jig. The polishing jig includes an elastic balloon member, a fixture, and a fluid supply portion. The fixture airtightly closes the rear opening portion of the balloon member. The fluid supply portion supplies a fluid into a space formed by the fixture and balloon ... 03/30/06 - 20060068687 - Apparatus for dry footing and sanding ceramic pieces and method of using same An apparatus for removing paint and dipping glaze from ceramic pieces before they are fired includes a support having an opening passing through it. Located in the opening is a rigid carrier which air can readily pass through. The carrier supports a porous, abrasive pad. A vacuum device attached to ... 03/23/06 - 20060063474 - Method for producing a mirror from a titanium-based material, and a mirror made from such a material A method for producing a mirror (10) from a titanium-based material by using the technique of ultraprecision machining. The mirror produced using this method has both a shape accuracy and a surface roughness in the submicrometer region. The mirror (10) is made from a titanium-based material having a shape accuracy ... 03/16/06 - 20060057945 - Chemical mechanical polishing process A first substrate and second substrate both having thereon a top bulk metal layer and a lower barrier layer are prepared. The first substrate is first loaded onto a first platen of a CMP tool, and then an upper portion of the top bulk metal layer of the first substrate ... 03/16/06 - 20060057944 - Chemical mechanical polishing process A high throughput chemical mechanical polishing process is disclosed. A substrate having thereon a top bulk metal layer and a lower barrier layer is prepared. The top bulk metal layer is polished at a substantial constant removal rate to expose the barrier layer by utilizing a first platen and first ... 03/16/06 - 20060057943 - Ceria-based polish processes, and ceria-based slurries By adding silica to ceria-based CMP slurries the polish process starts much faster than without silica thereby eliminating dead time in the polish process and eliminating process instability caused by changes in the dead time with operating conditions. A slurry for performing chemical mechanical polishing (CMP) of patterned oxides (e.g., ... 03/16/06 - 20060057942 - Polishing apparatus, polishing head and polishing method A polishing apparatus comprises a polishing plate (24), an abrasive cloth (25) attached to the surface of the polishing plate (24), a chuck (19) for holding and pressing one surface of a wafer (39) against the abrasive cloth (25), and a circular retaining ring (23) concentrically arranged on the periphery ... 03/09/06 - 20060052040 - Method for manufacturing microporous cmp materials having controlled pore size A method of manufacturing a chemical-mechanical polishing (CMP) pad comprises the steps of (a) forming a layer of a polymer resin liquid solution (i.e., a polymer resin dissolved in a solvent); (b) inducing a phase separation in the layer of polymer solution to produce an interpenetrating polymeric network comprising a ... 03/02/06 - 20060046622 - Polishing pad with microporous regions The invention provides a polishing pad for chemical-mechanical polishing comprising a polymeric material comprising two or more adjacent regions, wherein the regions have the same polymer formulation and the transition between the regions does not include a structurally distinct boundary. In a first embodiment, a first region and a second ... 03/02/06 - 20060046621 - Retaining ring structure for edge control during chemical-mechanical polishing The retaining ring has a plurality of slurry channels wherein each alternate channel is recessed away from the inner circumference of the pad contacting surface forming a recess which extends upward from the bottom surface sufficient to prevent contact of the retaining ring with the polishing pad. Each recess curves ... 02/23/06 - 20060040594 - Apparatus and method for fabricating liquid crystal display panel An apparatus and method for fabricating a liquid crystal display panel are disclosed. In case of the single mode that liquid crystal display panels are fabricated with the same size on a large glass substrate, defective unit liquid crystal display panels are kept and discarded not to proceed with a ... 02/23/06 - 20060040593 - Method for polishing silicon carbide crystal substrate A method for polishing a silicon carbide crystal substrate according to the present invention includes a polishing process of polishing a silicon carbide crystal substrate having a surface roughness Rz of at most 50 μm, using an abrasive solution containing abrasive particles made of boron carbide. Accordingly, it is possible, ... 