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Abrading > Precision Device Or Process - Or With Condition Responsive Control > With Indicating With IndicatingWith Indicating patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.04/12/07 - 20070082583 - Head for a robot ar intended to perform a deflashing or rouging operation The invention relates to a head for a robot arm, which is intended to perform a deflashing or carding operation. The inventive head comprises: a plate which is fixed to the arm of the robot; a shaft which is mounted to the plate in parallel therewith; a support for a ... 03/01/07 - 20070049173 - Process, apparatus and slurry for wire sawing A wire saw (1; 100) for cutting a workpiece includes a device (21, 22, 24, 27) for setting, controlling and/or maintaining a predetermined or desired water content in at least part of the gaseous medium that contacts the slurry. With the wire saw according to the invention and the process ... 03/01/07 - 20070049172 - Apparatus and method for removing material from microfeature workpieces Machines and systems for removing materials from microfeature workpieces using fixed-abrasive mediums. One embodiment of a method for removing material from a microfeature workpiece comprises rubbing the workpiece against a surface of a fixed-abrasive medium having a matrix and abrasive particles attached to the matrix, and sensing a parameter indicative ... 03/01/07 - 20070049171 - Flexible cnc belt grinding machine A belt grinding machine is disclosed that includes an automatic pressure and position control systems for robotic grinding and polishing applications. The machine will be combined with off-line programming package, capable of carrying out complicated operations that cannot be performed on traditional types of machines. The multiple contact wheels of ... 02/08/07 - 20070032172 - Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods Polishing liquids for activating and/or conditioning fixed abrasive polishing pads, and associated systems and methods are disclosed. A method in accordance with one embodiment of the invention includes disposing a polishing liquid on a polishing surface of a microfeature workpiece polishing pad. The polishing pad can include a matrix material ... 02/08/07 - 20070032171 - Methods and systems for conditioning planarizing pads used in planarizing susbstrates Monitoring the process of planarizing a workpiece, e.g., conditioning a CMP pad, can present some difficulties. Aspects of this invention provide methods and systems for monitoring and/or controlling such a planarization cycle. For example, a control system may monitor the proximity of a workpiece holder and an abrasion member by ... 02/01/07 - 20070026768 - Sharpening-trimming assembly The present invention relates to a sharpening-trimming assembly comprising a base, a casing mounted on said base, the casing having at least two insertion slots provided on the upper portion of the casing for receiving the tool to be sharpened, a moveable rod connecting the base to a engine by ... 01/25/07 - 20070021038 - Cmp apparatus and process sequence method A CMP apparatus and process sequence. The CMP apparatus includes multiple polishing pads or belts and an in-line metrology tool which is interposed between adjacent polishing pads or belts in the apparatus. A material layer on each of multiple wafers is successively polished on the polishing pads or belts. The ... 01/18/07 - 20070015443 - Semiconductor processor systems, systems configured to provide a semiconductor workpiece process fluid, semiconductor workpiece processing methods, methods of preparing semiconductor workpiece process fluid, and methods of delivering semiconductor workpie Semiconductor processor systems, systems configured to provide a semiconductor workpiece process fluid, semiconductor workpiece processing methods, methods of preparing semiconductor workpiece process fluid, and methods of delivering semiconductor workpiece process fluid to a semiconductor processor are provided. One aspect of the invention provides a semiconductor processor system including a process ... 01/18/07 - 20070015442 - Method and apparatus for measuring abrasion amount and pad friction force of polishing pad using thickness change of slurry film A method and apparatus for measuring an abrasion amount and a friction force of a polishing pad using a thickness change of a slurry film in a chemical mechanical polishing operation are provided. In a preferred method, for example, a first displacement of a semiconductor wafer with respect to a ... 01/04/07 - 20070004319 - Tire uniformity machine grinding assembly A grinder assembly (10) contacts a tire (T) supported by a frame (F) relative to the tire (T). The grinder assembly (10) includes at least one section, and a vertical repositioning system (118) supporting the at least one section. The vertical repositioning system (118) enables the at least one section ... 01/04/07 - 20070004318 - Free curved surface precision machining tool A free curved surface precision machining tool for precision-machining a surface to be machined with the lower end in contact therewith by rotation around an axis x. It includes a drum-shaped tool having a rotation axis x orthogonal to the axis z and rotationally driven around the rotation axis x. ... 