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Electrical Connectors > Preformed Panel Circuit Arrangement, E.g., Pcb, Icm, Dip, Chip, Wafer, Etc. > With Provision To Conduct Electricity From Panel Circuit To Another Panel Circuit > Micro Panel Circuit Arrangement, E.g., Icm, Dip, Chip, Wafer, Etc. > Dual Inline Package (dip) Dual Inline Package (dip)Dual Inline Package (dip) patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.04/12/07 - 20070082515 - Interconnecting electrical devices A male contact, a connector assembly of the type used to electrically connect electrical devices includes male contacts, and a method of manufacturing an electrical connector are disclosed. ... 04/12/07 - 20070082514 - Electrical connector assembly with fastening means An electrical connector assembly (100) includes an electrical connector (2) with a first plurality of holes (230) thereon, a heat sink (3) mounted onto the electrical connector and including a second plurality of holes (300) thereon, a substrate (4) mounted onto the electrical connector and including a third plurality of ... 04/12/07 - 20070082513 - Self-balanced dual l-shaped socket An embodiment of the present invention is a Land Grid Array (LGA) socket. A first L-shaped area has a first center, a first outer long side, and a first outer short side. The first L-shaped area contains a first set of contacts oriented in a first direction. A second L-shaped ... 03/22/07 - 20070066093 - Assembly of a mobile objective above an optical sensor An assembly structure of a mobile objective above an optical sensor assembled on a support board includes a cover assembled on the support board with an opening facing the sensor, this cover having a conical external surface with an axis orthogonal to the support board. The structure also includes a ... 03/08/07 - 20070054514 - Socket measurement apparatus and method An apparatus and method to determine the amount of misalignment between a chip carrier and socket by the use of an inspection master. The inspection master is tailored to the perimeter size of the chip carrier and contains alignment marks on the same array as the electrical contact pads of ... 01/04/07 - 20070004242 - Socket features for aligning and orienting components The present invention includes a socket with adjoining features that align, orient, and allow vertical assembly of enabling and non-enabling components. The present invention allows space conservation on the motherboard by stacking components on a socket which may serve as a base feature. ... 11/09/06 - 20060252288 - Electrical connector assembly An electrical connector assembly includes a connector comprising a base with a plurality of passageways receiving a plurality of conductive contacts, a cover mounted on the base, the cover defining a plurality of through holes corresponding to the passageways, and an actuator for driving the cover to move from an ... 08/24/06 - 20060189177 - Low profile lga socket assembly A socket terminal assembly is configured to electrically connect a contacting area of an integrated circuit with a corresponding connection region of a substrate, the socket terminal assembly comprising a socket shell including a first end configured to contact the corresponding connection region of the substrate and a second end ... 07/06/06 - 20060148283 - Surface-mount electrical connector with strain-relief features A preferred embodiment of an electrical connector includes a housing, and a surface mount conductor positioned on the housing. The surface mount conductor has a surface mount end. The electrical connector also includes a substrate penetrable electrical conductor positioned on the housing. The substrate penetrable electrical conductor provides strain relief ... 07/06/06 - 20060148282 - Electronic component assembly An electronic component assembly including an electrical connector and an electronic subassembly. The electrical connector has a housing with a receiving area, electrical contacts connected to the housing, and fusible elements. The electrical contacts include first electrical connection sections in the receiving area and second electrical connection sections proximate a ... 06/08/06 - 20060121753 - [burn-in socket] A burn-in socket for burn-in test is disclosed to include a body holding a set of terminals, and a shell detachably fastened to the body with locating pins that are detachably mounted in respective mounting through holes in the shell and inserted into respective mounting holes in the body for ... 05/11/06 - 20060099835 - Electrical socket with compressible domed contacts A compressible domed contact used as a portion of socket contact within an electrical socket to eliminate co-planarity issues and to achieve an effective electrical connection between the electrical socket and a microelectronic device. The compressible domed contact may be made of resilient material such that it will substantially return ... 03/30/06 - 20060068614 - Multi-site chip carrier and method An integrated circuit (IC) package socket device that can receive two or more IC packages and the method of operating the device. Uses for the device include burn-in in which testing and programming of dies or completed IC packages. The device can also be arranged to receive two or more ... 