02/23/06 - 20060040592 - Tool and process for chrome plating a vehicle wheel surface A cutting tool having a crystalline tip is pressed with a uniform pressure against the outboard surface of a vehicle wheel as the wheel is rotated. The smoothed wheel surface is then chrome plated to provide a cosmetic finish to the wheel face. ... 02/23/06 - 20060040591 - Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods are disclosed. A method in accordance with one embodiment of the invention includes disposing a polishing liquid on a polishing surface of a microfeature workpiece polishing pad. The polishing pad can include a matrix material ... 02/09/06 - 20060030246 - Buffing head and method for reconditioning an optical disc A buffing head (34) includes a rotary element (36) for retaining an optical disc (20) and causing the disc (20) to rotate at a first speed. A buffing element (38) contacts a work surface (30) of the optical disc (20), and rotation of the disc (20) enables corresponding movement of ... 02/09/06 - 20060030245 - Grindstone and method for producing optical element A grindstone 1 has a pedestal 2 and an abrasive-grain layer 9 provided on the pedestal 2. The abrasive-grain layer 9 is a plating film which contains abrasive grains. An intermediate layer 7 which has physical properties different from those of the abrasive-grain layer 9 is provided between the abrasive-grain ... 02/09/06 - 20060030244 - Substrate polishing apparatus A chemical mechanical polishing apparatus includes a rotating plate on which a substrate received, and a polishing pad which moves across the substrate as it rotates on the plate to polish the substrate. The load of the pad against the substrate, and the rotary speed of the plate, may be ... 02/09/06 - 20060030243 - Polishing composition A polishing composition containing an abrasive and water, wherein the polishing composition has a pH of from 0.1 to 7, and satisfies the following conditions: (1) that the number of polishing particles having sizes of 0.56 μm or more and less than 1 μm is 500,000 or less per 1 ... 02/09/06 - 20060030242 - Shaped polishing pads for beveling microfeature workpiece edges, and associate system and methods Systems and methods for beveling microfeature workpiece edges are disclosed. A system in accordance with one embodiment is configured to remove material from a microfeature workpiece having a first face, a second face facing opposite from the first face, an edge surface between the first and second faces, and an ... 02/09/06 - 20060030241 - Pad backer and cmp process using the same A pad backer is described, comprising a backing plate, an elastomer layer and a pad backing ring. The elastomer layer has a bottom surface bonded to the backing plate and an upper surface with a protrudent part at the edge portion thereof. The pad backing ring has an inner bottom ... 02/02/06 - 20060025055 - Apparatus for loading wafers and method for loading wafers using the same The present invention relates to an apparatus for loading wafers, a semiconductor manufacturing apparatus and a method for loading wafers comprising: a disk pad for supporting a wafer, the disk pad having a fixing member mounted on a front surface thereof for fixing the wafer and a hole extending therethrough; ... 01/26/06 - 20060019582 - Substrate removal from polishing tool Techniques for removing a substrate from a polishing pad are described. A substrate is pulled away from the polishing pad such that the edges of the substrate are pulled away from the polishing pad before the center of the substrate is pulled from the polishing pad. ... 01/26/06 - 20060019581 - Polishing solution retainer A substrate polishing apparatus and method are described. A base includes at least one movable platen to engage a polishing pad. At least one carrier head assembly presses a substrate against the polishing pad substantially within a polishing area during a polishing operation. A polishing solution dispenser applies a polishing ... 01/19/06 - 20060014479 - Arrangement of a chemical-mechanical polishing tool and method of chemical-mechanical polishing using such a chemical-mechanical polishing tool wherein the first dispensing means location (L1) of the first dispensing means (7) is arranged in a downstream direction with respect to the holder location (L0) at a first downstream distance (d1), with the downstream direction being taken in relation to the first direction (ω1); and the second dispensing means ... 