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Abrading > Precision Device Or Process - Or With Condition Responsive Control > By Optical Sensor By Optical SensorBy Optical Sensor patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.04/12/07 - 20070082582 - Apparatus for endpoint detection during polishing An apparatus for endpoint detection during polish, being used to monitor the surface polishing status of a polishing surface of a workpiece, is disclosed, which comprises: a probe, being positioned above the workpiece by a height; and at least a sensing element, being disposed on the probe at a position ... 03/08/07 - 20070054599 - Apparatus and method of controlling the temperature of polishing pads used in planarizing micro-device workpieces Temperature regulation systems and methods for controlling the temperature of polishing pads used in planarizing micro-device workpieces are disclosed herein. In one embodiment, an apparatus for polishing a workpiece includes a platen defining a planarizing zone and a primary duct system. The platen can have a first duct, and the ... 03/01/07 - 20070049169 - Nonwoven polishing pads for chemical mechanical polishing A polishing article and its use as a polishing article for various substrates, especially for polishing a semiconductor wafer. The article is comprised of a mesh of splittable intermingled fibers and a binder material holding the fibers in the mesh. The fibers and binder material provide the polishing pad with ... 03/01/07 - 20070049168 - Polishing pad, pad dressing evaluation method, and polishing apparatus The present invention provides: a polishing apparatus for polishing a workpiece, comprising a polishing pad whose surface or surface layer part is colored with a color different from a color inside the polishing pad, a pad dresser which performs dressing of the polishing pad, and an observing device which observes ... 03/01/07 - 20070049167 - Sealed polishing pad, system and methods A polishing pad, polishing system, method of making a polishing pad and method of using a polishing pad. The polishing pad includes a polishing layer having a polishing surface, a backing layer with an aperture and a first portion that is permeable to liquid, and a sealant that penetrates a ... 02/22/07 - 20070042682 - Transparent polishing pad The present invention relates to a polishing pad useful for planarizing a substrate in a CMP process using a polishing composition. The polishing pad is transparent and allows for the use of an in-situ optical end-point detection apparatus without the need for a separate aperture or window in the polishing ... 02/22/07 - 20070042681 - Spectrum based endpointing for chemical mechanical polishing Methods and apparatus for providing a chemical mechanical polishing pad. The pad includes a polishing layer having a top surface and a bottom surface. The pad includes an aperture having a first opening in the top surface and a second opening in the bottom surface. The top surface is a ... 02/22/07 - 20070042680 - Spectrum based endpointing for chemical mechanical polishing Methods and apparatus for providing a flushing system for flushing a top surface of an optical head. The flushing system includes a source of gas configured to provide a flow of gas, a delivery nozzle, a delivery line that connects the source of gas to the delivery nozzle, a vacuum ... 02/22/07 - 20070042679 - Substrate polishing apparatus A substrate polishing apparatus (10) polishes a substrate (20) to a flat mirror finish. The substrate polishing apparatus (10) has a polishing table (12) against which a substrate (20) is pressed, a light-emitting and light-receiving device (24) to emit measurement light from the polishing table (12) to the substrate (20) ... 02/15/07 - 20070037488 - Polishing pad having a window with reduced surface roughness The present invention provides a polishing pad for performing chemical mechanical planarization of semiconductor substrates. The polishing pad comprises a polishing pad body having an aperture formed therein and a window fixed in the aperture for performing in-situ optical measurements of the substrate. The window has a lower surface capable ... 02/15/07 - 20070037487 - Polishing pad having a sealed pressure relief channel The present invention provides a chemical mechanical polishing pad comprising a window formed in the polishing pad, the window having a void provided on a side thereof. The invention further provides a pressure relief channel provided in the polishing pad from the void to a periphery of the polishing pad. ... 02/08/07 - 20070032170 - Polishing pad with built-in optical sensor An optical sensor that includes a light source and a detector is located within a cavity in a polishing pad so as to face the surface that is being polished. Light from the light source is reflected from the surface being polished and the detector detects the reflected light. The ... 01/25/07 - 20070021037 - Polishing assembly with a window The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and ... 