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Semiconductor Device Manufacturing: Process > Miscellaneous MiscellaneousMiscellaneous patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.04/12/07 - 20070082508 - Methods for discretized processing and process sequence integration of regions of a substrate The present invention provides methods and systems for discretized, combinatorial processing of regions of a substrate such as for the discovery, implementation, optimization, and qualification of new materials, processes, and process sequence integration schemes used in integrated circuit fabrication. A substrate having an array of differentially processed regions thereon is ... 02/15/07 - 20070037415 - Lanthanum hafnium oxide dielectrics Dielectric layers containing a lanthanum hafnium oxide layer, where the lanthanum hafnium oxide layer is arranged as a structure of one or more monolayers, provide an insulating layer in a variety of structures for use in a wide range of electronic devices. ... 02/15/07 - 20070037414 - Switch element, memory element and magnetoresistive effect element A switch element includes a substrate; a plurality of carbon nanotubes provided upright on the substrate; magnetic particles arranged at tip ends of the carbon nanotubes respectively; and a plurality of conductive layers formed between base ends of the carbon nanotubes and the substrate. A switching operation of the switching ... 01/04/07 - 20070004234 - Fluids for immersion lithography systems Fluids for use in immersion lithography systems are disclosed. A resistivity-altering substance is introduced into a fluid, making it more conductive. The fluid is then disposed between an immersion head of a projection lens system and a semiconductor wafer during an exposure process. Because the fluid is conductive, electrostatic energy ... 12/07/06 - 20060276056 - Nanotube articles with adjustable electrical conductivity and methods of making the same Nanotube articles having adjustable electrical conductivity, and methods of making the same. A patterned article includes conducting nanotubes that define a plurality of conductive pathways along the article, and also includes nanotubes of modified electrical conductivity. The modified nanotubes may electrically isolate the conducting nanotubes from other conductors. The nanotube ... 10/26/06 - 20060240681 - Three-dimensional nanoscale crossbars Various embodiments of the present invention include three-dimensional, at least partially nanoscale, electronic circuits and devices in which signals can be routed in three independent directions, and in which electronic components can be fabricated at junctions interconnected by internal signal lines. The three-dimensional, at least partially nanoscale, electronic circuits and ... 10/26/06 - 20060240680 - Substrate processing platform allowing processing in different ambients A semiconductor wafer processing system including a factory interface operating at atmospheric pressure and mounting plural wafer cassettes and plural wafer processing chambers connected to the factory interface through respective slit valves. A robot in the factory interface can transfer wafers between the cassettes and the processing chambers. At least ... 10/05/06 - 20060223340 - Manufacturing managing method of semiconductor devices and a semiconductor substrate A managing method of manufacturing semiconductor devices is disclosed. The method comprises the steps of: providing at least one tag region on a semiconductor substrate in which plural semiconductor devices have been formed, the tag region being provided with a tag which can read/write information without making physical contact; writing ... 09/28/06 - 20060216955 - Laser-based termination of miniature passive electronic components Terminating the ends of passive electronic components entails applying a laser-removable coating to one or both of the opposed major surfaces of a substrate. A UV laser beam having a spot size and an energy distribution sufficient to remove the laser-removable coating from multiple selected regions of at least one ... 09/14/06 - 20060205240 - Fusing nanowires using in situ crystal growth Crystal growth performed in situ facilitates interconnection of prefabricated nano-structures. The nano-structures are immersed in a growth solution having a controllable saturation condition. Changing the saturation condition of the solution modifies a size of the immersed nanowires. The solution includes a solute of a nano-structure precursor material. The saturation condition ... 08/24/06 - 20060189172 - Method using specific contact angle for immersion lithography A method for performing immersion lithography on a semiconductor wafer is disclosed. The method includes positioning the semiconductor wafer beneath a lens and applying a fluid between a top surface of the semiconductor wafer and the lens. An additive can be provided to the top surface so that any droplet ... 08/24/06 - 20060189171 - Seasoning process for a deposition chamber A seasoning process for a deposition chamber, the process comprising providing a silicon-containing seasoning gas inside the deposition chamber; and forming a silicon-based seasoning film on at least one surface inside the deposition chamber, the seasoning film having a refractive index of about 1.48 or more. ... 07/06/06 - 20060148275 - Method of forming an alignment mark and manufacturing a semiconductor device using the same Embodiments of the present invention provide, among other things, a method of forming an alignment mark having a stepped structure without an additional process. The alignment mark may be used to prevent formation of a defect source in a semiconductor device. ... 06/29/06 - 20060141809 - Single side workpiece processing A centrifugal workpiece processor for processing semiconductor wafers and similar workpieces includes a head which holds and spins the workpiece. The head includes a rotor having a gas system. Gas is sprayed or jetted from inlets in the rotor to create a rotational gas flow. The rotational gas flow causes ... 06/22/06 - 20060134931 - Method for forming quantum dots A method for forming quantum dots includes the following steps: (a) depositing a metal layer (4) on a substrate (2); (b) using an atomic force microscope (AFM) probe (6) to form a plurality of nanopores (42) in the metal layer (4); (c) depositing a semiconductor layer (3) on the metal ... 06/15/06 - 20060128168 - Atomic layer deposited lanthanum hafnium oxide dielectrics Atomic layer deposited dielectric layers containing a lanthanum hafnium oxide layer and methods of fabricating such dielectric layers provide an insulating layer in a variety of structures for use in a wide range of electronic devices. In an embodiment, a lanthanum hafnium oxide layer is formed by depositing hafnium and ... 