01/19/06 - 20060014478 - Apparatus and method for distributing a polishing fluid An apparatus and method for evenly distributing a polishing fluid onto a polishing pad during a chemical mechanical planarization process, wherein the polishing fluid is dispersed by way of a spray being emitted from a spray nozzle. The pattern of polishing fluid applied to the polishing pad can be modified ... 01/12/06 - 20060009134 - Grinding wheel, grinding apparatus and grinding method The present invention provides the grinding wheel, the grinding apparatus and the grinding method of the present invention so that increase in the size of the grinding apparatus can be suppressed, and the back surface grinding of the wafer and the grinding of the peripheral edge part of the wafer ... 01/05/06 - 20060003675 - Fixed-abrasive chemical-mechanical planarization of titanium nitride Titanium nitride layers planarized may be utilized in the production of integrated circuits, and various apparatus utilizing such integrated circuits. Planarizing solutions may be used for removing titanium nitride from the surface of a substrate using a fixed-abrasive planarizing pad. The planarizing solutions take the form of an etchant solution ... 12/29/05 - 20050287933 - Glass substrate for information recording medium and process for manufacturing the same A glass substrate for use in an information recording medium is manufactured by polishing a surface of a disc-shaped glass substrate and then performing texture processing on the surface. The texture processing includes the steps of forming lines of texture on the surface of the glass substrate extending along a ... 12/29/05 - 20050287932 - Article for polishin substrate surface An article for polishing a surface of a semiconductor workpiece is provided. The article includes a polishing layer and a plurality of protrusions repeating across the polishing layer. The protrusions include abrasive particles and can be elastically deformed while polishing the surface of the wafer. ... 12/29/05 - 20050287931 - Polishing slurry and polished substrate A polishing slurry comprising an abrasive comprising as a basic ingredient rare earth oxides containing cerium oxide, which polishing slurry further comprises an anionic surfactant and a nonionic surfactant and has a pH value of at least 11. The polishing slurry is especially suitable for polishing a glass substrate for ... 12/22/05 - 20050282472 - Cmp apparatus and method for polishing multiple semiconductor wafers on a single polishing pad using multiple slurry delivery lines A chemical mechanical polishing (CMP) apparatus and method for sequentially polishing multiple semiconductor wafers on a single polishing pad utilizes multiple slurry delivery lines to supply one or more types of polishing solutions to the surface of the polishing pad. The slurry delivery lines are positioned to direct the polishing ... 12/22/05 - 20050282471 - Chemical mechanical polishing slurry useful for tunsten/titanium substrate Disclosed is a chemical mechanical polishing (CMP) slurry having a superior polishing efficiency as well as being capable of effectively converting a metal layer to be polished into a metal oxide layer. The CMP slurry composition includes an abrasive, an oxidizing agent, an iron-doped colloidal silica, and water. Preferably, the ... 12/15/05 - 20050277368 - Apparatus and method for removing a cmp polishing pad from a platen The invention provides a pad removal apparatus and method that enables improved pad removal from a platen. ... 12/15/05 - 20050277367 - Chemical-mechanical polishing (cmp) slurry containing clay and ceo2 abrasive particles and method of planarizing surfaces A composition for planarizing or polishing a surface comprising (a) a liquid carrier, and (b) solids comprising about 0.1 to about 10% by weight clay abrasive particles, and about 0.1% to about 50% by weight CeO2 particles, based on the total weight of solids in the composition, said clay and ... 12/08/05 - 20050272352 - Slurry delivery arm A polishing fluid delivery apparatus has been provided that in one embodiment includes a support member, a dispense arm, a polishing fluid delivery tube and a variable restricting device. The dispense arm extends from an upper portion of the support member and has an outlet of the delivery tube coupled ... 