For Dual Inline Package (dip)

For Dual Inline Package (dip) patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.

02/08/07 - 20070032128 - Test socket
An improved test socket for use in testing integrated circuits. The test socket includes a housing having one or more slots formed therein. Contacts can be received within respective slots and maintained therein with rear ends of the contacts in engagement with traces on a load board. Mounting is accomplished ...

05/25/06 - 20060110976 - Terminal having a protrusion for preventing incorrect insertion
A terminal for preventing incorrect insertion into a housing and a method of correctly inserting a terminal into a housing of a connection. The terminal includes a frame that is adapted to be received into a cavity in the housing and a wire operatively connected to the frame. A protrusion, ...

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