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Abrading > Precision Device Or Process - Or With Condition Responsive Control > Controlling Temperature Controlling TemperatureControlling Temperature patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.03/01/07 - 20070049170 - Retainer ring, polishing head, and chemical mechanical polishing apparatus A retainer ring configured to reduce heat generated during a polishing process may include a heat absorbing element, a thermoelectric element, and a heat dissipating element. A polishing head configured to polish a wafer may include a wafer carrier, a retainer ring, and a cooling element. A chemical mechanical polishing ... 11/02/06 - 20060246823 - Coolant supply method and apparatus for grinding machine In a coolant supply method and apparatus for a grinding machine, when an end surface of a workpiece is ground with a grinding wheel end surface of a grinding wheel with coolant being supplied toward a grinding point, a first coolant flow is ejected toward a first position which is ... 09/14/06 - 20060205323 - Substrate holding mechanism, substrate polishing apparatus and substrate polishing method A substrate holding mechanism, a substrate polishing apparatus and a substrate polishing method have functions capable of minimizing the amount of heat generated during polishing of a substrate to be polished and of effectively cooling the substrate holding part of the substrate holding mechanism and also capable of effectively preventing ... 05/04/06 - 20060094338 - Chemical mechanical polishing apparatus and chemical mechanical polishing method using the same Polishing uniformity in a CMP process may be improved due to an improvement in the temperature uniformity of a polishing surface, when a wafer is polished by a CMP apparatus including a polishing head for holding the wafer, a platen, a polishing pad at a top of the platen so ... 03/23/06 - 20060063472 - Method for polishing substrate In a method for polishing a substrate, a substrate placed on a polishing pad bonded onto a platen is polished while the temperature of a surface of the polishing pad is monitored. An index of the amount of the substrate polished is calculated based on the monitored temperature of the ... 12/08/05 - 20050272347 - Dry ice blasting cleaning apparatus The invention is an apparatus used for cleaning equipment including extremely high voltage energized electrical equipment using a dry ice blasting stream as the cleaning agent. The apparatus comprises a cleaning wand and a heating mechanism for impeding the formation of condensation and/or frost on the outer surface of the ... ### FreshPatents.com Support |