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Electrical Connectors > Preformed Panel Circuit Arrangement, E.g., Pcb, Icm, Dip, Chip, Wafer, Etc. > With Provision To Conduct Electricity From Panel Circuit To Another Panel Circuit > Micro Panel Circuit Arrangement, E.g., Icm, Dip, Chip, Wafer, Etc. Micro Panel Circuit Arrangement, E.g., Icm, Dip, Chip, Wafer, Etc.Micro Panel Circuit Arrangement, E.g., Icm, Dip, Chip, Wafer, Etc. patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.03/29/07 - 20070072447 - Printed wiring board having edge plating interconnects The present invention provides a PWB for attaching electrical components thereto. The PWB includes a stack of insulating layers, conductive layers located between the insulating layers, wherein the conductive layers terminate at an edge of the PWB, and an edge plate interconnect located on the edge. The edge plate interconnect ... 03/15/07 - 20070059951 - Flexible assembly of stacked chips A three-dimensional package consisting of a plurality of folded integrated circuit chips (100, 110, 120) is described wherein at least one chip provides interconnect pathways for electrical connection to additional chips of the stack, and at least one chip (130) is provided with additional interconnect wiring to a substrate (500), ... 11/02/06 - 20060246750 - Module connector A module connector, to which a module (5) is electrically connected, comprises a base (10) loaded with a number of terminals (2) and defining a receiving room for receiving the module; and an outer shell (4) assembled to the base after the module being accommodated in the receiving room of ... 11/02/06 - 20060246749 - Module connector A module connector, to which a module (5) is electrically connected, comprises a base (10) loaded with a number of terminals (2) and defining a receiving room for receiving the module; and an outer shell (4) comprising sidewalls (43) and a top wall (41), and assembled to the base after ... 09/14/06 - 20060205246 - Electronic apparatus According to one embodiment, an electronic apparatus includes: a casing; a circuit board provided in the casing; a connector mounted to the circuit board and detachably connecting a first module; and a first storing portion positioned between the first module and the circuit board when the first module is connected ... 05/25/06 - 20060110952 - Systems for interchip communication In some embodiments, the invention involves a system having a first group of integrated circuits connected in a truncated ring fashion, wherein the truncated ring includes a truncated region to allow for additional integrated circuits to be added to the ring. In some embodiments, the invention involves a system having ... 05/18/06 - 20060105594 - Method for package burn-in testing The present invention discloses a contact method of burn-in and test after packaging. The method comprises providing a print circuit board. A solder join socket is engaged with a first fixed plate, the solder join socket with contact spring located in the solder join socket. An adhesive material is formed ... 04/27/06 - 20060089014 - Module connector A module connector comprises an insulating housing defining a chamber for accommodating the module body; a plurality of contacts received in the insulating housing comprising a plurality of contacting portions exposed in the chamber of the housing for electrically connecting with the module body; and a holding member being assembled ... 04/27/06 - 20060089013 - Integrated circuit testing device An apparatus may include a body to couple to a motherboard, the body defining an opening, and a support separate from the body, the support to mount in the opening and to pass electrical interconnects to electrically couple an integrated circuit to the motherboard. ... 11/17/05 - 20050255723 - Attaching integrated circuits to printed circuit boards A land grid array socket may receive an integrated circuit package for electrical connection thereto through lands on the integrated circuit package and spring contacts which extend upwardly to engage those lands from the socket. A protector plate may be situated over the spring contacts prior to the time at ... 09/01/05 - 20050191874 - Inset mechanism for electronic assemblies This invention relates generally to an apparatus and a method for securing electronic components, such as semiconductors and LCD devices in a mechanical assembly through an interconnection formed by a tongue-and-groove securing structure. A first element comprises a holder with electronic components mounted thereon that couples into a second element ... 09/01/05 - 20050191873 - Metal contact lga socket A socket is provided which has an insulative housing surrounding a metal substrate. The substrate has an array of apertures which are located in spatially arranged order to accommodate the precise pattern desired for the device to be connected. Contact assemblies include stamped and formed contacts having an insulative plastic ... 08/25/05 - 20050186809 - Socket connector having keying means A socket connector (100) includes a socket base (12), a socket cover (13) slidable mounted on the socket base, a base plate (17) received in a recessed area (125) defined in the socket base, and an eccentric cam member (15) rotatable engaging with the socket cover, the socket base and ... ### FreshPatents.com Support |