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Abrading > Abrading Process > Utilizing Fluent Abradant Utilizing Fluent AbradantUtilizing Fluent Abradant patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.04/05/07 - 20070077864 - Scratch removal device and method A polishing wheel including a lower polishing surface and defining a different color from a secondary portion of the polishing wheel, so as to indicate wear of the polishing surface. The polishing surface includes a plurality of main radial flutes extending from a central passage to an outer edge. A ... 03/08/07 - 20070054600 - Polishing pad, method of producing same and method of polishing A polishing pad has a resin sheet having a flat surface and abrading particles fixed inside and on the surface of this resin sheet. Its tensile strength is in the range of 30MPa or greater and 70 MPa or less and preferably in the range of 40MPa or greater and ... 03/01/07 - 20070049178 - Method and apparatus for fluid polishing In a fluid polishing method for processing a fine aperture by slurry 7, the slurry is supplied from a cylinder 2a in a slurry flow rate target process until the flow rate increases to a target value of a slurry feed flow rate. When the flow rate reaches the target ... 03/01/07 - 20070049177 - Method and apparatus for removing material from microfeature workpieces Methods and apparatus for removing materials from microfeature workpieces. One embodiment of a subpad in accordance with the invention comprises a matrix having a first surface configured to support a polishing medium and a second surface opposite the first surface. The subpad in this embodiment further includes a hydro-control agent ... 11/02/06 - 20060246825 - Method for smoothing the surface of a gas turbine blade A surface of the gas turbine blade is smoothed by way of a drag finish process. A first ring-shaped container is filled with a liquid abrasive medium. A second container which is arranged next to the first container is filled with a second liquid abrasive medium. A pivoting arm is ... 10/19/06 - 20060234606 - Device and method for surface machining a workpiece The invention relates to an apparatus and a method for surface machining. The apparatus for surface machining a workpiece, i.e., for abrasive flow machining, has at least two opposite pressure devices, such that the workpiece to be machined is arranged between the opposite pressure devices and an abrasive can be ... 09/14/06 - 20060205325 - Material for purification of semiconductor polishing slurry, module for purification of semiconductor polishing slurry and process for producing semiconductor polishing slurry A material for purification of a semiconductor polishing slurry that without changing of pH value, is capable of efficiently purifying a polishing slurry to thereby not only prevent metal contamination of a polished object as effectively as possible but also achieve recycling of a polishing slurry without any problem; a ... 06/22/06 - 20060135045 - Polishing compositions for reducing erosion in semiconductor wafers The aqueous polishing composition is useful for polishing semiconductor substrates. The polishing solution comprises 0.001 to 2 wt % of a polyvinylalcohol copolymer, the polyvinylalcohol copolymer having a first component, a second component and a weight average molecular weight of 1,000 to 1,000,000 grams/mole, and the first component being 50 ... 06/08/06 - 20060121833 - Linear motion apparatus and method for manufacturing thereof A linear motion apparatus has a guide shaft including a spiral-shaped or linear-shaped rolling element rolling groove, a movable body including a spiral-shaped or linear-shaped rolling element rolling groove opposed to the rolling element rolling groove of the guide shaft, a large number of rolling elements rollably moving along a ... 05/18/06 - 20060105682 - System and method for monitoring and/or controlling a flow of a media Some embodiments of the invention relate to a system and method for enhanced monitoring and/or controlling a flow of a media. For example, the flow of the media may be controlled and/or monitored over an enhanced range of flow rates; control over the flow of the media may be highly ... 03/09/06 - 20060052039 - Method of and apparatus for magnetic-abrasive machining of wafers A method of magnetic-abrasive machining of parts has the steps of supporting a part, generating a magnetic field by magnetic means located at one side of the part, placing a magnetic-abrasive powder on a surface located at another, opposite side of the part, so that the magnetic-abrasive powder is attracted ... 02/02/06 - 20060025054 - Systems and methods for actuating end effectors to condition polishing pads used for polishing microfeature workpieces Systems and methods for activating end effectors used to condition microfeature workpiece polishing pads are disclosed. A system in accordance with one embodiment of the invention includes a rotatable end effector having a conditioning surface configured to condition a microfeature workpiece polishing medium, and a driver coupled to the end ... 