01/18/07 - 20070015441 - Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light ... 01/11/07 - 20070010169 - Polishing pad with window for planarization A polishing pad including a window can be useful for polishing articles and can be especially useful for chemical mechanical polishing or planarization of a microelectronic device, such as a semiconductor wafer. The window of the polishing pad is at least partially transparent and thus, can be particularly useful with ... 11/16/06 - 20060258265 - Rotary grinding apparatus for blending defects on turbine blades and associated method of use A grinding apparatus for use with an endoscope for viewing and blending defects on a turbine engine blade is provided. In one preferred embodiment a motorized driver causes a grinding head on the end of a grinding tool to rotate at a predetermined speed. The position of the grinding head ... 10/12/06 - 20060228995 - Systems and methods for monitoring characteristics of a polishing pad used in polishing micro-device workpieces Systems and methods for monitoring characteristics of a polishing pad used in polishing a micro-device workpiece are disclosed herein. In one embodiment, a method for monitoring a characteristic of a polishing pad includes applying ultrasonic energy to the polishing pad and determining a status of the characteristic based on a ... 10/12/06 - 20060228994 - Hand held electric polisher A polisher has a polishing disc on a shaft driven by a brushless DC motor driven by a motor controller mounted spaced from the polisher and adjacent a ground fault interrupt circuit and a power plug. Power and control wires form a cord that provides communication between a speed control ... 10/12/06 - 20060228993 - Mechanical grinding apparatus for blending defects on turbine blades and associated method of use A grinding apparatus for use with an endoscope for viewing and blending defects on a turbine engine blade is provided. In one preferred embodiment a mechanical driver causes a grinding head on the end of a grinding tool to reciprocate at a predetermined speed. The position of the grinding head ... 09/28/06 - 20060217038 - Endpoint detection system for wafer polishing An wafer polishing pad assembly for use in CMP includes an optical sensor for sensing reflectivity of the wafer during polishing, and produces a corresponding signal, and transmits the signal from the rotating pad to a stationary portion of the assembly. The signal is transmitting off the pad through non-contact ... 08/10/06 - 20060178086 - Eyeglass lens processing apparatus An eyeglass lens processing apparatus includes; a drilling tool for forming a hole in an eyeglass lens; a first movement mechanism part that relatively moves the drilling tool relative to the lens; a target lens shape input section that inputs data of a two-dimensional target lens shape of the lens; ... 08/03/06 - 20060172666 - Method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips A method of producing a semiconductor device by dividing a semiconductor wafer into separate pieces of semiconductor chips. This method includes forming a groove with a pattern according to an outer contour of a desired semiconductor chip, holding the semiconductor wafer by a wafer holding mechanism, grinding a back surface ... 08/03/06 - 20060172665 - Polishing tool and polishing apparatus A polishing tool is used for polishing a workpiece (13) such as a semiconductor wafer to a flat mirror finish. The polishing tool has a polishing table (10) and a polishing pad (11) attached to an upper surface of the polishing table (10). The polishing pad (11) has a plurality ... 07/27/06 - 20060166608 - Spectral imaging of substrates Spectral imaging systems and methods are provided for monitoring a substrate during a chemical-mechanical planarization process. An example system includes a carrier configured to receive a substrate, and a platen configured to receive a polishing pad. The platen includes an aperture configured to pass light. The system also includes a ... 07/27/06 - 20060166607 - Detection of diamond contamination in polishing pad and reconditioning system therefor Methods for reconditioning a polishing pad and detecting diamond contamination of the polishing pad, are disclosed. In particular, the methods include the step of exposing the reconditioned polishing pad to an energy source to induce the diamond contamination to fluoresce. Detection of the diamond contamination is then made by detecting ... 07/27/06 - 20060166606 - Polishing state monitoring apparatus and polishing apparatus and method A polishing state monitoring apparatus measures characteristic values of a surface, being polished, of a workpiece to determine the timing of a polishing end point. The polishing state monitoring apparatus includes a light-emitting unit for applying light from a light source to a surface of a workpiece being polished, a ... 