05/25/06 - 20060110945 - Method using specific contact angle for immersion lithography A method for performing immersion lithography on a semiconductor wafer is disclosed. The method includes positioning the semiconductor wafer beneath a lens and applying a fluid between a top surface of the semiconductor wafer and the lens. An additive can be provided to the top surface so that any droplet ... 05/04/06 - 20060094261 - Method for in-situ uniformity optimization in a rapid thermal processing system The present invention is directed to a method for thermally processing a substrate in a thermal processing system. The method comprises providing an amount of heat to the substrate and obtaining information associated with the substrate when the amount of heat is provided. For example, the substrate is provided at ... 03/16/06 - 20060057861 - Movable operating device and method of controlling the movable operating device The movable operating device includes a frame for fixedly supporting an object having a first surface, a plurality of movable members movably supported on the frame, and a movement control device for moving the movable members for positioning. At least one of the plurality of movable members includes an operating ... 02/23/06 - 20060040514 - Magnetic processing of electronic materials The electronic properties (such as electron mobility, resistivity, etc.) of an electronic material can be modified/enhanced when subjected to dynamic or stationary magnetic fields in conjunction with select cycles of heating, cooling and passage of electric current through the material. This “processing” includes one or more cycles using combinations of ... 01/12/06 - 20060009047 - Modular tool unit for processing microelectronic workpieces A modular apparatus for thermally processing a microelectronic workpiece is provided. The modular apparatus comprises a mounting module having a rotatable carousel assembly configured to support at least one workpiece. A driver is coupled to the carousel assembly and rotates the carousel assembly, moving the workpiece between a loading station, ... 11/17/05 - 20050255717 - Method of operating substrate processing device A substrate processing device 10 has a substrate transfer chamber 12 for moving, by a horizontal movement mechanism, storage trays 301, 302 for respectively storing one and two of the substrate support trays for supporting substrates in their vertical or substantially vertical state, to a substrate transfer position for effecting ... 11/10/05 - 20050250349 - High-resistance silicon wafer and process for producing the same A high-resistance silicon wafer is manufactured, in which a gettering ability and economical efficiency is excellent and an oxygen thermal donor is effectively prevented from being generated in a heat treatment for forming a circuit, which is to be implemented on the side of a device manufacturer. In order to ... 11/03/05 - 20050245101 - Methods and apparatus for transferring a substrate carrier within an electronic device manufacturing facility In a first aspect, a first method is provided for electronic device manufacturing. The first method includes the steps of (1) receiving a request to transfer a carrier from a first substrate loading station to a second substrate loading station of an electronic device manufacturing facility including a plurality of ... 10/20/05 - 20050233601 - System and method for controlling manufacturing processes, and method for manufacturing a semiconductor device A control system for a manufacturing process includes an inspection tool inspecting a dislocation image in semiconductor substrate processed by manufacturing processes; an inspection information input module configured to acquire the inspected dislocation image; a process condition input module acquiring process conditions of the manufacturing processes; a structure information input ... 10/20/05 - 20050233600 - Semiconductor device and method of its manufacture A semiconductor device comprising a vertical stack of layers, comprising: an active layer configured to support a two dimensional carrier gas having an excess of carriers; source and drain contacts provided to said active layer such that a current can flow between said source and drain contacts through said two ... 09/22/05 - 20050208781 - Crackstop with release layer for crack control in semiconductors Methods of forming and the integrated circuit device structure formed having vertical interfaces adjacent an existing crack stop around a perimeter of a chip, whereby the vertical interface controls cracks generated during side processing of the device such as dicing, and in service from penetrating the crack stop. The vertical ... 08/11/05 - 20050176264 - Process of forming silicon-based nanowires A process of forming silicon-based nanowires heats high-surface-oxygen-content silicon powders to initiate vapor-solid reaction to form nanowires. The reaction gas is charged to react with the Si powders to form the silicon-based nanowires such as silicon nanowires or SiC nanowires. With control of the reaction gas, the components of the ... 08/04/05 - 20050170670 - Patterning of sacrificial materials Methods and compositions for patterning sacrificial materials are provided. ... 07/21/05 - 20050159019 - Method for manufacturing large area stamp for nanoimprint lithography Provided is a method for manufacturing a large area stamp for nanoimprint lithography using a fabricated small area stamp. The method includes: fabricating a first small area stamp having a pattern less than a few hundred nanometers; and fabricating a second large area stamp having a pattern less than a ... 06/30/05 - 20050142898 - Method for manufacturing a nano-structured electrode of metal oxide The present invention relates to a method for manufacturing a nano-structured metal oxide electrode, and in particular, to a method for manufacturing a metal oxide electrode having a few tens or hundreds of nanometers in diameter that is well adapted to an electrode of a supercapacitor using an alumina or ... 06/16/05 - 20050130453 - Substrate processing apparatus and management method A variety of maintenance work is performed for each of operation units in a substrate processing apparatus. Doors are provided at given positions on sides of an apparatus space, each of which is provided with an interlock switch. An interlock release unit is provided near each of the doors for ... ### FreshPatents.com Support |