12/08/05 - 20050272351 - Method and apparatus for cleaning mounting nozzle, and mounting machine A cleaning apparatus according to the invention is used for an electronic component mounting machine, includes a abrading unit for abrading the suction surface of the mounting nozzle; and a drive unit for moving the abrading unit in a predetermined direction, the abrading unit being formed by a ceramics structure, ... 11/24/05 - 20050260931 - Carrier heads, planarizing machines and methods for mechanical or chemcial-mechanical planarization of microelectronic-device substrate assemblies Planarizing machines, carrier heads for planarizing machines and methods for planarizing microelectronic-device substrate assemblies in mechanical or chemical-mechanical planarizing processes. In one embodiment of the invention, a carrier head includes a backing plate, a bladder attached to the backing plate, and a retaining ring extending around the backing plate. The ... 11/24/05 - 20050260930 - Table of wafer of polishing apparatus, method for polishing semiconductor wafer, and method for manufacturing semiconductor wafer A table for a wafer polishing apparatus having superior heat-resistant, anti-thermal-shock, and anti-abrasion characteristics and capable of increasing the diameter of a semiconductor wafer while improving the quality of the wafer. The table includes a plurality of superimposed bases each of which is formed of silicide ceramic or carbide ceramic. ... 11/24/05 - 20050260929 - Chemical mechanical polishing pad and chemical mechanical polishing method A chemical mechanical polishing pad having a polishing surface, a non-polishing surface opposite to the polishing surface and a side surface for defining these surfaces, the polishing surface having (i) a first group of grooves which intersect a single virtual straight line extending from the center toward the peripheral portion ... 11/24/05 - 20050260928 - Integral polishing pad and manufacturing method thereof An integral polishing pad includes an elastic support layer and a polishing layer, which is formed on the elastic support layer and has a higher hardness than the elastic support layer. The elastic support layer and the polishing layer are made from materials chemically compatible with each other so that ... 11/17/05 - 20050255796 - Probe cleaning sheet and cleaning method A probe cleaning sheet is provided, which can be used not only at a room temperature and high temperature but also in a low temperature environment with sufficient cushioning property and which can softly and efficiently clean a probe tip end. Specifically, the cleaning sheet has a layered structure including ... 11/10/05 - 20050250424 - Polishing pad, method of manufacturing glass substrate for use in data recording medium using the pad, and glass substrate for use in data recording medium obtained by using the method A polishing pad used for precise polishing of the surface of a lapped glass workpiece when a glass substrate for use in data recording media is manufactured from a glass workpiece. The polishing pad comprises a base and a polishing portion laminated on the base and contacting the surface of ... 11/10/05 - 20050250423 - Method for manufacturing semiconductor device and polishing apparatus In manufacturing a semiconductor device, a part of an element is formed on the surface of a substrate, and at least a periphery of the substrate is polished using a polishing member stretched around the periphery of the substrate so that a polishing face of the polishing member is slid ... 11/10/05 - 20050250422 - Method and apparatus for grinding of concrete floors A method for dry finishing of a floor surface consisting of concrete, stone, marble, terrazzo, densite or other hard materials is disclosed. The method comprises finishing of the floor surface using a cutting, grinding and/or polishing tool. In the method, a vapor or aerosol is applied to the floor surface ... 11/03/05 - 20050245174 - Method of processing a substrate A method of processing a substrate is disclosed, wherein a sidewall surface of a notch portion formed in a circumferential portion of a substrate to be processed is polished by using a cylindrical polishing head rotatable with an axis as a rotational center. ... 10/27/05 - 20050239380 - Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method A chemical mechanical polishing pad having a polishing surface with an arithmetic mean roughness (Ra) of 0.1 to 15 μm, a 10-point height (Rz) of 40 to 150 μm, a core roughness depth (Rk) of 12 to 50 μm and a reduced peak height (Rpk) of 7 to 40 μm, ... 