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Electrical Connectors > Preformed Panel Circuit Arrangement, E.g., Pcb, Icm, Dip, Chip, Wafer, Etc. Preformed Panel Circuit Arrangement, E.g., Pcb, Icm, Dip, Chip, Wafer, Etc.Preformed Panel Circuit Arrangement, E.g., Pcb, Icm, Dip, Chip, Wafer, Etc. patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.03/22/07 - 20070066090 - Wiring board, process for producing the same polyimide film for use in the wiring board, and etchant for use in the process ;and an alkaline etchant containing oxyalkylamine, a hydroxide of an alkaline metal compound, water, and preferably an aliphatic alcohol is used as an etchant. The composition enables efficient formation of desirably shaped via holes and through holes through the organic insulating layer on a wiring board. ... 03/22/07 - 20070066089 - Micro security digital card The present invention provides a micro security digital card including: a first shell having a receiving space; a second shell with a periphery thereof forming an embedding part; an integrated circuit with one side thereof provided with a plurality of contacts; and an intermediate element disposed between the second shell ... 03/01/07 - 20070049061 - Electronic device improved in heat radiation performance for heat generated from active element An electronic device of the present invention includes a first substrate provided with a thin film active element, having a thickness of 200 μm or lower, and a second substrate formed with a high thermal conductivity portion. The second substrate is applied to one surface of the two surfaces of ... 03/01/07 - 20070049060 - Printed circuit board and manufacturing method thereof A printed circuit board includes a flexible insulated substrate with a first surface and a second surface at both sides respectively, a wiring layer on the first surface, a reinforcement plate on a part of the second surface and an auxiliary layer between the second surface and the reinforcement plate. ... 01/25/07 - 20070020959 - Circuit board including jacks A plurality of jacks are a video signal jack, a left audio signal jack, and a right audio signal jack from left to right. Jack fixing protrusions are formed on a surface of each jack which surface is attached to a circuit board. The jack fixing protrusions are arranged differently ... 01/04/07 - 20070004237 - Printed circuit board A printed circuit board includes a substrate and a circuit layer located on top of the substrate. The circuit layer further includes a plurality of lattice holes. By providing the lattice holes on the circuit layer, occurrence of bubbles between the circuit layer and the substrate after a high-temperature process ... 12/21/06 - 20060286822 - Multi-chip device and method for producing a multi-chip device The present invention relates to a multi-chip device comprising a plurality of chip stacks each including a plurality of single chips stacked on each other, wherein the stacked single chips are electrically interconnected by one or more through-chip-connection extending through at least one of the single chips and a substrate ... 11/16/06 - 20060258179 - Printed circuit board, connector, and electronic device According to one embodiment, there is provided a printed circuit board. The printed circuit board includes an end portion to be engaged with a member of a connector having a plurality of terminals when the printed circuit board is connected to the connector, and a plurality of wires to be ... 10/19/06 - 20060234521 - Connection structure of printed wiring board A connecting structure is for a printed wiring board to be electrically connected to a FPC. The FPC includes a substrate and electro-conductive portions. The printed wiring board includes an insertion opening provided on an edge surface thereof, and line connecting terminals formed on an inner wall face of the ... 10/12/06 - 20060228910 - Ic card A multifunction IC card (MFC) has compatibility with a multimedia card, an SD card, etc. in that connector terminals (#1 through #13) are disposed on a card substrate (1) in two rows in a zigzag fashion, and realizes multifunction facilities in that a memory card unit (3) and an SIM ... 10/12/06 - 20060228909 - Ic card A multifunction IC card (MFC) has compatibility with a multimedia card, an SD card, etc. in that connector terminals (#1 through #13) are disposed on a card substrate (1) in two rows in a zigzag fashion, and realizes multifunction facilities in that a memory card unit (3) and an SIM ... 10/05/06 - 20060223342 - Carrier element for connection terminal The invention concerns a carrier element (1) for connection leads (2, 3, 4, 30), with several slots (5, 6, 7, 8) for reception of at least one connection terminals (2, 3, 4, 30) and with means of attachment (18, 20) for securing the connection leads (2, 3, 4, 30) in ... 10/05/06 - 20060223341 - Ball assignment system A pattern of contacts that includes high speed transmitter contacts disposed in a first portion of the pattern, where the high speed transmitter contacts are disposed in transmitter differential pairs. High speed receiver contacts are disposed in a second portion of the pattern, where the first portion of the pattern ... 08/17/06 - 20060183354 - Via providing multiple electrically conductive paths A via provides a plurality of electrical connections between conductors on different layers of a circuit board. The via includes an opening through the circuit board formed by a plurality of substantially partially overlapping bores. An electrically conductive plating is formed on an inner surface of the opening. The plating ... 04/20/06 - 20060084285 - Circuit carrier and production thereof A circuit carrier includes a substrate with two oppositely arranged areas. The terminal contacts of a flat connector strip are arranged in the edge regions of the areas. A through contact is arranged under at least one of the terminal contacts with concealed electrical connection to the rear side of ... 03/30/06 - 20060068609 - Electronic device An electronic device comprises a circuit board which has a through hole and uses a resin with a glass transition temperature exceeding 150° C. as a base member, a metal casing which has an opening, and a connector which is fitted to the opening of the metal casing in which ... 01/26/06 - 20060019505 - Multi-layer integrated rf/if circuit board An improved multi-layered integrated RF/IF circuit board has been disclosed. The board is fabricated beginning with a center layer of material. In a first preferred embodiment, the center layer is a rigid core material. In a second preferred embodiment, the center layer is a pliable non-conductive material. For every layer ... 08/11/05 - 20050176268 - Grouped element transmission channel link with pedestal aspects A pedestal connector that incorporates one or more grouped element channel link transmission lines is seen to have a dielectric body and two opposing contact ends that are intended to contact opposing contacts or traces. The dielectric body has an S-shaped configuration such that the transmission lines supported thereon make ... ### FreshPatents.com Support - Terms & Conditions |