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Abrading > Precision Device Or Process - Or With Condition Responsive Control > Computer Controlled Computer ControlledComputer Controlled patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.04/12/07 - 20070082581 - Systems and methods for detecting device-under-test dependency A system of process control is provided. The system comprises a first processing tool, a first sensor, a second processing tool, and a processor. The first processing tool processes a first workpiece. The first sensor provides real-time monitoring (RTM) data of the first processing tool while processing the first workpiece. ... 04/12/07 - 20070082580 - Grinding machine with a concentricity correction system A tool grinding machine has a machine control unit, which by means of a suitable measuring device, which for instance comprises a tracer (9) and a measuring module, first determines the wobble runout with respect to the ideal receptacle axis (C) of a workpiece receptacle. In the grinding machining of ... 04/05/07 - 20070077862 - System for endpoint detection with polishing pad A method of forming a polishing pad with a polishing layer having a polishing surface and a back surface. A plurality of grooves are formed on the polishing surface, and an indentation is formed in the back surface of the polishing layer. A region on the polishing surface corresponding to ... 04/05/07 - 20070077861 - Polishing apparatus and method with direct load platen A method and apparatus for chemical mechanical polishing includes a platen supports a polishing article, a robot located proximate the platen, a carrier head having a retaining ring, and a carrier heads support mechanism. The robot is configured to position a substrate on the polishing article, and the carrier heads ... 03/29/07 - 20070072517 - Devices for altering the position of the scanning element unit on inclined installation of a segmented grinding platen and controller for control thereof On inclined installation of the segmented grinding platen (11, 12, 13) of a through belt grinding machine, the problem arises of the altered arrangement of the scanning element series (15) relative to a position for the segment series (11) which is different thereto, for example, at right angles. According to ... 03/22/07 - 20070066183 - Control structure of grinding machine A grinding machine includes a sensor for detecting the variation of the current of a motor thereof to determine the timing that a grinding assembly thereof touches a workpiece. An automated control system computes the grinding path of the grinding assembly according to the timing. Thus, all of the workpieces ... 03/22/07 - 20070066182 - Machine for grinding internal diameter and end surface of workpiece A grinding machine includes an automated control system, a machine base, a chuck device, and two grinding devices for grinding both of an internal diameter and an end surface of a workpiece automatedly. The machine base is provided with rails thereon. A chuck device has an independent power source and ... 03/15/07 - 20070060023 - Apparatus and method for polishing objects using object cleaners An apparatus and method for polishing objects, such as semiconductor wafers, uses at least one object cleaner, which may be a movable object cleaner. The movable object cleaner allows access to different parts of the apparatus for maintenance. ... 03/15/07 - 20070060022 - Gear manufacturing machine and process for the operation of such a gear manufacturing machine The invention concerns a device for the automatic loading of workpieces into a gear manufacturing machine, in particular a hard state finishing machine, by means of a swivel device arranged on the machine, where simultaneous with the machining process of a work piece blank (2) clamped on the work spindle ... 03/08/07 - 20070054598 - Locking mechanism of linear motor travel slider and processing machine A locking mechanism of a linear motor travel slider, includes: a serration member having a teeth portion and disposed on one of the bed and the travel slider extending in a slider-traveling-direction; a bracket supported by the other of the bed and the travel slider; an actuator supported by the ... 03/01/07 - 20070049166 - Polishing method and polishing apparatus A polishing method make it possible to carry out a multi-step polishing process with improved polishing conditions (polishing recipe) while omitting measurement of the surface conditions of a substrate, as carried out between polishing steps, as much as possible, thereby increasing the throughput. The polishing method for polishing workpieces by ... 03/01/07 - 20070049165 - Environmental control system for a centrifugal processor A centrifugal processor is disclosed with includes an outer frame having an inner surface and an axis. At least one inner vessel positioned within the outer frame and is adapted to receive an object to be processed. A drive system rotate the inner vessel with respect to the outer frame ... 03/01/07 - 20070049164 - Polishing pad and method for manufacturing polishing pads A polishing pad comprising particles having an average diameter between 1 nanometer and 100 nanometers, wherein the total weight of the particles is greater than about 3% of the total weight of the pad. Also, a method of manufacturing a polishing pad comprises the steps of: mixing a pre-polymer and ... 02/22/07 - 20070042678 - Plating removing apparatus for three-piece wheel To provide a plating removing apparatus for 3-piece wheels, which can easily and neatly remove plating at the welding planned portion of the superimposed part of the inner rim and the outer rim. A plating removing apparatus that removes plating of a welding planned portion R in a three-piece wheel ... 02/22/07 - 20070042677 - Methods for lapping using pneumatically actuated flexible coupling end effectors Methods for performing surface lapping using a robotic system are provided. In one embodiment, a method for lapping a surface includes providing a lapping assembly having a first base coupled to a second base by a flexible coupling member, and a lapping medium coupled to the second base, the flexible ... 02/22/07 - 20070042676 - Blasting apparatus and blasting method The present invention provides a lasting apparatus which is provided with an ejection device, which ejects blast media, and a recovery device, which sucks and recovers ejected and used blast media, on a traveling carriage, ejects the blast media to a surface to be treated by the ejection device while ... 02/22/07 - 20070042675 - Spectrum based endpointing for chemical mechanical polishing Methods and apparatus for spectrum-based endpointing. An endpointing method includes selecting a reference spectrum. The reference spectrum is a spectrum of white light reflected from a film of interest on a first substrate and has a thickness greater than a target thickness. The reference spectrum is empirically selected for particular ... 02/15/07 - 20070037486 - Polishing pad, method of manufacturing the polishing pad, and chemical mechanical polishing apparatus comprising the polishing pad A polishing pad of a CMP apparatus has a plurality of pores. A characteristic associated with the pores, such as average size or pore density, varies substantially from region to region of the pad across the pad in a diametral direction of the pad. The polishing pad can be designed ... 02/15/07 - 20070037485 - Method of aligning the upper and lower centering bells of a lens doublet assembly machine A method for aligning the upper and lower centering bells of a lens doublet assembly machine is provided. In one example of the method, the method includes positioning an alignment tool with respect to a base plate of the lens doublet aligning apparatus; positioning an upper bell shaft with respect ... 02/15/07 - 20070037484 - Method and system for cleaning A method and a system for cleaning the glass surface of an object, such as a surface light, a run way guide light, or a reflector, installed on various pavements or roads, by propelling a cleaning agent from a blast nozzle to the glass surface. The blast nozzle is installed ... 02/08/07 - 20070032169 - Method for aligning and assembling two lens pieces, and a machine to accomplish this task A method for aligning and assembling two lens pieces, and a machine to accomplish this task are provided. In one example of the method, the method includes holding an upper lens above a lower lens, holding the lower lens in a horizontal position, lowering the upper lens into a contact ... 01/25/07 - 20070021036 - Apparatus and a method of polishing an optical surface; an optical component; and a method of manufacturing a polishing tool An apparatus for polishing an optical surface, in particular an optical surface of a spectacle lens, is disclosed. The apparatus comprises a polishing head having a polishing tool, the polishing tool being provided along a common axis, one behind another, with a first preferably rigid member, a second elastic member, ... 01/18/07 - 20070015440 - Eyeglass lens processing apparatus An eyeglass lens processing apparatus includes a lens holding unit for holding an eyeglass lens, a roughing tool, a finishing tool, a drilling tool, a processing water supply unit for applying processing water to a processed part of the lens held by the lens holding unit, and a controller for ... 01/11/07 - 20070010168 - Methods and systems for planarizing workpieces, e.g., microelectronic workpieces This disclosure provides methods and apparatus for predictably changing the thickness of a microfeature workpiece. One implementation provides a planarizing method in which a first workpiece is planarized in first and second planarizing processes and a total change in thickness is determined. This thickness change is modified by a thickness ... 