12/14/06 - 20060281392 - Lens edger A lens edger which is capable of measuring the curvature of an eyeglass lens is disclosed. The lens edger includes a carriage which rotatably fixes a pair of lens fixing shafts and moves the position of the lens fixing shafts clamping a lens to be processed; a lens rotation motor ... 12/07/06 - 20060276107 - Method for processing and measuring rotationally symmetric workpieces as well as grinding and polishing tool A method for processing a rotationally symmetric workpiece, preferably having optically effective surfaces, whose symmetry axis is aligned parallel with the z-axis and which is moveable parallel with the z-axis, using a rotating, rotationally symmetric grinding or polishing tool whose rotation axis is aligned parallel with the y-axis and which ... 11/30/06 - 20060270323 - Polishing apparatus A polishing apparatus for polishing a substrate comprises a polishing table having a polishing surface, and a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against the polishing surface. The substrate holding apparatus comprises a vertically movable top ring body for holding a substrate, ... 11/30/06 - 20060270322 - Smart conditioner rinse station A method and apparatus for monitoring polishing pad conditioning mechanisms is provided. In one embodiment, a semiconductor substrate polishing system includes a rinse station, a polishing surface, a conditioning element, and a conditioning mechanism. The conditioning mechanism selectively positions the conditioning element over the polishing surface and over the rinse ... 11/23/06 - 20060264155 - Method and apparatus using a sensor for finish-machining teeth Teeth of a workpiece of a workpiece are finish-machined by first gauging shapes of the workpiece teeth and generating actual-value signals corresponding thereto. These actual-value signals are compared to set points representing desired tooth shapes, and the teeth of the workpiece are meshed with abrasive teeth of a honing tool ... 11/09/06 - 20060252352 - Method of monitoring surface status and life of pad by detecting temperature of polishing interface during chemical mechanical process A method of monitoring surface status and life of a pad by detecting temperature of a polishing interface during a CMP process. The method include the steps of preparing and placing a brand-new pad under an artificially controlled environment for several CMP tests until termination of its operational life to ... 11/09/06 - 20060252351 - Wafer carrier checker and method of using same A tool and method for assessing whether a disk carrier, and especially a carrier for holding semiconductor disks, is properly dimensioned. The tool has a body that includes a socket in which a portion of the disk carrier will seat fully if the disk carrier is properly dimensioned. Alignment structures ... 10/05/06 - 20060223419 - Height comparator A device is provided for measuring the centre of a grinding wheel for use in setting the height of a skate blade. The device has a base, a support extending from the base, a slider block slidable along the neck between the base and a head block secured to an ... 09/28/06 - 20060217039 - Polishing apparatus and method of polishing work piece The polishing apparatus is capable of changing a pH value of slurry to adjust polishing rate and polishing a work piece with high flatness. The polishing apparatus comprises: a pressure vessel; a polishing plate provided in the pressure vessel; a pressing plate pressing a work piece onto the polishing plate; ... 09/07/06 - 20060199474 - Systems including differential pressure application apparatus A differential pressure application apparatus is configured to apply different amounts of pressure to different locations of a substrate, such as a semiconductor device structure. The apparatus may be used during polishing or planarization processes. The apparatus includes physically discrete pressurization structures that may be moved independently from one another. ... 09/07/06 - 20060199473 - Polishing pad, process for producing the same and method of polishing therewith Provided is a polishing pad comprising a fiber including organic fiber and a matrix resin holding the fiber, wherein at least the organic fiber is exposed on the work material-side surface thereof at least after dressing. The polishing pad suppresses generation of minute polishing scratches on the work material and ... 08/31/06 - 20060194514 - Jet singulation Techniques for singulating a substrate into a plurality of component parts is disclosed. The singulation techniques include generating a jet stream in order to cut through large components so as to produce smaller components. The techniques are particularly suitable for singulating surface mount devices such as chip scale packages, ball ... 08/31/06 - 20060194513 - Workpiece headstock to align the clamping device (7), the alignment control unit (21) operates the actuating drive (19) as a function of the measurement values provided by the sensor arrangement (20) and thus cooperates with the actuating drive (19) and the sensor arrangement (20) to form a closed-loop control circuit. ... 