02/02/06 - 20060025053 - Method for fabricating a magnetic transducer using a slurry with spherical particles for cmp-assisted photoresist lift-off A method is described which uses a CMP slurry with an abrasive of spherical particles to lift-off photoresist used in the patterning of the sensor for a magnetic transducer. The spherical particles are preferably silica, alumina, titania or zirconia with colloidal silica being preferred. The size of the particle is ... 01/26/06 - 20060019580 - Apparatus for removing material, use of gas inclusions in an abrasive liquid and process for grinding and/or polishing surfaces The invention relates to an apparatus for removing material from a surface of a workpiece during grinding and/or polishing of the surface by means of abrasive particles which are delivered by a liquid. The apparatus comprises a device for setting the gas content in the liquid, in particular for adding ... 01/19/06 - 20060014477 - Polishing pad with flow modifying groove network A polishing pad (20) for polishing a wafer (32) or other article, the pad having a groove network (60) configured to vary the residence time across the wafer track of the reaction products formed by the interaction of reactants in the polishing medium (46) with structure on the wafer. The ... 12/29/05 - 20050287930 - Uninterrupted abrasive fluid supply A substantially uninterrupted flow of a pressurised abrasive slurry is maintained by successively charging each of a plurality of vessels V1, V2 with an abrasive material while discharging an abrasive slurry from another of the vessels at a common outlet 2. The vessels connect to the common outlet via respective ... 12/22/05 - 20050282470 - Continuous contour polishing of a multi-material surface A chemical-mechanical polishing pad, and method of polishing a substrate using a polishing pad, comprising (a) a resilient subpad, and (b) a polymeric polishing film substantially coextensive with the resilient subpad, wherein the polymeric polishing film comprises (i) a polishing surface that is substantially free of bound abrasive particles, and ... 12/01/05 - 20050266776 - Polishing pad with oscillating path groove network A polishing pad (20) for polishing a wafer (32) or other article, the pad having a groove network (60) configured to increase the residence time polishing medium (46) on the pad. The groove network has a first portion (72) that may extend substantially radially outwardly and an oscillating portion (74) ... 11/17/05 - 20050255794 - Polishing pad An improved polishing pad for polishing semi-conductors and other planar substrates in the presence of a slurry which optionally may contain abrasive particles is disclosed. The polishing pad comprises a non-woven fibrous component, a portion which may optionally comprise bicomponent fibers, optionally embedded within a polymer matrix component. ... 09/29/05 - 20050215180 - Semiconductor device fabrication method The method for fabricating a semiconductor device comprises the step of planarizing the surface of a film-to-be-polished formed over a semiconductor substrate by polishing, with a polishing pad 104 formed of a foam with a plurality of cells 107 incorporated in a base material 105 thereof, the surface being polished ... 08/25/05 - 20050186889 - Wheel polishing device A device for finishing workpieces, such as automobile wheels. The device includes a bowl assembly containing polishing media therein, and a drive assembly including a rotatable turret which carries the wheels thereon so that same are orbitally driven through the polishing media. A cam arrangement is provided which essentially continuously ... 08/25/05 - 20050186888 - Method and apparatus for abrasive recycling and waste separation system The present invention provides a method of handling abrasive solids materials used in an abrasive cutting procedure which jets a high-pressure abrasive slurry through a nozzle (7) onto a work piece over and/or in a catcher tank (8). This handling method includes catching the used abrasive slurry together with work ... 08/11/05 - 20050176352 - System, device and method for cutting steel plate A system for cutting steel plate, in particular for cutting the bottom and/or the wall of an oil storage tank, comprising a hydraulic or pneumatic pump and a movable cutting device comprising a hydraulic or pneumatic motor for moving the cutting device, wherein the pump and the motor are hydraulically ... 07/28/05 - 20050164609 - Reducing wafer defects from chemical mechanical polishing Tantalum barrier layer chemical mechanical polishing may be improved by using suitably aged slurries. Slurries that are older than fifty days from their manufacture date result in significantly lower occurrences of defects. ... 06/23/05 - 20050136802 - Polishing method In a method for the machine polishing of workpieces, the workpiece is immersed into a container filled with abrasive and is moved relative to the abrasive container. The workpiece is here moved up and down in the vertical direction, rotated about its own central axis and moved with its central ... 06/02/05 - 20050118931 - Method and apparatus for measuring flow rate through and polishing a workpiece orifice A method and apparatus for comparing the flow rate through an orifice within a master part with the orifice within a workpiece by subjecting each orifice to an identical fluid at an identical temperature, under an identical pressure, and comparing the downstream pressures of the fluid exiting these orifices when ... ### FreshPatents.com Support |