REGISTER now for FREE 
|
FREE patent keyword monitoring and additional FREE benefits. REGISTER now for FREE
|
|
|
Abrading > Precision Device Or Process - Or With Condition Responsive Control > With Feeding Of Tool Or Work Holder With Feeding Of Tool Or Work HolderWith Feeding Of Tool Or Work Holder patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.04/12/07 - 20070082585 - On-line grinding method for work roll An on-line roll grinding method for a work roll, which can decrease an overshoot, by which the pressing load of a rotating grinding wheel on a work roll exceeds a set grinding pressing load, is provided. This method is an on-line grinding method for a work roll, adapted to press ... 04/12/07 - 20070082584 - Grinding method A method of grinding the outer circumferential surface of a workpiece 5 formed of a hard and brittle material into a predetermined shape using a grinding wheel while rotating the workpiece 5 is disclosed. The method includes plunge grinding the workpiece 5 at an arbitrary portion (plunge ground portion 21) ... 04/05/07 - 20070077863 - Spectacle-lens edging machine The invention relates to a grinding machine for the edges of spectacles lenses, comprising at least one grindstone and one driven shaft for holding the spectacles lenses, said shaft being able to move radially and axially relatively to the grindstone. The inventive grinding machine comprises at least one operational support ... 03/29/07 - 20070072518 - Grinding machine A grinding machine, which includes a grinding wheel rotatable by a motor, a first slide movable in X-axis direction, a second slide supported on the first slide and movable in Y-direction, a bracket supported on the second slide and turnable about Y-axis, a tool holder supported on the bracket for ... 03/01/07 - 20070049175 - Diamond tool blade with circular cutting edge An apparatus for turning a hard and/or brittle material includes a precision workpiece spindle, a workpiece support, a hard and/or brittle workpiece rigidly coupled to the workpiece support, and a diamond tool blade rigidly coupled to a spin-turner mechanism. The diamond tool blade is formed to include a cutting edge ... 03/01/07 - 20070049174 - Apparatus for screw-polishing with abrasive and method thereof The present invention is applied in the fields of precise transmission devices, bio-medical devices and military-used devices to polish a surface of an object by an abrasive carried by the rotating of a screw. ... 02/22/07 - 20070042683 - Optical fiber polishing and finishing system, device and method A method, device and system for polishing and/or finishing one or more optical fibers. The method comprising securing an optical fiber connector to at least one holder, generating a tilting motion at the end of the optical fiber, adjusting the tilting motion of the optical fiber to create the desired ... 02/15/07 - 20070037489 - Centerless grinder A centerless grinder for grinding an elongated workpiece includes a grinding wheel having a working surface with a plurality of raised areas extending circumferentially around at least a portion of the working surface. A platform is provided having an elongated top surface for supporting the workpiece substantially adjacent to the ... 01/11/07 - 20070010172 - Enhanced end effector arm arrangement for cmp pad conditioning A CMP conditioning apparatus enhanced end effector arm for improving the reliability of the apparatus and the quality of the conditioning and polishing operations includes a conditioner head with features that provide for simplified alignment/attachment of a conditioning disk to the arm, while also providing a “quick release” mechanism for ... 01/11/07 - 20070010171 - Superfinishing machine and method A superfinishing system and method, wherein an abrasive is employed to process a workpiece, and wherein the system simultaneously mounts a plurality of workpieces in a diagonal turret, or mounts a plurality of different types of workpieces in a plurality of chucks for different operations thereon, or performs a plurality ... 01/04/07 - 20070004321 - Systems and methods for mechanical and/or chemical-mechanical polishing of microfeature workpieces Systems and methods for polishing microfeature workpieces. In one embodiment, a method includes determining a status of a characteristic of a microfeature workpiece and moving a carrier head and/or a polishing pad relative to the other to rub the microfeature workpiece against the polishing pad after determining the status of ... 01/04/07 - 20070004320 - Grinding machine A grinding machine (3) for grinding drill bits (6), having a grinding unit (9) which includes a motor unit (10) and a spindle (11) which is driven by the motor and which carries a grinding wheel (12) for rotation by the spindle (11) and for grinding a button bit (8) ... 12/28/06 - 20060292967 - Polishing apparatus A polishing apparatus has a top ring (1) configured to hold a semiconductor wafer (W) on a substrate holding surface and a pushser (130) configured to deliver the semiconductor wafer (W) to the top ring (1) and receive the semiconductor wafer (W) from the top ring (1). The pushser (130) ... 11/23/06 - 20060264156 - Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers that are transferred to different positions about a polishing pad to polish at least one semiconductor wafer while another semiconductor wafer is being loaded onto or unloaded from one of the wafer carriers. The ... 11/16/06 - 20060258266 - Apparatus and article for polishing gemstones Disclosed is an apparatus for working gemstones. The apparatus comprises an abrading article and a rotatable support with a guiding feature for holding and rotating the article. The abrading article has a mounting bore substantially larger than the guiding feature. A balancing arrangement facilitates balancing of the article, and an ... 