08/10/06 - 20060178087 - Hand-held electric machine tool comprising a dust collection container and a level indicator An electric hand-held power tool is described that has a machine housing (11) with an integral dust-ejection connection (15) and a dust collection container (16) attached thereto. To ensure, when working with the electric hand-held power tool, that the dust collection container (16) is emptied in time when full, a ... 07/20/06 - 20060160470 - Methods and apparatuses for analyzing and controlling performance parameters in mechanical and chemical-mechanical planarization of microelectronic substrates Methods and apparatuses for analyzing and controlling performance parameters in planarization of microelectronic substrates. In one embodiment, a planarizing machine for mechanical or chemical-mechanical planarization includes a table, a planarizing pad on the table, a carrier assembly, and an array of force sensors embedded in at least one of the ... 07/13/06 - 20060154570 - Monitoring a metal layer during chemical mechanical polishing A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around ... 07/13/06 - 20060154569 - Platen assembly utilizing magnetic slip ring Embodiments of the present invention generally relate to an apparatus for processing a substrate and more specifically to a device that will transfer electrical power and/or control signals between a stationary base and a rotating platen without involving mechanical contact. The device does not suffer the drawbacks of conventional slip ... 07/06/06 - 20060148382 - Polishing apparatus A polishing apparatus has a polishing table (12) with a polishing surface (10) attached thereon, and a top ring (20) for pressing a workpiece (W) against the polishing surface (10). The top ring (20) has a housing (40) and a retainer ring (44) vertically movable in the housing (40) for ... 04/27/06 - 20060089086 - Working device and method for working a stack of plate-shaped elements A working station for working vertical edges of a stack (9) of plate-shaped elements (10). The working station comprises a support (11) for supporting the stack (9) and a number of working devices (1, 2, 3, 4) that are each configured for being able to slide towards and away from ... 04/06/06 - 20060073769 - Polishing method A polishing method includes the steps of: (a) polishing a to-be-polished object by moving an abrasive cloth relative to the to-be-polished object while pressing the to-be-polished object against the abrasive cloth; and (b) pressing a dressing member against the abrasive cloth moving relative to the to-be-polished object with the to-be-polished ... 03/30/06 - 20060068685 - In-line contiguous resistive lapping guide for magnetic sensors An in-line lapping guide uses a contiguous resistor in a cavity to separate a lithographically-defined sensor from the in-line lapping guide. As lapping proceeds through the cavity toward the sensor, the resistance across the sensor leads increases to a specific target, thereby indicating proximity to the sensor itself. The contiguous ... 03/23/06 - 20060063473 - Method for inspecting grinding wheels This invention discloses a method of evaluating the internal structure of a grinding wheel through ultrasonic inspection. ... 03/02/06 - 20060046619 - Polishing pad conditioner and monitoring method therefor A polishing pad conditioner for a chemical mechanical polishing apparatus and real-time monitoring method thereof. A conditioning head is supported for rotation at one end of a transverse beam. A drive assembly is coupled to the conditioning head to drive downward force to the conditioning head, and at least one ... 02/23/06 - 20060040589 - Double sided polishing machine Double-sided polishing machine with an upper and a lower working disc, each comprising a polishing disc and a carrier disc. The working disc are co-axially arranged and rotatable relative to each other, a polishing gap being formed between the polishing discs. Said workpieces are machined in the polishing gap. A ... 02/16/06 - 20060035565 - Grinding wheel monitoring A method of monitoring the wear of a grinding wheel comprises the steps of measuring the force exerted between the wheel and a workpiece, measured normal to the grinding face of the wheel at the point of contact between the wheel and workpiece, and generating a warning signal when the ... 01/26/06 - 20060019578 - Machining device According to a machining device for machining a conductive workpiece (W) by a conductive (T), when the tool (T) contacts the workpiece (W) in machining, there is formed a closed-circuit (C) connecting the tool (T), the workpiece (W), a brush (315), a conductor (311), a main spindle housing (12), a ... 01/12/06 - 20060009132 - Chemical mechanical polishing apparatus with non-conductive elements Conductive elements of a chemical mechanical polishing system may generate undesired eddy currents under the influence of a time-dependent magnetic field used in an eddy current monitoring system. To improve the accuracy of an eddy current monitoring system, elements that may contribute an undesired signal to the sensed eddy current ... 11/24/05 - 20050260925 - Polishing apparatus A polishing apparatus for polishing a substrate comprises a polishing table having a polishing surface, and a substrate holding apparatus for holding a substrate to be polished and pressing the substrate against the polishing surface. The substrate holding apparatus comprises a vertically movable top ring body for holding a substrate, ... 