10/20/05 - 20050233680 - Method chemical-mechanical polishing and planarizing corundum, gaas, gap and gaas/gap alloy surfaces Compositions and methods for planarizing or polishing a corundum, GaAs, GaP or GaAs/GaP alloy surface, particularly a semiconductor wafer surface. The polishing compositions described herein comprise (a) a liquid carrier; (b) a smectite clay, preferably a sodium smectite clay; and optional additives, such as (c) CeO2, SiO2 and/or Al2O3 abrasive ... 10/20/05 - 20050233679 - Methods for making wafers with low-defect surfaces, wafers obtained thereby and electronic components made from the wafers The method of making an especially low-stress wafer substrate with an active surface to be coated with few surface defects that produce coating defects includes polishing the active surface with the help of a polishing tool in order to smooth it and changing a polishing direction of the polishing tool ... 10/13/05 - 20050227591 - Processing tool, method of producing processing tool, processing method and processing apparatus A processing tool is used to carry out a fixed-abrasive grinding process on a surface of a silicon work-piece. The processing tool includes abrasive grains made up silica grains. A primary average grain size of the silica grains is desirably 0.8 nm to 10 μm. ... 10/13/05 - 20050227590 - Fixed abrasive tools and associated methods A fixed abrasive tool incorporating nanodiamond particles is described and disclosed. A fixed abrasive tool can include a polishing layer on a substrate. The polishing layer can include an organic matrix with nanodiamond particles therein. The polishing layer can be formed in a wide variety of configurations, depending on the ... 10/06/05 - 20050221726 - Polishing composition The present invention relates to a polishing composition containing an abrasive having an average particle size of from 1 to 30 nm and water, wherein the abrasive has a packing ratio of from 79 to 90% by weight; a method for manufacturing a substrate, including the steps of introducing the ... 10/06/05 - 20050221725 - Method of sucking water and water sucking device The method of sucking water is capable of easily removing excess water included in a backing member adhered on a plate of a polishing apparatus. In the method, the excess water is removed from the backing member by the steps of: pressing a water absorbing member onto a holding surface ... 10/06/05 - 20050221724 - Polishing apparatus and method of polishing a subject A polishing apparatus. The polishing apparatus has an abrasive cloth and a table to rotate the abrasive cloth. A holder holds a subject to be polished against the abrasive cloth. A discharger discharges a polishing solution from the abrasive cloth after the polishing solution passes between the abrasive cloth and ... 10/06/05 - 20050221723 - Multi-layer polishing pad for low-pressure polishing A polishing pad has a polishing layer and a backing layer secured to the polishing layer. The polishing layer has a polishing surface, a first thickness, a first compressibility, and a hardness between about 40 to 80 Shore D. The backing layer has a second thickness and has a second ... 09/29/05 - 20050215183 - Chemical-mechanical planarization composition having pvno and associated method for use A composition and associated method for chemical mechanical planarization (or other polishing) are described. The composition contains an abrasive, a dielectric protector comprising a polyvinylpyridine-N-oxide polymer, an oxiding agent, and water. The composition affords minimization of local erosion effects and possesses high selectivities for metal and barrier material removal in ... 09/29/05 - 20050215182 - Wafer carrier with pressurized membrane and retaining ring actuator A wafer carrier for controlling downward force and edge effect during chemical mechanical planarization. A retaining ring actuator is disposed within the retaining ring to control the height of the retaining ring relative to the bottom surface of the wafer carrier. An inflatable membrane is disposed across the bottom surface ... 09/29/05 - 20050215181 - Chemical mechanical polishing retaining ring, apparatuses and methods incorporating same The disclosure is directed to a chemical mechanical polishing retaining ring including a polymer matrix and a filler including polyimide. The chemical mechanical polishing retaining ring has a wear rate performance not greater than about 75 microns/hour. ... 09/22/05 - 20050208883 - Polishing composition The present invention relates to a polishing composition containing an aqueous medium and silica particles, wherein the silica particles in the polishing composition has a zeta potential of from −15 to 40 mV; a method for manufacturing a substrate including the step of polishing a substrate to be polished with ... 