07/13/06 - 20060154568 - Multilayer polishing pad and method of making A polishing pad has a polishing layer with a polishing surface and a first registration mark, and a backing layer connected to the polishing layer and having a second registration mark aligned with the first registration mark. The polishing pad may have a window that includes an aperture in the ... 06/29/06 - 20060141908 - Method and apparatus for using a coolant fluid A metal machining apparatus for removal of metal from a workpiece, that employs a laser-targeted coolant nozzle to apply coolant fluid to a machining tool, such as a grinding wheel, to remove metal from a workpiece. The laser-targeted coolant nozzle has a coolant nozzle body having a flow passage for ... 06/29/06 - 20060141907 - Method for monitoring a cmp polishing method and arrangement for a cmp polishing method The invention relates to a method for monitoring a CMP polishing method, a substrate being fixed in a mount, a polishing pad being fixed on a plate, a surface of the polishing pad being operatively connected to a surface of the substrate, the polishing pad and the substrate being moved ... 06/15/06 - 20060128272 - Automated drill bit re-sharpening and verification system A completely automated apparatus for verifying the identity and geometry of drill bits, re-sharpening the cutting tip of a drill bit and re-positioning a locating ring upon the shank portion of the drill bit subsequent to the re-sharpening of the cutting tip thereof. The apparatus comprises a housing having a ... 06/15/06 - 20060128271 - Polishing pad for semiconductor wafer and laminated body for polishing of semiconductor wafer equipped with the same as well as method for polishing of semiconductor wafer An objective of the present invention is to provide a polishing pad for a semiconductor wafer and a laminated body for polishing of a semiconductor wafer equipped with the same which can perform optical endpoint detection without lowering the polishing performance as well as methods for polishing of a semiconductor ... 06/01/06 - 20060116051 - Polishing pad with built-in optical sensor An optical sensor that includes a light source and a detector is located within a cavity in a polishing pad so as to face the surface that is being polished. Light from the light source is reflected from the surface being polished and the detector detects the reflected light. The ... 05/25/06 - 20060111019 - Toolholder A toolholder (50) with a controllable critical angle, such as a lead, trailing, rake or clearance angles, includes a tool spindle (42a) for retaining the toolholder in a tool rest (42) of a machine tool. The machine tool (10) includes at least one linear axis, for example, three mutually perpendicular ... 05/18/06 - 20060105679 - Substrate polishing apparatus A substrate polishing apparatus is used to polish a surface of a substrate such as a semiconductor wafer to a flat mirror finish. The substrate polishing apparatus has a polishing table and a polishing pad mounted on the polishing table for polishing a semiconductor substrate. The polishing pad has a ... 05/11/06 - 20060099886 - Electronic die positioning device and method An autocollimator is relied upon to orient an electronic die such that its frontside is parallel to a polishing surface. The polishing device is configured such that a beam of light that is projected by the autocollimator is able to reflect off of the backside surface of the die. Measurement ... 04/06/06 - 20060073768 - Conductive pad design modification for better wafer-pad contact An apparatus and method for manufacturing and refurbishing a conductive polishing pad assembly for performing an electrochemical process on a substrate is disclosed. The conductive polishing pad assembly is formed using a contact surface as a foundation that is coated with a metallic coating to create a conductive contact surface. ... 03/23/06 - 20060063471 - Cmp pad having a streamlined windowpane A chemical mechanical polishing pad (200, 300, 400, 500, 600) that includes a translucent windowpane (220, 320, 404, 516, 524, 604) that allows optical measurements to be made using light energy reflected from the surface of a wafer (212, 324, 608) or other object being polished. The windowpane includes a ... 03/02/06 - 20060046618 - Methods and systems for determining physical parameters of features on microfeature workpieces Methods and systems for determining physical parameters of features on microfeature workpieces. In one embodiment, a method includes directing a substantially coherent probe beam at a selected area of a feature on the microfeature workpiece to produce a reflected probe beam having phase information of different points within the selected ... 02/23/06 - 20060040588 - Apparatus for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies and methods for making and using same Polishing pads, planarizing machines and methods for mechanical and/or chemical-mechanical planarization of microelectronic-device substrate assemblies. The polishing pads, for example, can be web-format pads, and the planarizing machines can be web-format machines. In a typical application, the web-format machines have a pad advancing mechanism and stationary table with a first ... 