11/24/05 - 20050260924 - Pad break-in method for chemical mechanical polishing tool which polishes with ceria-based slurry A chemical mechanical polishing (CMP) method is disclosed in which a new polishing pad is broken-in and conditioned into a steady operating state while using a silica (SiO2) based CMP slurry and where the broken-in and conditioned pad is afterwards used for polishing patterned workpieces (e.g., semiconductor wafers) with a ... 11/17/05 - 20050255792 - Carrier assemblies, polishing machines including carrier assemblies, and methods for polishing micro-device workpieces Carrier assemblies, polishing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical polishing of micro-device workpieces are disclosed herein. In one embodiment, a carrier assembly includes a head having a chamber, a magnetic field source carried by the head, and a magnetic fluid in the chamber. The magnetic field ... 11/03/05 - 20050245172 - Dicing saw blade positioning apparatus and methods independent of blade thickness via constrained biasing elements An apparatus for positioning dicing saw blades at a fixed axial distance from one another independent of the thicknesses of the saw blades, where the saw blade thickness varies within a range. Flanges, spacers, and retention spacers may be employed to achieve desired spacing of dicing saw blades in the ... 10/27/05 - 20050239375 - Method for deciding a bevel curve, method for determining the locus of a bevel, method for processing a lens and apparatus for processing a lens When a forming a bevel on a lens, the value of the bevel curve is calculated based on the value of the curve of the concave face, a reference axis of the bevel curve is determined to be in the same direction as the curvature of the concave face, a ... 10/27/05 - 20050239374 - Method for deciding a bevel curve, method for determining the locus of a bevel, method for processing a lens and apparatus for processing a lens When a forming a bevel on a lens, the value of the bevel curve is calculated based on the value of the curve of the concave face, a reference axis of the bevel curve is determined to be in the same direction as the curvature of the concave face, a ... 10/27/05 - 20050239373 - Method for deciding a bevel curve, method for determining the locus of a bevel, method for processing a lens and apparatus for processing a lens When a forming a bevel on a lens, the value of the bevel curve is calculated based on the value of the curve of the concave face, a reference axis of the bevel curve is determined to be in the same direction as the curvature of the concave face, a ... 09/29/05 - 20050215179 - Low surface energy cmp pad The invention provides a polishing pad substrate comprising a copolymer, wherein the copolymer has at least one hydrophilic repeat unit and at least one hydrophobic repeat unit. The invention also provides a polishing pad substrate comprising a polymer, wherein the polymer is a modified polymer having at least one hydrophilic ... 09/08/05 - 20050197048 - Method for manufacturing a workpiece and torque transducer module A method for manufacturing a workpiece and a torque transducer module for material removal techniques, are disclosed, where machining friction varies in dependency of machining depth and the torque/deformation of a shaft is monitored for controlling material removal. The module has a body extending along a central axis and two ... 09/01/05 - 20050191946 - Methods and apparatus for controlling the lapping of a slider based on an amplitude of a readback signal produced from an externally applied magnetic field The lapping of a slider is controlled based on an amplitude of a readback signal which is produced from an externally applied magnetic field. A lapping plate is used to lap a slider which includes at least one magnetic head having a read sensor. During the lapping, a coil produces ... 08/11/05 - 20050176349 - Load cup for chemical mechanical polishing Embodiments of a load cup for transferring a substrate are provided. The load cup includes a pedestal assembly having a substrate support and a de-chucking nozzle. The de-chucking nozzle is positioned to flow a fluid between the polishing head and the back side of a substrate during transfer of the ... 08/04/05 - 20050170752 - Plated grinding wheel life maximization method A method of determining the condition of a grinding wheel is provided to avoid over use or premature changing of the grinding wheel in a grinding machine, such as for crankshaft or camshaft grinding. The grinding machine has a motor which drives a grinding spindle carrying an abrasive coated hub ... 07/14/05 - 20050153632 - Methods of preparing semiconductor workpiece process fluid Semiconductor processor systems, systems configured to provide a semiconductor workpiece process fluid, semiconductor workpiece processing methods, methods of preparing semiconductor workpiece process fluid, and methods of delivering semiconductor workpiece process fluid to a semiconductor processor are provided. One aspect of the invention provides a semiconductor processor system including a process ... ### FreshPatents.com Support |