11/09/06 - 20060252353 - Rotary jig A jig intended in use to hold a series of blanks of rod-like or wire-like form during machining, the jig having a body adapted to be mounted to a drive shaft for rotation of the body about an axis of rotation, the body having a perimeter which on rotation of ... 10/19/06 - 20060234603 - Attitude control device and precision machining apparatus An attitude control device and a precision machining apparatus capable of accurately controlling the attitude of an object mounted on the attitude control device according to grinding stages. The attitude control device is constituted by a first flat-plate member 21 and a second flat-plate member 22 disposed in parallel with ... 10/12/06 - 20060228997 - Apparatus for polishing edge surface of glass substrate for magnetic recording media, and process for producing glass substrate To provide an apparatus for polishing an edge surface of a glass substrate for magnetic recording media and a process for producing a glass substrate for magnetic recording media, whereby with respect to a glass substrate to be used as a substrate for a hard disk, the quality and productivity ... 10/12/06 - 20060228996 - Lapping system with mutually stabilized lapping carriers A lapping system for eliminating crowning in a surface to be lapped includes a first lapping carrier adapted to carry a first workpiece and a second lapping carrier adapted to carry a second workpiece. A stabilizer assembly interconnects the first and second lapping carriers in a mutually stabilizing arrangement that ... 10/05/06 - 20060223421 - Polishing apparatus The polishing apparatus is capable of transferring a work piece to a top ring without moving the work piece from the center and capable of precisely polishing the work piece. The polishing apparatus has a transfer unit for transferring the work piece to the top ring. The transfer unit comprises: ... 10/05/06 - 20060223420 - Shaping apparatus A shaping apparatus for shaping a flotation core includes a worktable. At least one support is adjustably mounted on the worktable to be adjustable at least along a z-axis and configured to support the core. At least one engagement mechanism is mounted on the worktable and is displaceable relative to ... 09/21/06 - 20060211338 - Method for removing material from a semiconductor wafer The invention relates to a method for removing material from a semiconductor wafer by machining, in which a semiconductor wafer held on a wafer holder and a grinding wheel lying opposite it are rotated independently of one another, the grinding wheel being arranged laterally offset with respect to the semiconductor ... 09/21/06 - 20060211337 - Machining apparatus and method to machine surfaces in recesses of workpieces In a machining apparatus to machine surfaces in recesses of workpieces, especially tools with flutes and cutting edges, such as twist drills, milling heads, reamers, and similar, the machining apparatus has a circular disk-shaped or frustum-shaped machining body with a symmetrical and rotational axis which is seated in a bearing ... 07/13/06 - 20060154571 - Grinding machines for depression patterns along roads In certain preferred embodiments, the present invention provides a grinding machine for creating depression patterns in a surface such as asphalt or concrete. The depression pattern may be a rumble strip for alerting drivers who drift off a driving lane, or may be for other uses. Use of a depression ... 06/22/06 - 20060135044 - Grinding machine In a cylindrical grinding machine for grinding a rotating cylindrical workpiece with a rotating grinding wheel, a wheel spindle for supporting the grinding wheel is divided at its axial mid portion into first and second spindle components, and respective ends on the sides opposite to the axial mid portion of ... 06/22/06 - 20060135043 - Grinding method and grinding machine In a grinding machine, a generally cylindrical workpiece having at least first and second grinding areas is ground by use of a grinding wheel supported by a wheel head. The first grinding area is first ground such that power consumed by the grinding machine is maintained at a first level. ... 06/15/06 - 20060128274 - Process and device for grinding a profile of a workpiece On a device for grinding the profile of a rotating workpiece (5), the rotating workpiece (5), arranged on a swivel table (6) for axial and transverse displacement with reference to the work spindle (4), is according to the invention positioned prior to grinding and relative to a swivel table axis ... 06/08/06 - 20060121832 - Pressure feed grinding of amlcd substrate edges The present invention is directed to an apparatus for grinding or polishing at least one edge of a glass substrate. The apparatus includes an air bearing support member configured to pivot about an axis of rotation with zero frictional resistance opposing said pivotal movement. A grinding unit is coupled to ... 06/08/06 - 20060121831 - Grinding table for liquid crystal display panel and grinder apparatus using the same Disclosed is a grinding table apparatus for a liquid crystal display panel and a grinder using the adapt to various sizes of unit liquid crystal display panels for grinding edges of the corresponding liquid crystal display panel by adjusting a variable moving distance of the grinding tables instead of replacing ... 