01/11/07 - 20070010167 - Method and apparatus for reconditioning digital discs An automated method for reconditioning a plurality of digital discs within a reconditioning apparatus is disclosed. The method comprises holding the digital discs in a load area, and then transferring each of the digital discs from the load area to at least one workstation with a disc transfer mechanism. The ... 01/04/07 - 20070004317 - Eyeglass lens processing apparatus An eyeglass lens processing apparatus includes: a processing tool that processes a periphery of an eyeglass lens; a lens chucking shaft that holds the lens; a rotating unit that rotates the chucking shaft; a first moving unit that relatively moves the chucking shafts with respect to the processing tool; a ... 01/04/07 - 20070004316 - Integrated system for processing semiconductor wafers An integrated process tool for chemical mechanical processing, cleaning and drying a semiconductor workpiece is provided. The integrated process tool includes a CMP module and a cleaning and drying module. After being processed, the workpiece is transported from the CMP module to the cleaning and drying module using a movable ... 12/21/06 - 20060286904 - Polishing system with in-line and in-situ metrology A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing ... 12/21/06 - 20060286903 - Eyeglass lens processing apparatus An eyeglass lens processing apparatus includes; a lens holding unit that holds an eyeglass lens; a data input unit that inputs target lens shape data; a lens measuring unit that measures a refractive surface of the held lens based on the input target lens shape data to obtain an edge ... 12/21/06 - 20060286902 - Eyeglass component engraving device A laser cutting tool whose position, aiming direction and cutting duration are controlled by a programmable microprocessor, is housed in a cabinet above a platen equipped with a number of component-holding stations. Each of the stations has a plurality of vises sized to grasp an eyeglass component including lenses or ... 12/07/06 - 20060276106 - Method for supplying lens of eyeglasses A method of supplying a spectacle lens by bevel-edging an uncut spectacle lens based on specified lens edge shape data includes a lens edging step (S2) to rim machine a spectacle lens based on a lens edge shape data and a prescribed edging condition of the spectacle frame, a lens ... 11/23/06 - 20060264154 - Eyeglass lens processing apparatus An eyeglass lens processing apparatus includes: a lens rotating unit having lens chucking shafts which hold an eyeglass lens, and a first motor which rotates the chucking shafts; an axis-to-axis distance changing unit having a second motor which changes an axis-to-axis distance between a center axis of rotation of a ... 11/23/06 - 20060264153 - Method for selective removal of materials present in one or more layers on an object, and apparatus for implementation of this method There is provided a method and apparatus for selective removal of materials present on an object A in one or more layers B by surface abrasion by projection onto the surface of the object A of a moving fluid composed of a gas and solid particles conveyed in the gas. ... 11/16/06 - 20060258264 - Cmp pad analyzer An ultrasonic CMP polishing pad analyzer is disclosed. The analyzer provides a manufacturer or other user an ability to inspect a CMP polishing pad without removing the pad from the CMP machine by creating and displaying a topographical image of an in-service polishing pad. The analyzer includes an ultrasonic transducer ... 11/16/06 - 20060258263 - Chemical mechanical polishing end point detection apparatus and method Methods and apparatus for substantially continuously measuring the surface of a wafer during a polishing process are disclosed. According to one aspect of the present invention, an apparatus includes a wafer support table that supports a wafer, a polishing pad that polishes a surface of the wafer, and a polishing ... 11/09/06 - 20060252350 - Chemical mechanical polishing system and process Chemical mechanical polishing (CMP) systems and methods are provided herein. One aspect of the present subject matter is a polishing system. One polishing system embodiment includes a platen adapted to receive a wafer, and a polishing pad drum that has a cylindrical, or generally cylindrical, shape with a length and ... 11/09/06 - 20060252349 - Semiconductor wafer polishing apparatus having magneto-rhelogical elastic pad Disclosed herein is a semiconductor wafer polishing apparatus having a magneto-rheological elastic pad, in which the dielectric layer of the wafer fixed in the wafer holder to contact the abrasive coated on a rotating plate is polished. The semiconductor wafer polishing apparatus comprises a magneto-rheological elastic pad formed by a ... 11/09/06 - 20060252348 - Method and apparatus to enable accurate wafer prediction A method for monitoring a processing tool in a semiconductor manufacturing facility includes selecting key hardware parameters for a virtual sensor system based on manufacturing data associated with a fabrication tool and collecting manufacturing data associated with the fabrication tool. The method further includes dynamically maintaining the virtual sensor system ... 11/02/06 - 20060246822 - System and method for in-line metal profile measurement A system includes a measuring station for positioning an eddy current probe proximate to a substrate in a substrate holder. The probe can produce a time-varying magnetic field, in order to induce eddy currents in one or more conductive regions of a substrate either prior to or subsequent to polishing. ... 11/02/06 - 20060246821 - Method for controlling polishing fluid distribution A method for delivering a polishing fluid to a chemical mechanical polishing surface is provided. In one embodiment, a method for delivering a polishing fluid to a polishing surface of a chemical mechanical polisher includes flowing polishing fluid to a first portion of the polishing surface through a first outlet ... 11/02/06 - 20060246820 - Extended kalman filter incorporating offline metrology An algorithm uses offline metrology to control a process by passing information from an outer control loop to an inner control loop, extended Kalman filter estimator. The inner control loop operates online, and the outer control loop operates asynchronously with respect to the inner control loop. The online control loop ... 10/26/06 - 20060240747 - Eyeglass lens processing apparatus An eyeglass lens processing apparatus for processing a periphery of an eyeglass lens, the apparatus includes: a lens chuck shaft that holds and rotates the lens; an end mill that processes the periphery of the lens; an end mill tilting unit that varies a tilt of the end mill with ... 10/26/06 - 20060240746 - System and method for precision machining of high hardness gear teeth and splines A gear shaper machine system drives and maneuvers a hone tool to generate teeth geometry in a manner the teeth were machined prior to a hardening process. After heat treatment, the hone tool is indexed to the teeth geometry spacing of the workpiece so as to divide the stock removal ... 10/26/06 - 20060240745 - Method for analyzing effective polishing frequency and effective polishing times for chemical mechanical planarization polishing wafers with different polishing pad profiles A method for analyzing polishing frequency and number of polishing times for chemical planarization polishing wafer with different polishing pad profiles is disclosed. First, drawings of a wafer and a polishing pad are provided and then are converted into pixel arrays. Pixel arrays are processed to be black/white images. The ... 10/26/06 - 20060240744 - Method for calibrating a grinding machine The invention relates to a method for calibrating a grinding machine for sharpening bar blades by grinding at least two flanks and a top surface (K) of the bar blades, involving the following steps: producing a calibrating blade by sharpening a bar blade according to predetermined dimensions; measuring the dimensions ... 10/12/06 - 20060228992 - Process control in electrochemically assisted planarization In one embodiment, a pad assembly for electro-processing a substrate is provided which includes a first conductive layer having a working surface adapted to contact the substrate during a polishing process, an intermediate layer coupled to the first conductive layer, and a second conductive layer coupled to the intermediate layer. ... 10/12/06 - 20060228991 - Polishing method and apparatus A chemical mechanical polishing method for polishing an oxide film and a protective film formed on a substrate having recesses comprises four steps. The first step planarizes the oxide film using a polishing pad and a polishing agent containing cerium oxide particles by causing relative rotational motion between the substrate ... 10/12/06 - 20060228990 - Method and apparatus for generating complex shapes on cylindrical surfaces A method and apparatus for shaping the radial surface of a roller or other cylindrically shaped part in a single cycle. The preferred embodiment forms a crown geometry on one roller at a time using a CNC system to control a grinding surface in three axes. The grinding surface is ... 10/05/06 - 20060223418 - Method and apparatus for treating the surface of a media, such as a magnetic hard disk, while operating, such as during dynamic electrical testing A system and method for treating (e.g. polishing to remove defects) the surface of a media, such as a magnetic hard disk, while in operation, such as during dynamic electrical testing is disclosed. Further, a method for manufacturing a head for treating the surface of a media is disclosed. ... 