03/23/06 - 20060063399 - Socket connector with reliable shielding member A socket connector adapted for receiving an electronic element therein includes an insulative housing defining an upper opening for receiving an electronic element therein, a plurality of terminals received in the housing, and a first and a second shell member for enclosing the housing. Each terminal has a retaining portion ... 03/16/06 - 20060057868 - Socket for ball grid array devices Disclosed is a socket (10) including a base (12), an array of contacts (22) in columns and rows, a plurality of positioning blocks (121) between the rows of the contacts of the base. Each of the contacts includes two deflectable contact pieces (223) at a distal region thereof to capture ... 03/02/06 - 20060046531 - Top loaded burn-in socket A top loaded burn-in socket for forming a plurality of electrical connections between a ball gird array (BGA) package having a plurality of conductive ball leads and an electrical component is provided. The socket assembly includes a plurality of resilient electrical contacts; a cam being configured to position the contacts ... 03/02/06 - 20060046530 - Lga socket for cpu Provided is an LGA socket of rectangle comprising four side walls wherein at least one of the walls is not fixed, a plastic housing provided on an enclosed space of the socket and comprising a plurality of apertures arranged in rows and columns, and a plurality of conductors each substantially ... 10/27/05 - 20050239301 - Repairable ball grid array contact An electrical contact for a ball grid array connector includes a platform for holding a solder ball and a body having a first end frictionally coupled to the platform and an opposite second end that includes a separable interface configured to mate with a mating contact. The body is separable ... 10/20/05 - 20050233615 - Cpu mounting apparatus A mounting apparatus for mounting a CPU (53) in a socket (52), includes a base (20), a plurality of resilient members (300) respectively disposed at opposite sides of the base and a movement unit (40) having a pressing portion (402) received in the base which moves vertically with respect to ... 10/20/05 - 20050233614 - Test connector with metallic stiffener A test connector (1) includes a base (10), a cover (20), a metallic stiffener (70), two operating members (60), and a lid (30). An opening (703) is defined in the stiffener for receiving the cover therein. Two spaced projections (704) are formed on one end of the stiffener. Two receiving ... 10/13/05 - 20050227512 - Kelvin contact module for a microcircuit test system A test assembly for testing electrical performance of microcircuits contained in leadless packages has Kelvin contacts. Slider contacts in a plurality of contact assemblies slide compliantly to accommodate lack of coplanarity in terminals on the package. A resilient elastomeric block may be inserted through interior spaces of the contact assembly ... 10/06/05 - 20050221634 - Bonded three dimensional metal laminate structure and method A conductive structure and method of manufacturing therefor includes a plurality of stacked metal laminates secured to one another via an intermetallic bond made from a metallic bonding agent. ... 09/22/05 - 20050208791 - System and apparatus for socket and package power/ground bar to increase current carrying capacity for higher ic power delivery A socket and package apparatus are disclosed for increasing the amount of power that can be delivered from an IC board to an IC where the IC package is mounted in a socket connected to the IC board. In one embodiment, the IC package includes a first power plane along ... 09/22/05 - 20050208790 - Electronic part-mounting socket An electronic part-mounting socket includes a socket body having an electronic part-receiving portion for receiving an electronic part, and a plurality of contacts having a resilient contact piece portion projecting into the electronic part-receiving portion, and the electronic part is connected to a printed wiring board via the contacts. The ... 09/15/05 - 20050202696 - Electrical connector An electrical connector (1) is used for electrically connecting a ball grid array (BGA) central processing unit (CPU) (3) with a printed circuit board (PCB). The connector includes a generally rectangular insulative housing (10) and a number of terminals (20) received in the housing. Each of the terminals includes a ... 09/08/05 - 20050196982 - Land grid array connector with reliable securing blocks A land grid array (LGA) connector (1) for connecting a land grid array (LGA) chip with a printed circuit board (PCB) includes a housing (10), and terminals (11) received in the housing. The housing defines a base (100) and four sidewalls (12, 13, 14, 15), the base and the sidewalls ... 08/11/05 - 20050176272 - Interconnect structure and method for connecting buried signal lines to electrical devices An electrical component, such as a trace, signal line, or contact pad connected to the trace or signal line, is covered by one or more layers. The electrical component is connected directly to an electrical device by forming an opening through the one or more layers. The opening exposes a ... 06/23/05 - 20050136704 - Die carrier A die carrier is disclosed which is specifically designed for use in a TSOP socket. More specifically, the die carrier has a carrier substrate with carrier contacts thereon that are dimensioned specifically to match the positioning of the upper and lower socket contacts. The carrier substrate, being 145 microns thick, ... ### FreshPatents.com Support |