06/08/06 - 20060121830 - Grinding method of crank pin and grinding machine A grinding method of a crank pin that grinds an outer circumferential surface of the crank pin of a crankshaft having a crank journal and the crank pin eccentric to the crank journal by rotating a crankshaft around a central axis (a center of the journal) of the crank journal ... 06/01/06 - 20060116052 - Workpiece grinding method In a workpiece grinding method, a grinding allowance of a predetermined width (T) at at least an end surface portion 21 of a workpiece W is removed with a grinding wheel 10 (or 32) by rotating the workpiece W having a cylindrical portion 20 and the end surface portion 21 ... 05/25/06 - 20060111021 - Semiconductor wafer grinder A grinder designed to provide an automatic grinding operation for the manufacture of a semiconductor device wafer. The grinder includes a base, a rotatable index table mounted to the base, and a grinding wheel assembly including a grinding wheel for grinding a flat surface on the wafer. The index table ... 05/25/06 - 20060111020 - Crankshaft and camshaft grinder An apparatus for grinding a surface of a nonstraight elongated workpiece has a frame, drives on the frame for rotating the workpiece about a longitudinal workpiece axis, and a guide defining a pivot axis offset from the workpiece axis on the frame. A hanging arm has an inner end juxtaposable ... 05/18/06 - 20060105680 - Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers that are transferred to different positions about a polishing pad to polish at least one semiconductor wafer while another semiconductor wafer is being loaded onto or unloaded from one of the wafer carriers. The ... 05/11/06 - 20060099887 - Grinding jig set and grinding method A grinding jig set comprising a combination of several jig units and a method for grinding a number of objects are provided. The method comprises a series of steps from arranging the objects to be ground on a grinding jig (a master plate) through removing the ground objects from the ... 04/27/06 - 20060089088 - Holding apparatus for an optical element Holding apparatus for an optical element In a holding apparatus (1) for an optical element (2) that holds the optical element during an abrasive processing of the latter, the optical element (2) is in contact with a pressure piece (9) that is adapted to a force distribution to be expected ... 04/27/06 - 20060089087 - Honing installation with several work stations A honing installation for honing workpieces comprises a plurality of work stations, each work station being configured for performing at least one working step on a workpiece and at least part of the work station is set up as a honing station for performing at least one honing operation on ... 03/16/06 - 20060057941 - Machine for machining elongate workpieces provided with cutting teeth, in particular for grinding bandsaw blades furthermore the workpiece-guiding device guiding the workpiece (14) along a predetermined guide path to bring about the desired position by means of the feed device (38), and the workpiece-fixing device (42) fixing the workpiece on reaching the desired position, there is provided a common central machine block (18), on which ... 03/09/06 - 20060052038 - Machine for superfinishing by honing A honing machine for super finishing workpieces, e.g. by honing using a tool spindle (7), can be rotatably driven and can receive a tool. A motor rotates the tool spindle, the tool spindle (12) being arranged on a carriage (12), which can be displaced on a machine frame (16), by ... 12/08/05 - 20050272348 - Polishing pad assembly, apparatus for polishing a wafer including the polishing pad assembly and method for polishing a wafer using the polishing pad assembly An apparatus for polishing a wafer is provided. The apparatus comprises a polishing pad for polishing the wafer. The polishing pad is divided into multiple portions that are rotated in a substantially same direction. At least one of the portions of the polishing pad is adapted to rotate at a ... 12/01/05 - 20050266774 - Variable rate method of machining gears A method of machining gears or other toothed articles wherein the workpiece feed rate and/or the tool shifting is varied so as to produce an irregular surface pattern on tooth surfaces with a resulting reduction in mesh noise. The method is particularly applicable to grinding spur and/or helical gears with ... 11/24/05 - 20050260927 - Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces Carrier assemblies, planarizing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, the carrier assembly includes a head having a chamber, a magnetic field source carried by the head, and a fluid with magnetic elements in the chamber. The ... 11/24/05 - 20050260926 - Method and device for grinding the outside and inside of a rotationally symmetric machine part comprising a longtudinal borehole A machine part with a conical effective surface, which is machined by means of a device comprising a machine bed, a longitudinally movable grinding bench, and a workpiece spindle head that clamps the machine part by means of clamping jaws via a chuck. The conical effective surface of the machine ... 11/17/05 - 20050255793 - Method and device for grinding a rotationally symmetric machine part Disclosed are a method and a device for grinding a machine part (17) that comprises two shaft elements (18, 19) and a central element (20) having a significantly increased diameter (D). The central element (20) is provided with an effective surface (22), a portion of which is embodied in the ... 10/27/05 - 20050239378 - Apparatus and method for polishing a fiber optic connector A fiber optic polishing apparatus including a support system, a polishing sub-assembly coupled to the support system including a plurality of pads, and a fixture to hold a plurality of fiber optic connectors. The fixture is positioned adjacent to the plurality of pads so that an end surface of each ... 