10/05/06 - 20060223417 - Manufacturing cell for the treatment of grinding and wheel set testing and procedures for the operation of the manufacturing cell A manufacturing cell for the treatment of grinding of gear wheel flanks, in particular by bevel pinions, and suggested for the wheel set testing, which includes a grinding machine (1), an unreeling test equipment (2), a laser inscription unit (3) with a time band (5) and a robot-supported load system ... 10/05/06 - 20060223416 - Device and nethod for abrading a wooden barrel A device for abrading a wooden barrel (13) includes a robot having elements (11, 17, 23) for loading a barrel (13), elements (29a, 29b, 33a, 33b) for gripping and rotating the barrel (13) around the axis thereof, elements (43a, 43b) for extracting and re-positioning the two bilge hoops of the ... 09/28/06 - 20060217037 - Control system and method for processing jewelry and the like A control system for controlling processing of workpieces such as jewelry has gantry and gimbal units having x, y, z translational and x, y, z rotational degrees of freedom, the units carrying a gripper for holding a piece of jewelry. Drive motors are associated with each translational and rotational degree ... 09/28/06 - 20060217036 - Machine for grinding optical lenses The invention relates to a machine comprising a train of grinding stones (21), mounted to rotate about a first axis (A-A′), a lens support (15), provided with means (37), for rotating the lens (35) about a second axis (B-B′) parallel to the first axis (A-A′), means (13, 39) for relative ... 09/14/06 - 20060205322 - Chemical-mechanical planarization tool force calibration method and system The methods and devices described below allow users of CMP tools to quickly calibrate Spindle Force, Wafer Force, and Retaining Ring Force using mechanisms, load cells, a control computer, and force equations. The control computer can test a variety of pressures in the inflatable seal or the inflatable membrane, depending ... 09/14/06 - 20060205321 - Super-abrasive machining tool and method of use The super-abrasive machining tool utilizes both a means for grinding a workpiece and a means for revolving the workpiece in order to efficiently and cost effectively remove material from a workpiece comprising superalloy materials or even ceramic material. The means for grinding revolves at a much greater velocity than the ... 09/07/06 - 20060199472 - Apparatus and method for conditioning a polishing pad used for mechanical and/or chemical-mechanical planarization Conditioning apparatuses and methods for conditioning polishing pads used for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, a method for conditioning a polishing pad used for polishing a micro-device workpiece includes monitoring surface condition in a first region of the polishing pad and adjusting ... 09/07/06 - 20060199471 - Pad conditioner design and method of use A polishing pad conditioning apparatus includes a laser beam generating unit along with a system to transmit or focus the beam. The unit is mounted on a conditioning arm, such that the laser beam may be directed perpendicular to the plane of the polishing pad, which is next to the ... 08/31/06 - 20060194512 - Thickness control method and double side polisher The object of the present invention is to provide a thickness control method for a double side polisher, accuracy of which is not affected by wearing of polishing pad and applicable to polishing of nonconductive work pieces. An eddy current sensor in a cavity of an upper polishing plate measures ... 08/31/06 - 20060194511 - Thickness control method and double side polisher The object of the present invention is to provide a double side polisher capable of maintaining thickness control accuracy over a long period of time without being affected by a gradual change in thickness of a polishing pad, and a thickness control method. The first polishing operation is finished based ... 08/31/06 - 20060194510 - Precision machining apparatus and precision machining method A precision machining apparatus and a precision machining method capable of carrying out grinding with accuracy by performing switching control, for example, on a device for rotating a grinding wheel according to grinding stages through the amount of movement and constant pressure changed stepwise. To a second pedestal 3 supporting ... 08/24/06 - 20060189259 - Polishing apparatus and related polishing methods Polishing apparatus and related methods employ aligned first and second magnetic field sources to adjust the compressive force and/or pressure applied by a carrier head against a target workpiece (such as a wafer) by selectively and controllably generating a repellant or attractive force between the two magnetic field sources. ... 08/24/06 - 20060189258 - Controlled wall saw and method for controlling the wall saw A control wall saw includes a guide rail (2) securable on a to-be-cut wall (7), a saw head (3) displaceable along the guide rail (2), a rotary drive, a pivotally adjustable saw arm (4) on a radially end of which a rotatably driven, disc-shaped saw blade (5) is releasably mountable, ... 08/24/06 - 20060189257 - Systems and methods for wafer polishing An electromagnetic polish head (100) comprises at least one electromagnet. An embodiment may also include the addition of a slurry component or components that can be affected by an electromagnetic field. During polishing or planarization, a field or fields may be generated by the polish head (100) to affect the ... 08/24/06 - 20060189256 - Systems and methods for wafer polishing An electromagnetic polish head (100) comprises at least one electromagnet. An embodiment may also include the addition of a slurry component or components that can be affected by an electromagnetic field. During polishing or planarization, a field or fields may be generated by the polish head (100) to affect the ... 08/24/06 - 20060189255 - Spectacle lens manufacturing method and spectacle lens manufacturing system A spectacle lens design device 201 disposed at a factory 200 on a manufacturing side and a lens processing device connected thereto block an applicable semi-finished lens blank or lens blank so that a reference surface thereof tilts at a predetermined angle using a numerical-control curve generator based on order ... 08/17/06 - 20060183407 - Platen and head rotation rates for monitoring chemical mechanical polishing Methods system and apparatus, including computer program products, for monitoring polishing a substrate. A polishing pad mounted on a platen is rotated at a first rotation rate, and a carrier head is rotated at a second rotation rate that is different from the first rotation rate. The carrier head carries ... 08/03/06 - 20060172664 - Methods for reducing delamination during chemical mechanical polishing Method and apparatus are provided for polishing substrates comprising conductive and low k dielectric materials with reduced or minimum substrate surface damage and delamination. In one aspect, a method is provided for processing a substrate including positioning a substrate having a conductive material form thereon in a polishing apparatus having ... 08/03/06 - 20060172663 - Surface polishing method and apparatus thereof A surface polishing method that polishes the surface of a hard brittle material, such as a glass substrate, an oxide film of a silicon wafer, and a ceramic substrate is disclosed. In the surface polishing method, a fixed abrasive grain polishing tool is used, in which the fixed abrasive grains ... 08/03/06 - 20060172662 - Real time monitoring of cmp pad conditioning process CMP pad conditioning processes have been monitored and controlled by detecting the vibrational spectrum of a sensor mounted on the conditioner support arm. An accelerometer is used as the detector so that vibrational velocity (which correlates with pad wear) can be measured, rather than displacement or acceleration. After the vibrational ... 08/03/06 - 20060172661 - Devices with angularly adjustable sanding units The invention describes devices consisting of a combination of oblique to feed direction aligned belt sanding assemblies, with drives or devices for low sanding belt speeds and/or with conventional, or modified for sanding belt oblique operation, electronic segmented sanding pad. The oblique alignment of the sanding unit can be adjusted ... 07/27/06 - 20060166605 - Apparatus for processing chamfering of eyeglass lens An apparatus for processing a chamfering of an eyeglass lens, including means for inputting a width of the chamfering and a range of the chamfering from a periphery of a lens shape at at least one position adjacent to a nose or far away from the nose, arithmetic control means ... 07/27/06 - 20060166604 - Process and apparatus for grinding work for non-circular rotor, as well as camshaft To grind an outer peripheral surface of a work (10) for a non-circular rotor by a rotary grindstone (22) advanced and retreated by an NC control depending on the profile of the work (10), while rotating the work (10) about its axis, the following steps are carried out: a first ... 07/20/06 - 20060160469 - Blade sharpening machines The invention concerns a blade (5) sharpening machine (1) comprising a support, operation means, manual and/or automatic control and driving means, said machine (1) being characterised in that it provides a rotating grinding wheel (2) and at least a support (3) for the blade (5) to be sharpened, said support ... 07/06/06 - 20060148381 - Pad assembly for electrochemical mechanical processing Embodiments of a pad assembly for processing a substrate are provided. The pad assembly includes a processing layer having a working surface adapted to process a substrate, a lower layer coupled to and disposed below the processing layer, and an electrode having an upper surface disposed above the lower layer ... 