09/22/05 - 20050208882 - Ceria slurry for polishing semiconductor thin layer A non-agglomerating ceria aqueous slurry, which has good dispersion stability and reduced generation of scratches with excellent polishing productivity, comprises ceria particles having a mean volume particle size ranging from 0.1 to 0.2 μm and is characterized in that when it is centrifuged under an applied average centrifugal force (g) ... 09/22/05 - 20050208881 - Chemical mechanical polishing retaining ring with integral polymer backing In one embodiment, the disclosure is directed to a chemical mechanical polishing retaining ring. The chemical mechanical polishing retaining ring includes a support formed of a first material comprising a first polymer and a wear portion formed of a second material comprising a second polymer. The first material has an ... 09/15/05 - 20050202758 - Carrier for holding an object to be polished To provide a diamond-like carbon coated carrier for holding an object to be polished used for double-sided polishing, and a manufacturing method therefor. A carrier for holding an object to be polished according to the present invention has a substrate whose entire surface is coated with diamond-like carbon. A method ... 09/08/05 - 20050197050 - Multi-layer polishing pad material for cmp The invention is directed to a multi-layer polishing pad for chemical-mechanical polishing comprising a porous polishing layer and a porous bottom layer, wherein the bottom layer is substantially coextensive with the polishing layer, the polishing layer being joined to the bottom layer without the use of an adhesive; the polishing ... 09/01/05 - 20050191948 - Polishing pads and planarizing machines for mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies, and methods for making and using such pads and machines Polishing pads used in the manufacturing of microelectronic devices, and apparatuses and methods for making and using such polishing pads. In one aspect of the invention, a polishing pad for planarizing microelectronic-device substrate assemblies has a backing member including a first surface and a second surface, a plurality of pattern ... 09/01/05 - 20050191947 - Retaining ring with shaped surface A retaining ring can be shaped by machining or lapping the bottom surface of the ring to form a shaped profile in the bottom surface. The bottom surface of the retaining ring can include flat, sloped and curved portions. The lapping can be performed using a machine that dedicated for ... 08/18/05 - 20050181709 - Rinse apparatus and method for wafer polisher An apparatus for polishing a wafer comprising a rotatable polishing pad having a center of rotation and a rinse delivery conduit positioned adjacent to the polishing pad and substantially in radial alignment with the center. The rinse delivery conduit includes a plurality of nozzles to dispense a rinsing liquid. In ... 08/18/05 - 20050181708 - Removal of embedded particles during chemical mechanical polishing A chemical mechanical polishing method and apparatus are introduced that reduce embedded particles during CMP processing. Throughout the CMP process, the wafer-carrier and the polish platen turn or rotate in the same direction. This enables particles to become embedded in the oxide or other film surface. In the disclosed process, ... 08/04/05 - 20050170760 - Polishing apparatus In a polishing apparatus having a cover body with fluid pressing mechanism, during polishing, vibration and migration of sticking portion between a retainer and a membrane generated in downstream of rotation of a polishing platen is prevented by reducing sticking force between the retainer and the membrane to less than ... 08/04/05 - 20050170759 - Differential planarization Method and structure for optimizing and controlling chemical mechanical planarization are disclosed. Embodiments of the invention include planarization techniques to make nonplanar surfaces comprising alternating metal and intermetal layers. Relative protrusion dimensions and uniformity of various layers may be accurately controlled using the disclosed techniques. ... 08/04/05 - 20050170758 - Scratch removal tool and system A system for removing scratches from glass windows, windshields and the like utilizing a compound applied to a powered polishing disk/pad which effectively “scrubs” away the scratches. Liquid needs to be applied during the process. To enable the operator to use both hands to maneuver the tool while also controlling ... 