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Electrical Connectors > Having Or Providing Inductive Or Capacitive Shield > Resilient Conductive Means Providing Additional Electrical Path Between Mating Outer Shield Members Resilient Conductive Means Providing Additional Electrical Path Between Mating Outer Shield MembersResilient Conductive Means Providing Additional Electrical Path Between Mating Outer Shield Members patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.10/19/06 - 20060234557 - Electrical connector with retaining shell An electrical connector (100) adapted for receiving a module body (4) comprises an insulative housing defining a cavity (10) for receiving the module body therein, a plurality of contacts (2) received in the insulative housing and a shielding shell (3). The shielding shell defines sidewalls (31,32) surrounding the housing and ... 09/28/06 - 20060216997 - Connecting element A connecting element (1) for shielded data and/or telecommunications cables (2, 3), with a metal housing (10) and with at least one connector jack (15, 16), where contact means (20, 21) are provided for contacting the metal housing (10) with a plug housing (6, 7), particularly with the plug housing ... 02/23/06 - 20060040559 - Electrical connector with improved shielding member An electrical connector comprising a housing (1) having a bottom wall and four upstanding walls (11,12,13) formed a mating cavity (15) adapted for receiving a plug portion of a complementary connector; a plurality of terminals (2) received in the housing and each having a contact portion (21) exposed in the ... 09/15/05 - 20050202723 - Equipment and methods for producing continuous metallized thermoformable emi shielding material The present invention provides in-line equipment and methods for manufacturing an EMI/RFI shield that is integrated formed in a formable sheet. The EMI/RFI shield may comprise a shaped thermoform shell that has one or more conductive layers applied to one or more surfaces. The EMI/RFI shield may be integrally formed ... ### FreshPatents.com Support |