06/22/06 - 20060135042 - Multi-station disk finishing apparatus and method Multi-disk processing system and method of continuous finishing of memory media disks for digital data storage systems in preparation for magnetic memory coating, comprising four main sub-systems: 1) multiple driven spindles mounted on a chassis, at 3, 6, 9 and 12 o'clock positions; 2) finishing tape head units mounted on ... 06/22/06 - 20060135041 - Stonecutting apparatus and method using saw and water jet An apparatus for cutting stone which utilizes both a circular saw and a water jet. Both the saw and the water jet are mounted on a gantry, which moves along tracks. All the parts are under the control of the CNC device. The saw is used for straight cuts and ... 06/22/06 - 20060135040 - Method and device for the high-precision machining of the surface of an object, especially for polishing and lapping semiconductor substrates The aim the invention is to machine the surface of objects using a universal device as economically as possible and in a significantly reduced amount of time, even in the event of process variations, material non-homogeneities etc., with high reproducible precision. The this end, the pressure distribution on the surface ... 06/15/06 - 20060128270 - Apparatus at a spinning room machine, especially a flat card, roller card, cleaner or the like, for processing, especially grinding and/or sharpening, a clothing In a spinning room machine, especially a flat card, roller card or cleaner, an apparatus for processing, especially grinding and/or sharpening, a clothing on a roller has a processing device which is movable along a track. The spinning room machine has an electronic control and regulation device together with a ... 06/08/06 - 20060121829 - Bit sharpening apparatus and method of using In an embodiment of the present invention, a laser 314 (FIGS. 6 and 7) directs a beam onto a mirror 318 affixed to the bit cutting face 28. The beam is reflected back to a pair of cross hairs positioned next to the laser to achieve parallel adjustment. ... 06/08/06 - 20060121828 - Method and apparatus for pivot point determination and machine tool adjustment A CNC apparatus has a memory configured to compensate for offsets in a pivot point. The machine tool has a head, a pivot point, a spindle, a table, and at least four axes including an X-axis, a Y-axis, a Z-axis, and a C-axis. A method for calibrating the CNC apparatus ... 06/08/06 - 20060121827 - Cylindrical grinding method for producing hard metal tools and cylindrical grinding machine for grinding cylindrical starting bodies during the production of hard metal tools The invention relates to a grinding method and to a cylindrical grinding machine, in which a sintered hard metal round rod is completely pushed through a chuck of a workpiece spindle head, said chuck having chuck jaws. Two backrest seats are ground on the freely projecting end area of the ... 05/25/06 - 20060111018 - Method and apparatus for lapping gears A method for lapping the gears of a gear set as well as a gear lapping system. The gear set generally includes a first gear in meshed engagement with a second gear, each of the first and second gears having a plurality of gear teeth each with drive and coast ... 05/18/06 - 20060105678 - Polishing apparatus and polishing method A polishing apparatus can supply a polishing liquid uniformly and efficiently to a surface to be polished of a workpiece. The polishing apparatus includes a polishing table having a polishing surface, and a top ring for holding a semiconductor wafer and pressing the semiconductor wafer against the polishing surface. The ... 05/18/06 - 20060105677 - System and method for manufacturing magnetic heads Systems and methods for the manufacture of a magnetic head. A first embodiment provides an apparatus for the manufacture of a magnetic head comprising a feedback control loop to terminate lapping of the magnetic head responsive to achieving a target signal to noise ratio for the magnetic head. ... 05/18/06 - 20060105676 - Robust signal processing algorithm for end-pointing chemical-mechanical polishing processes A signal processing system has the detected mechanical, chemical, optical, electrical, or thermal signals generated during chemical-mechanical polishing (CMP) process collected, analyzed and differentiated with respect to time in-situ, in order to reveal the different stages during CMP for process control and end-pointing purposes. This control and/or end-pointing scheme may ... 05/18/06 - 20060105675 - Grinding apparatus for buttons on rock drill bit The present invention relates to grinding apparatus for grinding the hard metal inserts of rock drill bits, said grinding apparatus having a grinding machine carried on an support system that provides a feed pressure for said grinding machine during grinding, said grinding machine equipped with a grinding pin driven by ... 05/11/06 - 20060099885 - Wear indication apparatus and method Apparatus and method for monitoring the wear of a downhole tool, and providing indication of the degree of wear to an operator at the well surface. A pressurized fluid path within the cutting element matrix can exhibit a pressure drop when wear of the matrix progresses into the fluid path, ... 05/04/06 - 20060094337 - Pad conditioner test apparatus and method A test apparatus and method tests a pad conditioner of a chemical mechanical polishing apparatus. The pad conditioner test apparatus includes a main body having a conditioner mounting section that supports the pad conditioner, a conditioner head raising/lowering system that raises and lowers the head of the pad conditioner while ... 04/20/06 - 20060084364 - Combined apparatus for machining of articles, in particular in form of slabs An apparatus for machining an article (L) in the form of a slab or the like comprises—in addition to a rotary tool (24) associated with a spindle (22)—a nozzle (26) ejecting water at very high pressure. Both the rotary tool and the nozzle are supported by a carriage (20) sliding ... 04/20/06 - 20060084363 - Direct clamp tooling for robotic applications A direct clamp robotic finishing system is provided including a robot, a gripper secured to the robot, and a pair of fingers secured to the gripper. A tray assembly is also provided for supporting a plurality of implants for picking up by the fingers. An implant reorientation station is provided ... 04/06/06 - 20060073767 - Apparatus and method for mechanical and/or chemical-mechanical planarization of micro-device workpieces Planarizing machines and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, a method for polishing a workpiece includes determining an estimated frequency of serial defects in a workpiece, pressing the workpiece against a polishing pad and moving the workpiece relative to the pad. ... 04/06/06 - 20060073766 - Magnetic spindle for machine tool A spindle for a machine tool comprising a outer spindle portion and an inner spindle portion with each of the outer spindle portion and the inner spindle portion being rotatable relative to one another about the same axis. The outer spindle portion and the inner spindle portion each include a ... 04/06/06 - 20060073765 - Grinding process and apparatus with arrangement for grinding with constant grinding load A process of grinding a surface of a workpiece, by a grinding tool rotated about its axis. The process includes a grinding step of grinding the workpiece surface, by pressing at least one of the grinding tool and the workpiece against the other of the grinding tool and the workpiece, ... 04/06/06 - 20060073764 - Device and method for machine control A data set (D) is provided for machine control of a grinding machine to determine time-efficient, collision-free travel paths whereby said data set has a collision parameter of “0” or “1” in each separate coordination point (X, Y, Z, A) as well as for each combination of the separated tool ... 03/30/06 - 20060068684 - Polishing method and polishing system A polishing method includes supplying a slurry onto a pad disposed above a turntable while rotating the turntable, and polishing a workpiece disposed on the pad by pressing the workpiece to the pad, and detecting an ion concentration of a specific ion included in the slurry on the pad by ... 03/30/06 - 20060068683 - Machining apparatus using a rotary machine tool to machine a workpiece A machining apparatus includes a rotary machine tool for machining a workpiece. A nozzle jets a coolant for the rotary machine tool. Information which changes based on a position of the nozzle is obtained. The nozzle is moved based on the information obtained. ... 03/30/06 - 20060068682 - Method and system of using offset gage for cmp polishing pad alignment and adjustment A method and system are provided using an offset dial gage for alignment and adjustment of a polishing pad that has been attached to a turntable of a chemical mechanical polishing (CMP) device. In a described embodiment, an offset dial gage has a surface that contacts a side of a ... 03/30/06 - 20060068681 - Wafer polishing method and apparatus The present invention provides a wafer polishing method and a polishing apparatus which are capable of preventing peripheral sags of a wafer due to polishing and then manufacturing the wafer, especially an SOI wafer at a high flatness level. There is provided a wafer polishing method using a polishing apparatus ... 03/23/06 - 20060063470 - Semiconductor wafer material removal apparatus and method for operating the same A system for applying a microtopography to a semiconductor wafer (“wafer”) is provided. The system includes a chuck configured to hold and rotate the wafer. The system also includes a grinding wheel disposed over the chuck in a proximately adjustable manner relative to the wafer to be held by the ... 