10/27/05 - 20050239377 - Portable sharpening system for a dual-knife cutting machine A grinding apparatus (36) for a paper cutting mechanism (10) is shown and includes a coupler (38), for mounting on an upper rail (14) of the cutting mechanism (10), a motor-driven grinder (40), and an adjustable support (42) for adjustably positioning the motor-driven grinder (40) in the direction of the ... 10/27/05 - 20050239376 - Method and device for grinding a rotating roller using an elastic steady-rest support The invention relates to a device for grinding rollers, also for grinding hollow rollers. As the rollers tend to vibrate transversally as a result of the contact with the grinding disc, a cushioned body is applied to the opposite side of the roller from the grinding disc, said body being ... 10/13/05 - 20050227588 - Drive unit for horizontally turning rotational solid Disclosed is a drive unit for a rotational solid (2) which revolves around the essentially horizontal longitudinal axis (3) thereof. Said drive unit is arranged laterally below the rotational solid (2) such that the driving pinion/s (4, 4′) engage/s in the toothed ring (6) of the rotational solid (3) in ... 10/06/05 - 20050221721 - Method and apparatus for grinding and polishing free-form ophthalmic surfaces A system for polishing and grinding optical surfaces is provides by employing a pad surface that is controllably moved over an affected surface in accordance with control procedures to facilitate a desired surface contour. The system does not require multiple hard master shapes for each desired surface contour but rather ... 09/22/05 - 20050208880 - Substrate holding apparatus A substrate holding apparatus can accurately control temperature of a substrate in a direct manner with a relatively simple arrangement. The substrate holding apparatus has a top ring configured to hold a substrate to be polished and press the substrate against a polishing surface and an air bag attached to ... 09/15/05 - 20050202757 - Device for the simultaneous double-side grinding of a workpiece in wafer form A device for the simultaneous double-side grinding of workpiece wafers has two collinear grinding wheels and two hydropads oppositely positioned for hydrostatic bearing of the workpiece, each having at least one hydrostatic bearing and at least one dynamic pressure tube for measuring the spacing between the workpiece and the hydrdopads. ... 09/08/05 - 20050197049 - Grinding machine The grinding machine (10) according to the invention serves in particular for the machining or production of tools. It comprises a machine bed 11 and a workpiece spindle (14) arranged thereon, which receives the workpiece (13) to be machined, as well as a grinding station (19) arranged next to the ... 08/18/05 - 20050181707 - Pneumatically actuated flexible coupling end effectors for lapping/polishing Methods and apparatus for end effectors for performing surface lapping using a robotic system are provided. In one embodiment, a lapping system includes a robotic arm and a pneumatic end effector unit. The pneumatic end effector unit includes a first base attached to the robotic arm, a second base, a ... 08/11/05 - 20050176350 - Semiconductor wafer grinder A grinder designed to provide an automatic grinding operation for the manufacture of a semiconductor device wafer. The grinder includes a base, a rotatable index table mounted to the base, and a grinding wheel assembly including a grinding wheel for grinding a flat surface on the wafer. The index table ... 08/04/05 - 20050170753 - Method and device for producing gear plates for a continuously variable gearbox The invention relates to a method for producing gear plates (1) for a continuously variable gearbox wherein at least two gear plates (1) with the transmission surfaces (2) thereof are arranged in an opposite mauler. When the gearbox is in operation, said transmission surfaces come into contact in a non-positive ... 07/21/05 - 20050159082 - Polishing apparatus A polishing apparatus is used for polishing a workpiece such as a semiconductor wafer to a flat mirror finish. The polishing apparatus comprises a turntable having a polishing surface, a top ring for holding a workpiece and pressing the workpiece against the polishing surface to polish the workpiece, at least ... 07/21/05 - 20050159081 - Methods, systems and computer program products for dynamically controlling a semiconductor dicing saw A saw cutting pattern is dynamically established for a semiconductor dicing saw based on detection of the saw blade contacting a wafer or a portion of a wafer. The dynamic cutting pattern may terminate cuts if the saw blade no longer contacts the wafer or a portion of a wafer. ... 07/07/05 - 20050148288 - Centerless grinder A centerless grinder for grinding an elongated workpiece includes a grinding wheel having a working surface with a plurality of raised areas extending circumferentially around at least a portion of the working surface. A platform is provided having an elongated top surface for supporting the workpiece substantially adjacent to the ... 06/16/05 - 20050130563 - Machine for machining long workpieces provided with cutting teeth, particularly for grinding endless saw blades In a machine (10) for machining long workpieces (32) provided with cutting teeth (60), particularly for grinding endless saw blades, having a machine base (40) and a machining device (12) which has a rotatably drivable tool (16), particularly a grinding wheel, for machining the workpiece (62), the machining device (12) ... ### FreshPatents.com Support |