08/04/05 - 20050170757 - Grooved polishing pad and method A polishing pad (104, 300, 400, 500) for polishing a wafer (112, 516), or other article. The polishing pad includes a polishing layer (108) having a polishing region (164, 320, 420, 504) defined by first and second boundaries ((168, 172), (312, 316), (412, 416) (508, 512)) having shapes and locations ... 07/21/05 - 20050159086 - Methods for planarization of group viii metal-containing surfaces using complexing agents A planarization method includes providing a second and/or third row Group VIII metal-containing surface (preferably, a platinum-containing surface) and positioning it for contact with a polishing surface in the presence of a planarization composition that includes a complexing agent. ... 07/21/05 - 20050159085 - Method of chemically mechanically polishing substrates The present invention relates to a method of polishing a substrate. The invention more particularly relates to the chemical mechanical polishing of a substrate enhanced by the addition of a refractory metal. A method according to the present disclosure comprises using an oxidizing agent, a refractory metal suspended in a ... 07/21/05 - 20050159084 - Chemical mechanical polishing method and apparatus for controlling material removal profile A material removal apparatus employing a showerhead with non-planar topography is provided. The showerhead surface includes a plurality of fluid zones to apply a fluid pressure to a backside of a polishing pad while a front side of the polishing-pad polishes a substrate. The varying topography of the showerhead surface ... 07/21/05 - 20050159083 - All-in-one polishing process for a semiconductor wafer A semiconductor wafer has a top surface and an edge bevel surface, and a first material layer and a second material layer are respectively formed on the top surface and the edge bevel surface. A surface chemical mechanical polishing (surface CMP) process is performed to polish and remove portions of ... 07/14/05 - 20050153634 - Negative poisson's ratio material-containing cmp polishing pad The invention is directed to a chemical-mechanical polishing pad comprising a porous polymeric material, wherein the porous polymeric material has a Poisson's ratio less than 0. The invention further provides a method of polishing a workpiece comprising (i) providing a workpiece to be polished, (ii) contacting the workpiece with a ... 07/14/05 - 20050153633 - Polishing pad, polishing apparatus, and polishing method A polishing pad which ensures that a work can be easily removed from the polishing pad surface after polishing, the amount of a polishing liquid used for polishing can be reduced, and the production cost of the polishing pad can be lowered. A first polishing pad (1) for polishing a ... 07/07/05 - 20050148291 - Polishing composition and polishing method A polishing composition contains silicon dioxide, an alkaline compound, and water. Silicon dioxide is, for example, colloidal silica, fumed silica, or precipitated silica. The alkaline compound is, for example, ammonium carbonate, potassium carbonate, sodium carbonate, ammonium hydrogen carbonate, potassium hydrogen carbonate, sodium hydrogen carbonate, ammonium phosphate, potassium phosphate, sodium phosphate, ... 07/07/05 - 20050148290 - Chemical-mechanical polishing of metals in an oxidized form The invention provides a method for polishing a substrate comprising a metal in an oxidized form, the method comprising the steps of: (a) providing a substrate comprising a metal in an oxidized form, (b) contacting a portion of the substrate with a chemical-mechanical polishing system comprising: (i) a polishing component, ... 07/07/05 - 20050148289 - Micromachining by chemical mechanical polishing Methods of micromachining structures on substrates using chemical mechanical polishing techniques. ... 06/30/05 - 20050142989 - Polishing body, polishing apparatus, semiconductor device, and semiconductor device manufacturing method The polishing body 4 is attached to a substrate 5. The polishing body 4 has a structure in which a polishing pad 6, a hard elastic member 7 and a soft member 8 are laminated in that order from the side of the polishing surface. For example, an IC1000 (commercial ... 06/30/05 - 20050142988 - Cmp process using slurry containing abrasive of low concentration A CMP process using a slurry containing an abrasive of low concentration is disclosed. More specifically, a planarization process is performed using the slurry containing an abrasive of low concentration of less than 0.1 wt % unlike the conventional CMP slurry, thereby improving uniformity of a CMP process in a ... 