03/23/06 - 20060063469 - Advanced chemical mechanical polishing system with smart endpoint detection The methods and systems described provide for an in-situ endpoint detection for material removal processes such as chemical mechanical polishing (CMP) performed on a workpiece. In a preferred embodiment, an optical detection system is used to detect endpoint during the removal of planar conductive layers using CMP. An optically transparent ... 03/16/06 - 20060057940 - Polishing apparatus and method for producing semiconductors using the apparatus The present invention relates to a polishing apparatus, and a semiconductor manufacturing method using the apparatus. Dressing of a grindstone surface is ground by sizing processing whereby dressing of a tool surface can be done while preventing occurrence of cracks on the grindstone surface which is the cause for occurrence ... 03/16/06 - 20060057939 - Grinding method of a workpiece and grinding apparatus An adaptive work table-reciprocation control system and method that can reduce a grinding time. The system uses a vibration sensor head installed on a chuck surface in the vicinity of the workpiece to detect a vibration signal emitted from the contact zone between the grinding wheel and the workpiece. When ... 03/09/06 - 20060052037 - Vacuum suction holding apparatus and holding method, polishing apparatus using this holding apparatus, and device manufacturing method using this polishing apparatus The vacuum suction holding apparatus of the present invention has a vacuum duct which is disposed inside a polishing head, with one end of this vacuum duct being opened in the attachment surface and the other end thereof being connected to a vacuum source. A polishing body is held by ... 03/09/06 - 20060052036 - System and method detecting malfunction of pad conditioner in polishing apparatus A system and method adapted to detect a malfunction related to a pad conditioner in a polishing apparatus are disclosed. The pad conditioner includes a conditioning pad seated on a conditioner head and a drive motor rotating the conditioner head. The system also comprises a current sensor connected to the ... 03/02/06 - 20060046617 - Apparatus and method for polishing semiconductor wafers using pivotable load/unload cups An apparatus and method for polishing objects, such as semiconductor wafers, utilizes pivotable load/unload cups to transfer the objects to object carriers to polish the objects on at least one polishing surface. The pivoting axes of the pivotable load/unload cups are located between the object carriers. ... 02/23/06 - 20060040587 - Automatic sharpening system for ice-skates A method is for using a skate-grinding device. The method provides an automatic sharpening system (10) that has grip members (14, 16) and a grinding wheel (28). A blade (18) of a skate (20) is inserted into a groove (19). The system is turned on. A motor (44) rotates the ... 02/23/06 - 20060040586 - Method and apparatus for polishing a semiconductor device A method and an apparatus for polishing a semiconductor wafer are provided. An initial thickness of the semiconductor wafer is actually measured to obtain a measured initial thickness value. First and second inter-positions are then set or determined with reference to the measured initial thickness value. The first and second ... 02/23/06 - 20060040585 - Method and apparatus for abrasive circular machining For the machining of a workpiece (18) rotating about a workpiece axis, a first abrasive tool (20), which rotates about a first tool axis, and the workpiece (18) are advanced towards one another, in order to machine a first workpiece face in a first abrasive operation. Further, a second abrasive ... 02/23/06 - 20060040584 - Method and apparatus for grinding Apparatus for high speed grinding includes a diamond-bonded abrasive wheel, a drive mechanism for mounting and rotating the grinding wheel at peripheral speeds up to approximately 200 m/s, and a liquid coolant supply system including a delivery system for directing liquid coolant to the point of grinding contact. ... 02/16/06 - 20060035564 - Fine force actuator assembly for chemical mechanical polishing apparatuses A polishing apparatus (10) for polishing a device (12) with a polishing pad (48) includes a pad holder (50) and an actuator assembly (432). The pad holder (50) retains the polishing pad (48). The actuator assembly (432) includes a plurality of spaced apart actuators (438F) (438S) (438T) that are coupled ... 02/16/06 - 20060035563 - Method, apparatus and system for use in processing wafers The present embodiment provides for methods and systems for use in processing objects such as wafers, including polishing and/or grinding wafers. Some embodiments provide systems that include a front-end module and a processing module. The front end module couples with a storage device that stores objects for processing. The front-end ... 02/16/06 - 20060035562 - System and a method for polishing optical connectors A polishing system for polishing optical connectors includes at least one polishing station having a region of polishing film overlying a substrate block, and a polishing fixture (200). The polishing fixture has connector mounting holes (204) for receiving optical connectors and a working liquid supply arrangement including working liquid release ... 02/09/06 - 20060030240 - Method and apparatus for planarizing microelectronic workpieces Planarizing machines and methods for accurately planarizing microelectronic workpieces. Several embodiments of the planarizing machines produce a planar surface at a desired endpoint in the microelectronic workpieces by (a) quickly reducing variances on the surface of the workpiece using a planarizing medium that removes topographical features but has a low ... 02/02/06 - 20060025052 - Method and apparatus of eddy current monitoring for chemical mechanical polishing A polishing system can have a rotatable platen, a polishing pad secured to the platen, a carrier head to hold a substrate against the polishing pad, and an eddy current monitoring system including a coil or ferromagnetic body that extends at least partially through the polishing pad. A polishing pad ... 02/02/06 - 20060025051 - Wire sawing apparatus A wire sawing apparatus includes a plurality of cutting wires arranged in parallel with one another and caused to travel in their axial directions; a table on which a workpiece is placed and held; a moving device for vertically moving the table; and a machining-liquid feed pipe. While a machining ... 02/02/06 - 20060025050 - Gear grinding machine To correct the tooth profile error of a ground gear, the wheel angle of a threaded grinding wheel is modified by dressing the threaded grinding wheel by a dressing device. To correct the helix form deviation of a ground gear, namely, to modify the helix angle of the gear, synchronization ... 02/02/06 - 20060025049 - Spray slurry delivery system for polish performance improvement and cost reduction Methods and apparatus for delivering a polishing fluid to a chemical mechanical polishing surface is provided. In one aspect, the apparatus comprises a vertical arm having a delivery portion located proximate to a circumference of a polishing surface, a first nozzle disposed on the delivery portion and adapted to dispense ... 02/02/06 - 20060025048 - Abrasive article detection system and method Systems and methods control abrading operations of an abrading machine by sensing characteristics of an abrading article installed on the abrading machine. When a problem is discovered by sensing the article, appropriate actions may be taken. As one example, the abrading article may be sensed to determine whether the abrading ... 02/02/06 - 20060025047 - Grading system and method for abrasive article Systems and methods control abrading operations of an abrading machine by sensing characteristics of an abrading article installed on the abrading machine. When a problem is discovered by sensing the article, appropriate actions may be taken. As one example, the abrading article may be sensed to determine whether the abrading ... 02/02/06 - 20060025046 - Abrasive article splicing system and methods Systems and methods control abrading operations of an abrading machine by sensing characteristics of an abrading article installed on the abrading machine. When a problem is discovered by sensing the article, appropriate actions may be taken. As one example, the abrading article may be sensed to determine whether the abrading ... 02/02/06 - 20060025045 - System and method for detecting abrasive article orientation Systems and methods control abrading operations of an abrading machine by sensing characteristics of an abrading article installed on the abrading machine. When a problem is discovered by sensing the article, appropriate actions may be taken. As one example, the abrading article may be sensed to determine whether the abrading ... 01/19/06 - 20060014475 - Grindstone tool A grindstone tool forperformpredeterminedprocessing on a workpiece, wherein a radio IC tag from, and to, which information can be read, and written, without contact is embedded in the grindstone tool. ... 01/19/06 - 20060014474 - Gear grinding machine A gear grinding machine comprises: a moving mechanism rotatably mounted with a threaded grinding wheel, and arranged to move the threaded grinding wheel along directions of X, Z, and Y, and to turn the threaded grinding wheel in a Y-Z plane; an NC device for controlling the position of the ... 01/19/06 - 20060014473 - Many-headed grinding machine and grinding method using many-headed grinding machine A control device 40 controls the grinding processing at a processing portion of a work W so as to shift to the last precision grinding step from a rough grinding step through a middle grinding step and a finishing grinding step. When the grinding in each step is carried out, ... 