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Electrical Connectors > Preformed Panel Circuit Arrangement, E.g., Pcb, Icm, Dip, Chip, Wafer, Etc. > Distinct Contact Secured To Panel Circuit > Resilient Contact Or To Receive Resilient Contact Resilient Contact Or To Receive Resilient ContactResilient Contact Or To Receive Resilient Contact patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.12/21/06 - 20060286829 - Microprobe tips and methods for making Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include ... 12/07/06 - 20060276063 - Non-rigid conductor link measurement sensor and method for the production thereof The invention relates to electronic sensors comprising an electromechanical microsensor cell such as a micro-accelerometer, and it more particularly relates to the way in which the microsensor cell per se is mounted in a package that furthermore comprises a printed circuit board carrying the electronic processing circuits associated with the ... 10/26/06 - 20060240690 - Systems for testing and packaging integrated circuits Several embodiments of stress metal springs are disclosed, which typically comprise a plurality of stress metal layers that are established on a substrate, which are then controllably patterned and partially released from the substrate. An effective rotation angle is typically created in the formed stress metal springs, defining a looped ... 08/03/06 - 20060172568 - Micro contact device comprising the micro contact element and the base member A micro contact element made by photolithography technology includes a suspension arm having a first long side and a second long side opposite to the first long side, a point connected to an end of the first long side of the suspension arm and extending perpendicularly from the suspension arm, ... 06/01/06 - 20060116010 - Latching structure and a method of making an electrical interconnect An electrical interconnect device attaches electrical devices with a cantilever spring with out the use of solder or adhesive. The cantilever spring latches to a contact structure such that there are a plurality of contact points between the spring and the contact structure. The cantilever spring has two tines at ... 02/09/06 - 20060030179 - Transmission-line spring structure A curved transmission-line spring structure formed by self-bending materials (e.g., stress-engineered materials, intermetallic compounds and/or bimorphs) that are layered to form a stripline or microstrip transmission line. A dielectric layer is sandwiched between two conductive layers, which form the signal and ground lines of the structure. The various layers are ... 10/06/05 - 20050221644 - Microprobe tips and methods for making Embodiments of the present invention are directed to the formation of microprobe tips elements having a variety of configurations. In some embodiments tips are formed from the same building material as the probes themselves, while in other embodiments the tips may be formed from a different material and/or may include ... 06/23/05 - 20050136710 - Female terminal for inserting in a printed circuit board Disclosed is a female terminal for mounting on a printed circuit board comprising two resilient arms or tabs, beveled on their inner portion and facing each other, between which various types of components can be electrically connected, and having one or more pins to be inserted in one or more ... 06/16/05 - 20050130462 - Stressed metal contact with enhanced lateral compliance An electrical interconnect structure that includes a spring portion that extends out of a plane. The electrical interconnect including curved regions to improve the lateral compliance of the interconnect. The curved region may be incorporated into a release region of the spring. The release region may include either or both ... ### FreshPatents.com Support |