06/23/05 - 20050136807 - Polishing composition for magnetic disk A polishing composition for a magnetic disk, comprising alumina, water, a peroxide and an organic acid; a polishing process for a substrate to be polished, comprising the step of polishing the substrate to be polished with the polishing composition; and a process for manufacturing a substrate, comprising the step of ... 06/23/05 - 20050136806 - Apparatus for polishing a semiconductor wafer and method therefor An apparatus for polishing a wafer comprises a supporting portion having an abrasive pad disposed thereon, and a polishing head disposed over the abrasive pad. The polishing head comprises a carrier having at least two fluid passages, a retainer ring disposed on a lower edge of the carrier, forming a ... 06/23/05 - 20050136805 - Polishing solution and method of polishing nonferrous metal materials A polishing solution, comprising copper ions and chloride ions in Cu/Cl molar ratio of 10−1 to 103 and at pH 0.5 to 10, is suited for polishing a surface composed of a nonferrous metal material such as copper or copper alloy. Thicker metal film can be polished at high removal ... 06/23/05 - 20050136804 - Method for polishing workpiece, polishing apparatus and method for manufacturing semiconductor device A region free of groove is provided in a central portion of a polishing pad, and a region having grooves formed thereon is provided on the outer portion thereof. A retainer ring surrounds and sustains a circumference portion of the wafer, and a part that tends to provide higher polishing ... 06/23/05 - 20050136803 - Polishing composition and polishing method A polishing composition of the present invention contains silicon dioxide, an acid, and water. Silicon dioxide is, for example, colloidal silica, fumed silica, or precipitated silica. The acid is, for example, hydrochloric acid, phosphoric acid, sulfuric acid, phosphonic acid, nitric acid, phosphinic acid, boric acid, acetic acid, itaconic acid, succinic ... 06/16/05 - 20050130566 - Slurry distributor for chemical mechanical polishing apparatus and method of using the same A polishing apparatus (100) is provided for polishing a substrate (102) that has slurry distributor (125) which improves planarization uniformity. Generally, apparatus (100) includes: (i) platen (106) with polishing surface (110); (ii) head (116) adapted to hold substrate (102) against polishing surface; (iii) mechanism to rotate platen (106) during polishing; ... 06/09/05 - 20050124264 - Double side polishing device for wafer and double side polishing method The present invention provides a wafer double-side polishing apparatus comprising at least a carrier plate having wafer holding holes; upper and lower turn tables to which polishing pads are attached; and a slurry supply means; with wafers held in the wafer holding holes, the carrier plate being moved between the ... 06/02/05 - 20050118935 - Substrate holding apparatus The present invention relates to a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against a polishing surface. The substrate holding apparatus comprises a top ring body for holding a substrate, an elastic pad for being brought into contact with the substrate, and a ... 06/02/05 - 20050118934 - Method for shaping air bearing surface of magnetic head slider and manufacturing method of magnetic head slider A method for shaping an ABS of a magnetic head slider includes including a step of holding at least one row bar with a plurality of aligned thin-film magnetic head elements by adhering a first surface of the at least one row bar to an adhesive or UV tape capable ... 06/02/05 - 20050118933 - Wafer polishing method A wafer polishing method which can prevent polishing swarfs from entering the gap between the periphery of a wafer and a protective tape when the back surface of the wafer is dry polished with a polishing pad after the protective tape is affixed onto the front surface of the wafer, ... 06/02/05 - 20050118932 - Adjustable gap chemical mechanical polishing method and apparatus A polishing apparatus for polishing a surface of wafer is provided. The apparatus includes a carrier to hold the workpiece. An array of fluid nozzles are placed across from the surface of the wafer to provide a gap between the nozzles and the surface of the workpiece. A polishing pad ... ### FreshPatents.com Support |