01/12/06 - 20060009130 - Method and apparatus for dry-in, dry-out polishing and washing of a semiconductor device A polishing apparatus includes an arrangement of a plurality of units to deal with various operations and a robot having at least one arm. The plurality of units are disposed around the robot and include a loading unit for receiving thereon a, e.g. dry, workpiece to be polished, a polishing ... 01/12/06 - 20060009129 - Feedforward and feedback control for conditioning of chemical mechanical polishing pad A method, apparatus and medium of conditioning a planarizing surface includes installing a wafer to be polished in a chemical mechanical polishing (CMP) apparatus having a polishing pad and a conditioning disk, polishing the wafer under a first set of pad conditioning parameters selected to maintain wafer material removal rates ... 01/12/06 - 20060009128 - Eddy current sensing of metal removal for chemical mechanical polishing A sensor for monitoring a conductive film in a substrate during chemical mechanical polishing generates an alternating magnetic field that impinges a substrate and induces eddy currents. The sensor can have a core, a first coil wound around a first portion of the core and a second coil wound around ... 01/12/06 - 20060009127 - Method for estimating polishing profile or polishing amount, polishing method and polishing apparatus A polishing method can automatically reset the polishing conditions according to the state of a polishing member based on data on the polishing profile changing with time, thereby extending the life of the polishing member and obtaining flatness of the polished surface with higher accuracy. The polishing method, including the ... 01/12/06 - 20060009126 - Method and apparatus for producing optical glasses The invention relates to a method and an apparatus for producing optical glasses. The glasses are polished and marked, following a shaping process. The polishing and marking steps are carried out in a common processing cell which comprises a polishing station, a washing station, and a marking station. ... 01/12/06 - 20060009125 - Both side grinding method and both side grinder of thin disc-like work When the feeding operation of grinding wheels (1, 2) is completed, the distances from hydrostatic pads (20, 21) to the surface and back of work (W) are measured at three points, and the deformation amount of work (W) is detected from the results of measurement at the three points by ... 01/05/06 - 20060003674 - Aspheric-surface processing method and aspheric-surface forming method An aspheric-surface processing method according to the present invention, uses a cuffing apparatus including at least one turning tool movable in the same direction as the rotating axis of the work and is also movable in a direction perpendicular to the rotating axis of the work. This method includes moving ... 01/05/06 - 20060003673 - Apparatus and method for conditioning and monitoring media used for chemical-mechanical planarization A method and apparatus for conditioning and monitoring a planarizing medium used for planarizing a microelectronic substrate. In one embodiment, the apparatus can include a conditioning body having a conditioning surface that engages a planarizing surface of the planarizing medium and is movable relative to the planarizing medium. A force ... 01/05/06 - 20060003672 - Polishing apparatus The present invention relates to a polishing apparatus for polishing a workpiece such as a semiconductor wafer. The polishing apparatus has a processing section including a polishing section (1) for polishing a semiconductor wafer (6) and a cleaning section (10) for cleaning a polished semiconductor wafer, a receiving section (40) ... 01/05/06 - 20060003671 - Cmp apparatus and method Methods and apparatus are provided for the chemical mechanical planarization (CMP) of a surface of a work piece. In accordance with one embodiment of the invention the apparatus comprises a plurality of CMP systems, a plurality of load cups for loading unprocessed work pieces into and unloading processed work pieces ... 01/05/06 - 20060003670 - Electrically enhanced surface planarization A substrate processing apparatus equipped to employ electrical potential to assist in planarization and/or conditioning is provided. ... 12/29/05 - 20050287929 - Integrated endpoint detection system with optical and eddy current monitoring A chemical mechanical polishing apparatus and method can use an eddy current monitoring system and an optical monitoring system. Signals from the monitoring systems can be combined on an output line and extracted by a computer. A thickness of a polishing pad can be calculated. The eddy current monitoring system ... 12/29/05 - 20050287928 - Method and apparatus for post-cmp cleaning of a semiconductor work piece A method and apparatus are provided for post-CMP cleaning of a semiconductor work piece. The method comprises the steps of subjecting the work piece to a first cleaning composition having one of an acidic pH and a basic pH and subjecting the work piece to a second cleaning composition having ... 12/29/05 - 20050287927 - Method to monitor pad wear in cmp processing A pad groove analyzer and associated method configured to assess the grooves on the pad and determine how worn the pad is. The pad groove analyzer may be configured to monitor the grooves via a contact or no-contact process. In a contact process, the pad groove analyzer may include a ... 12/22/05 - 20050282469 - Method of producing a design on a terracotta container having a glazed surface portion This invention relates to a method of producing designs on terracotta containers, the surfaces of which have been at least partly covered with a glaze. In the method, the glaze is cut through and is cut, grinded, or etched away with glass cutting tools to expose the terracotta surface beneath. ... 12/15/05 - 20050277365 - Real time polishing process monitoring A technique for in situ monitoring of polishing processes and other material removal processes employs a quartz crystal nanobalance embedded in a wafer carrier. Material removed from the wafer is deposited upon the surface of the crystal. The resulting frequency shift of the crystal gives an indication of the amount ... 12/01/05 - 20050266772 - System and method for ophthalmic lens manufacture A method and system for the manufacture of ophthalmic lenses comprising a computer (102) and a CNC machining platform (104) in operative connection with the computer. The CNC machining platform includes a mounting stage (110), a block (106) in releasable connection with the mounting stage, and a machining tool (112). ... 12/01/05 - 20050266771 - Polishing pad with window Polishing pads with a window, systems containing such polishing pads, and processes that use such polishing pads are disclosed. ... 11/24/05 - 20050260923 - Hand power tool which receives its operating voltage from a power supply unit A hand power tool is connectable to a power supply unit via a multi-wire cable including a plurality of lines for delivering an operative voltage, and the power supply unit is adjustable by an electronic control unit to one or more operating parameters adapted to whichever hand power tool is ... 11/24/05 - 20050260922 - Torque-based end point detection methods for chemical mechanical polishing tool which uses ceria-based cmp slurry to polish to protective pad layer A chemical mechanical polishing (CMP) method is disclosed in which a torque-based end-point algorithm is used to determine when polishing should be stopped. The end-point algorithm is applicable to situations where a ceria (CeO2) based CMP slurry is used for further polishing, pre-patterned and pre-polished workpieces (e.g., semiconductor wafers) which ... 11/10/05 - 20050250419 - High selectivity slurry delivery system Various embodiments of a semiconductor processing fluid delivery system and a method delivering a semiconductor processing fluid are provided. In aspect, a system for delivering a liquid for performing a process is provided that includes a first flow controller that has a first fluid input coupled to a first source ... 11/03/05 - 20050245170 - Polishing system with in-line and in-situ metrology A computer-implemented method for process control in chemical mechanical polishing in which an initial pre-polishing thickness of a substrate is measured at a metrology station, a parameter of an endpoint algorithm is determined from the initial thickness of the substrate, a substrates is polished at a polishing station, and polishing ... 11/03/05 - 20050245169 - Method of polishing semiconductor wafer In a wafer polishing method, a within-wafer distribution model of a removal rate and a within-wafer distribution model of a polishing process are selected, and a within-wafer distribution of a removal rate is obtained by determining parameters of a within-wafer distribution model of a removal rate based on the within-wafer ... 10/27/05 - 20050239371 - Pressure control system and polishing apparatus A pressure control system is used for eliminating individual differences of a plurality of pressure controllers used for controlling pressures of a plurality of pressure-controlled sections. The pressure control system includes a plurality of pressure controllers for supplying a pressurized fluid to a plurality of pressure-controlled sections, a master pressure ... 10/13/05 - 20050227586 - Apparatus and method for sequentially polishing and loading/unloading semiconductor wafers A chemical mechanical polishing (CMP) apparatus and method for polishing semiconductor wafers utilizes multiple wafer carriers that are transferred to different positions about a polishing pad to polish at least one semiconductor wafer while another semiconductor wafer is being loaded onto or unloaded from one of the wafer carriers. The ... 