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Semiconductor Device Manufacturing: Process > Coating Of Substrate Containing Semiconductor Region Or Of Semiconductor Substrate > Combined With The Removal Of Material By Nonchemical Means Combined With The Removal Of Material By Nonchemical MeansCombined With The Removal Of Material By Nonchemical Means patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.03/01/07 - 20070049047 - Porous thin-film-deposition substrate, electron emitting element, methods of producing them, and switching element and display element A method of producing a porous thin-film-deposition substrate, which has the steps of: placing onto a substrate that has an electrostatic charge on its surface, fine particles with a surface electrostatic charge opposite to the electrostatic charge of the substrate surface, depositing a thin film on the fine-particle-placed substrate, and ... 12/21/06 - 20060286811 - Method of optically imaging and inspecting a wafer in the context of edge bead removal The present invention relates to a method of optically imaging a wafer with a photoresist layer, wherein an imaging area on the surface of the wafer is illuminated with light and a fluorescence image is taken in the imaging area based on the fluorescent light irradiated due to the illumination ... 09/21/06 - 20060211258 - Two-dimensional patterning method, electronic device using same, and magnetic device fabricating method A novel two-dimensional patterning method enabling two-dimension patterning without using any photosensitive material and ion milling, wherein a two-dimensional pattern is formed by destroying a blister provided on a substrate by electron or ion irradiation. ... 08/24/06 - 20060189152 - Slurry composition, method of polishing an object and method of forming a contact in a semiconductor device using the slurry composition In a slurry composition preventing damage to an insulation layer, and uniformly polishing a metal layer, the slurry composition includes an acidic aqueous solution having a first pH and an anionic surfactant having a second pH lower than or equal to the first pH. Irregular polishing of the metal layer ... 08/04/05 - 20050170661 - Method of forming a trench structure A method of fabricating a filled trench structure, the method including: (a) forming a first set of trenches in a first region of a substrate and forming a second set of trenches in a second region of the substrate, trenches in the first set of trenches having a higher aspect ... ### FreshPatents.com Support |