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Electrical Connectors > With Insulation Other Than Conductor Sheath > Plural-contact Coupling Part > For Coupling To Edge Of Printed Circuit Board Or To Coupling Part Secured To Such Edge > Having Elongated Slot For Receiving Edge Of Printed Circuit Board > Providing Direct Contact Between Contacts Of Printed Circuit Board And Different Type Conductors

Providing Direct Contact Between Contacts Of Printed Circuit Board And Different Type Conductors

Providing Direct Contact Between Contacts Of Printed Circuit Board And Different Type Conductors patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

03/15/07 - 20070059984 - Modular sockets using flexible interconnects
A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor die to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare ...

10/19/06 - 20060234560 - Modular sockets using flexible interconnects
A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor die to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare ...

09/28/06 - 20060217000 - Method for forming polymer materials utilizing modular die units
The present invention is directed to a modular die unit comprising a plurality of individually shaped plates wherein the shaped plates are stacked in face to face juxtaposition, and when placed into such a juxtaposition exhibit useful polymer forming attributes heretofore unattainable by prior art practices. Single die plates are ...



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