10/06/05 - 20050221720 - Polishing apparatus A polishing apparatus can detect completion of initialization of a polishing pad quantitatively. The polishing apparatus has a polishing table having a polishing pad attached thereto and a substrate holder configured to bring a surface of a substrate into contact with the polishing pad and press the substrate against the ... 09/29/05 - 20050215178 - Semiconductor wafer chemical-mechanical planarization process monitoring and end-point detection method and apparatus The chemical-mechanical polishing (CMP) of products in general and semiconductor wafers in particular is controlled by monitoring the acoustic emissions generated during CMP. A signal is generated with the acoustic emissions which is reflective of the energy of the acoustic emissions. The signals are monitored and the CMP process is ... 09/29/05 - 20050215177 - Cmc porous pad with component-filled pores The invention provides a polishing pad comprising a polymeric material having pores and a component that is disposed within the pores, as well as a method of polishing a workpiece with the aforesaid polishing pad, and a method for producing the aforesaid polishing pad. ... 09/29/05 - 20050215176 - Numeric controller The chopping control process is allowed without adding the chopping dedicated axis. To correct the chopping operation for a movement error in the contour control with the positioning axis or rotation axis, an interpolation processing part 12 and an axis control processing part 13 are provided with a function of ... 09/29/05 - 20050215175 - Method for re-grinding and polishing free-form surfaces, especially rotationally symmetrical aspherical optical lenses A method for re-grinding and polishing free-form surfaces, especially rotationally symmetrical aspherical optical lenses by tools. in which the virtual levelling of a coarsely pre-grinded lens, for example, is calculated by interferometric measurement and by calculation with a desired form; pressure, rotational speed and sojourn time of the tools are ... 09/22/05 - 20050208879 - Control of chemical mechanical polishing pad conditioner directional velocity to improve pad life A method, apparatus and medium of conditioning a planarizing surface includes installing a wafer to be polished in a chemical mechanical polishing (CMP) apparatus having a polishing pad and a conditioning disk, polishing the wafer under a first set of pad conditioning parameters selected to maintain wafer material removal rates ... 09/22/05 - 20050208878 - Method of and machine for grinding a roll A method and machine for grinding a rolling mill roll in which the grinding wheel is rotated against the working surface of the rotating mill roll and is displaced back and forth longitudinally along this surface and simultaneously or subsequently the surface is examined for defects by sensors capable of ... 09/22/05 - 20050208877 - Apparatus for machining workpieces, in particular workpieces provided with cutting teeth In an apparatus for machining workpieces, in particular workpieces provided with cutting teeth, such as bandsaw blades or circular-saw blades for example, comprising a base (12), a machining device (18) displaceable relative to the base (12) and having at least one machining tool (20) rotationally drivable about a drive axis, ... 09/22/05 - 20050208876 - Cmp process control method A one-time feedback CMP process control method which contributes to uniformity in the quantity of material removed from wafers in a lot during semiconductor processing and is suitable for complex processes such as STI (shallow trench isolation) fabrication procedures, is disclosed. The method includes providing a plurality of wafers having ... 09/15/05 - 20050202756 - Methods and systems for planarizing workpieces, e.g., microelectronic workpieces This disclosure provides methods and apparatus for predictably changing the thickness of a microfeature workpiece. One implementation provides a planarizing method in which a first workpiece is planarized in first and second planarizing processes and a total change in thickness is determined. This thickness change is modified by a thickness ... 09/15/05 - 20050202755 - Multi-port sandblasting manifold and method A method and apparatus is provided to simplify sandblasting processes while increasing applied coverage areas in sandblasting operations. The method and apparatus provide a manifold assembly having a plurality of nozzles and that is rigidly attached to an air supply. The manifold is supplied with abrasive material via a plurality ... 09/15/05 - 20050202754 - Method, apparatus, and tools for precision polishing of lenses and lens molds A tool, apparatus, and method for polishing objects having a wide variety of materials and shapes including precision optical surfaces, injection mold inserts, and thin film coating dies. The tool has an inflatable bladder contained within an abrasive surface. The bladder may be inflated using a variety of fluids having ... 09/08/05 - 20050197047 - Magnetic recording head burnishing method A slider burnishing method is introduced, in which the slider is brought into a predetermined surface contact with the rotating disk for a specified period. The predetermined surface contact end the specified time period are selected together with the surface condition of the rotating hard disk, such that smoothened slider ... 09/08/05 - 20050197046 - Chemical mechanical polishing method, chemical mechanical polishing system, and manufacturing method of semiconductor device Setting a polishing rate and a polishing time in chemical mechanical polishing can be performed with high accuracy by considering a product wafer of an object to be polished, and an instrumental error between apparatuses to be used, etc. By using, as a calculating formula, a formula well approximating a ... 09/08/05 - 20050197045 - Fine force control of actuators for chemical mechanical polishing apparatuses An actuator assembly (432) for positioning a pad (48) includes a first actuator assembly (440), a second actuator subassembly (442) and a control system (524). In one embodiment, the first actuator subassembly (440) includes a first core (502), and a conductor (504) secured to the first core (502), and the ... 09/08/05 - 20050197044 - Automatic roll data acquisition system The present invention discloses a method, system and apparatus for use in a roll grinding machine. Data is read from an RFID tag automatically by providing an RF read/write sensor on a movable cylinder rod. The RF sensor is held away from the work roll area while the work roll ... 09/01/05 - 20050191944 - Truing method and apparatus In a truing method and apparatus, an analyzing method is employed to calculate a truing shape from which a grinding surface having been trued with a grinding wheel being rotated at a low rotational speed during a truing operation is deformed to a desired shape due to centrifugal expansion depending ... 09/01/05 - 20050191943 - Device for grinding of clothing in a textile machine A grinding device for the flats of a card comprises elastically bendable elements which enter between the clothing points, brush over the side flanks of the points and thereby grind the points. Additional grinding elements are provided in order to treat the front sides of the clothing points. The ground-off ... 09/01/05 - 20050191942 - Cmp apparatus and process sequence method A CMP apparatus and process sequence. The CMP apparatus includes multiple polishing pads or belts and an in-line metrology tool which is interposed between adjacent polishing pads or belts in the apparatus. A material layer on each of multiple wafers is successively polished on the polishing pads or belts. The ... 08/25/05 - 20050186887 - Processing method and apparatus A processing method includes the steps of elastically deforming a jig together with a work, the jig having been mounted on a work, compressing the work against a polishing surface, and moving the work and the polishing surface relative to each other. ... 08/25/05 - 20050186886 - Process and device for the aligning of tooth spaces of a workpiece with precut teeth In a process and a device for the aligning of the tooth spaces of a workpiece with precut teeth, which is set up on the work spindle of a gear finishing machine, the workpiece (1) is brought into no-backlash double flank mesh with a pilot gear (6). The workpiece (1) ... 08/18/05 - 20050181706 - Method and control system for improving cmp process by detecting and reacting to harmonic oscillation A method and control system for detecting harmonic oscillation in a chemical mechanical polishing process and reacting thereto, such as by taking steps to at least one of: 1) reduce or eliminate the harmonic oscillation; and 2) counter the noise which is associated with the harmonic oscillation. By reducing or ... 08/11/05 - 20050176348 - Treatment condition decision method, treatment condition decision system, treatment system, treatment condition decision calculator program, program recording medium, and semiconductor device manufacturing method In step S11, quantities that are varied (parameters) are respectively varied in a stepwise manner at a specified pitch, and standard working conditions consisting of combinations of these parameters are determined. For all of the standard working conditions, a working is actually performed, and the treated shapes that are obtained ... 08/11/05 - 20050176347 - Wafer grinder A wafer grinder withholds a lateral force and adjusts a tilt of worktable with precision. The wafer grinder is used to grind a wafer; that is, the tilt angle of wafer can be adjusted so that wafer is ground with precision. The wafer grinder has a housing module, a rotary ... 