01/19/06 - 20060014476 - Method of fabricating a window in a polishing pad The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and ... 01/12/06 - 20060009131 - Data processing for monitoring chemical mechanical polishing Methods and apparatus to implement techniques for monitoring polishing a substrate. Two or more data points are acquired, where each data point has a value affected by features inside a sensing region of a sensor and corresponds to a relative position of the substrate and the sensor as the sensing ... 12/08/05 - 20050272346 - Carrier head of chemical mechanical polishing apparatus having barriers dividing pressure chamber into a plurality of pressure zones A carrier head of a chemical mechanical polishing apparatus has a support, an elastic membrane secured to the support and spaced from the bottom surface of the support so that a pressure chamber is defined between the membrane and the bottom surface of the support; and at least one annular ... 12/01/05 - 20050266773 - Apparatuses and methods for in-situ optical endpointing on web-format planarizing machines in mechanical or chemical-mechanical planarization of microelectronic-device substrate assemblies Planarizing machines, planarizing pads, and methods for planarizing or endpointing mechanical and/or chemical-mechanical planarization of microelectronic substrates. One particular embodiment is a planarizing machine that controls the movement of a planarizing pad along a pad travel path to provide optical analysis of a substrate assembly during a planarizing cycle. The ... 11/03/05 - 20050245171 - Chemical mechanical polishing pad, manufacturing process thereof and chemical mechanical polishing method for semiconductor wafers There is provided a chemical mechanical polishing pad containing a polishing substrate having a polishing surface and a light-transmitting member fused to the polishing substrate. The sectional form of the light-transmitting member when it is cut with a plane parallel to the polishing surface is elliptic with a value obtained ... 10/27/05 - 20050239372 - Substrate polishing apparatus A substrate polishing apparatus for polishing a polishing surface of a substrate has a film thickness monitoring device for monitoring a state of a film thickness of a thin film on the polishing surface of the substrate during polishing. The apparatus includes a table, a polishing member fixed on a ... 10/13/05 - 20050227587 - In-line wafer surface mapping A method and apparatus for the topographical profiling of a raw substrate is carried out during in-line processing of the substrate during which additional films and structures have been formed over the raw substrate surface. The method includes forming a dielectric film over the substrate surface and forming a metal ... 09/01/05 - 20050191945 - Polishing pad for use in chemical/mechanical planarization of semiconductor wafers having a transparent window for end-point determination and method of making A porous polishing pad for use chemical/mechanical planarization of semiconductor wafers is provided with a transparent section formed in a section of the porous polishing pad by direct injection of a polymeric material into a modified portion of the pad. The modified section may be either a low density area, ... 08/04/05 - 20050170751 - Apparatus and method for in-situ endpoint detection for chemical mechanical polishing operations An apparatus and method of chemical mechanical polishing (CMP) of a wafer employing a device for determining, in-situ, during the CMP process, an endpoint where the process is to be terminated. This device includes a laser interferometer capable of generating a laser beam directed towards the wafer and detecting light ... 07/28/05 - 20050164608 - Apparatus for optical inspection of wafers during processing An optical system is disclosed for the inspection of wafers during polishing which also includes a measurement system for measuring the thickness of the wafers top layer. The optical system views the wafer through a window and includes a gripping system, which places the wafer in a predetermined viewing location ... 07/07/05 - 20050148287 - Rotary grinding apparatus for blending defects on turbine blades and associated method of use A grinding apparatus for use with an endoscope for viewing and blending defects on a turbine engine blade is provided. In one preferred embodiment a motorized driver causes a grinding head on the end of a grinding tool to rotate at a predetermined speed. The position of the grinding head ... 06/16/05 - 20050130562 - Polishing apparatus and method for detecting foreign matter on polishing surface A polishing apparatus 110 which comprises a polishing tool 1 having a polishing surface, and a holder means (top ring 4) for holding a semiconductor wafer (a substrate) W. Polishing apparatus 110 further comprises color CCD camera 10 for taking a color image of a region on the polishing surface; ... ### FreshPatents.com Support |