08/04/05 - 20050170750 - Polish pad to change polish rate on wafer by adjusting groove width and density The present invention describes a method for creating a differential polish rate across a semiconductor wafer. The profile or topography of the semiconductor wafer is determined by locating the high points and low points of the wafer profile. The groove pattern of a polish pad is then adjusted to optimize ... 08/04/05 - 20050170749 - Process for producing a semiconductor wafer The invention relates to a process for producing a semiconductor wafer by simultaneous polishing of a front surface and a back surface of the semiconductor wafer with a polishing fluid between rotating polishing plates during a polishing run which lasts for a polishing time, the semiconductor wafer being located in ... 08/04/05 - 20050170748 - Lens made of a crystalline material As a preliminary stage in manufacturing a lens or lens part for an objective, in particular a projection objective for a microlithography projection system, an optical blank is made from a crystal material. As a first step in manufacturing the optical blank, one determines the orientation of a first crystallographic ... 07/28/05 - 20050164607 - Lapping a head while powered up to eliminate expansion of the head due to heating A head is fabricated using photolithography, and the head is purposely powered up during a material removal process, such as lapping, so that the head's expansion (that would be formed on being powered up during normal usage in a drive) is planarized. Specifically, the head is energized in a manner ... 07/28/05 - 20050164606 - Chemical mechanical planarization process control utilizing in-situ conditioning process A system and method for providing process control in a CMP system utilizes a vacuum-assisted arrangement for conditioning a wafer polishing pad so that the effluent (i.e., wafer debris, polishing slurry, chemical or other by-products) from the conditioning process is diverted from the waste stream and instead introduced into an ... 07/28/05 - 20050164605 - Device and method for surface working The invention relates to a method for surface working of a body having a first surface to be worked and a second surface to be worked. The method includes, in a first step, providing a first tool and a second tool, in a second step, placing the body between the ... 07/28/05 - 20050164604 - Apparatus for transporting for polishing wafers The present invention discloses an apparatus for transporting wafers. The apparatus includes a tray having a sloped portion on which a wafer having a sidewall can be mounted, a plurality of guides that disposed about the tray, and a plurality of sensors for detecting the position of the sidewall of ... 07/28/05 - 20050164603 - Pivotable slurry arm Embodiments of methods and apparatus of the present invention provide a chemical mechanical planarization (CMP) apparatus including a pivotable slurry arm for dispensing slurry. ... 07/21/05 - 20050159080 - Modified radial motion (mrm) method for modifying lengthwise curvature of face-milling spiral bevel and hypoid gears The present invention relates to a modified radial motion method for modifying lengthwise curvature of face-milling spiral bevel and hypoid gears, which is capable of modifying a locus of a cutter center into a curve, without changing a head cutter's geometry, by providing modified radial motion of the head cutter ... 07/21/05 - 20050159079 - Rotor-grinding machine comprising a rotary head with two grinding wheels The invention relates to a machine (1) for grinding the blades of a turbine rotor (2) or a compressor. The inventive machine consists of a rotary head (6) which is provided with two different grinding wheels (7, 7′) for grinding the rotors (2), three carriages (8, 9, 10) of the ... 07/14/05 - 20050153631 - System and method for monitoring quality control of chemical mechanical polishing pads The present invention provides a method for predicting a performance characteristic of a chemical mechanical polishing (CMP) pad. The method comprises providing a CMP pad having a polishing surface and measuring a frictional property of the polishing surface. The method further includes estimating a performance characteristic of the CMP pad ... 07/07/05 - 20050148286 - Grinding method for vertical type of double disk surface grinding A grinding method for a vertical type of double disk surface grinding machine comprising a pair of rotating grinding wheels vertically opposed to each other and vertically movable and a moving table for moving a work having a work holding jig, wherein vertical positions of the upper and the lower ... 07/07/05 - 20050148285 - Surface cleaning and modifying method and surface cleaning and modifying apparatus A self-cleaning step for cleaning an elastic abrasive body 231 itself by pressing the rotating elastic abrasive body 231 against a pressing member 221 to deform the elastic body 231 while supplying slurry L containing abrasive to the elastic abrasive body 231 so as to clean the elastic abrasive body ... 07/07/05 - 20050148284 - Stacked triple wheel head assembly A stacked three head finishing apparatus is provided. The apparatus includes a base mountable to a floor, a first head mounted to the base, a second head mounted to the base above the first head, and a third head mounted to the base above the second head. Each of the ... 06/30/05 - 20050142987 - Method and system for controlling the chemical mechanical polishing by using a seismic signal of a seismic sensor In a system and a method according to the present invention, a seismic signal from a seismic sensor coupled to a drive assembly of a pad conditioning system is used to estimate the status of one or more consumables in a CMP system. ... 06/23/05 - 20050136801 - Cutting machine for plate-shaped material When a plate-shaped material, such as a CSP substrate, that does not require exact precision is divided, in order to divide a workpiece by cutting the workpiece efficiently in a suitable manner, a cutting machine is provided with not only the first and second chuck tables, but also the first ... 06/23/05 - 20050136800 - Polishing endpoint detection system and method using friction sensor A system method and apparatus to monitor a frictional coefficient of a substrate undergoing polishing is described. A polishing pad assembly includes a polishing layer including a polishing surface, and a substrate contacting member flexibly coupled to the polishing layer having a top surface to contact an exposed surface of ... 06/23/05 - 20050136799 - Automated polishing process for mechanical parts in titanium or titanium alloy The present invention pertains to an automated polishing process for semi-finished mechanical parts in titanium or titanium alloy, using a machine with abrasive belt mounted on a tangential contact wheel driven in rotation at a determined speed and applied at a determined pressure, the wheel travelling with respect to the ... 06/16/05 - 20050130561 - Polishing method and apparatus Provided is a polishing method of polishing a substrate by rotating the substrate and a pad while keeping the pad in contact with the substrate, the method including: a first polishing step of polishing the substrate by rotating the substrate and the pad in a first direction; and a second ... 06/16/05 - 20050130560 - Method of honing bores In a method for honing a bore having first and second sections sequentially arranged in an axial direction of the bore, wherein the first section is hardened so that the first and second sections have different hardness, a honing tool is radially supported by positioning guides of the honing tool ... 06/09/05 - 20050124263 - Grinding arrangement A grinding arrangement for sharpening knives carried by a chopper drum includes a movement arrangement for moving a grinding stone along the chopper drum during a grinding process. A force measurement arrangement is provided which measures the force applied to the knife by the grinding stone, during the grinding process, ... 06/09/05 - 20050124262 - Processing pad assembly with zone control An electrochemical mechanical processing station having a zoned polishing pad assembly is provided. The zoned polishing pad assembly includes a conductive layer coupled to an upper layer having a non-conductive processing surface. At least two zones of different current permeability are defined across the processing surface of the upper layer. ... 06/02/05 - 20050118930 - Carrier assemblies, planarizing apparatuses including carrier assemblies, and methods for planarizing micro-device workpieces Carrier assemblies, planarizing machines with carrier assemblies, and methods for mechanical and/or chemical-mechanical planarization of micro-device workpieces are disclosed herein. In one embodiment, the carrier assembly includes a head having a chamber, a magnetic field source carried by the head, and a fluid with magnetic elements in the chamber. The ... 06/02/05 - 20050118929 - Aspherical surface processing method, aspherical surface forming method and aspherical surface processing apparatus An aspherical surface processing method involves a workpiece to be processed by rotating around a rotation axis, and a rotational tool movable relative to the workpiece in the same direction as the rotation axis of the workpiece and in a direction perpendicular to the rotation axis of the workpiece. The ... 06/02/05 - 20050118928 - Machine tool with 5 machining axes with a continuous grinding tool profilling system The invention relates to a machine tool for machining a part (3) by on-head and continuous grinding tool profiling, including a part holder support (4) driven into rotation by first driving means around a first axis (A1) in a vertical plane, a machining system (S) provided with a grinding tool ... ### FreshPatents.com Support |