REGISTER now for FREE 
|
FREE patent keyword monitoring and additional FREE benefits. REGISTER now for FREE
|
|
|
Semiconductor Device Manufacturing: Process > Chemical Etching > Liquid Phase Etching > Electrically Conductive Material (e.g., Metal, Conductive Oxide, Etc.) Electrically Conductive Material (e.g., Metal, Conductive Oxide, Etc.)Electrically Conductive Material (e.g., Metal, Conductive Oxide, Etc.) patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.04/12/07 - 20070082498 - Method of cleaning a wafer A wafer having a metal layer inclding salicide regions and unreacted metal regions disposed thereon is provided. Subsequently, an acidic solution is provided to remove the unreacted metal regions. Following that, a cold APM solution is used to remove particles subsequent to using the acidic solution to remove the unreacted ... 12/28/06 - 20060292888 - Etchant, method for fabricating interconnection line using the etchant, and method for fabricating thin film transistor substrate using the etchant An etchant, a method for fabricating a multi-layered interconnection line using the etchant, and a method for fabricating a thin film transistor (TFT) substrate using the etchant. The etchant for the multi-layered line comprised of molybdenum/copper/molybdenum nitride illustratively includes 10-20 wt % hydrogen peroxide, 1-5 wt % organic acid, a ... 10/26/06 - 20060240676 - Lawn and garden battery clamp An improved battery cable clamp provides for toolless attachment of battery cable connectors to lawn and garden-type battery terminal posts utilizing a bossed handle, cam seat and thumbnut, preferably made of non-corrosive materials. ... 09/28/06 - 20060216943 - Method for forming metal line A method for forming a metal line is provided. The method includes: forming a metal structure with a specific grain size on a substrate; forming a first hard mask layer on the metal structure; forming a second hard mask layer on the first hard mask layer; forming a photoresist pattern ... 09/21/06 - 20060211257 - Compound, semiconductor component, and method for producing a semiconductor component comprising an organic memory material The invention relates to a compound comprising at least one memory unit consisting of an organic memory material, especially for use in CMOS structures, said compound being characterized by a) at least one first anchor group (1) provided with a reactive group for covalently bonding to a first electrode (10), ... 09/07/06 - 20060199394 - Etching solution, method of etching and printed wiring board There is provided an etching solution comprised of a cupric chloride solution and a high-concentration triazole type compound added to the cupric chloride solution and capable of forming an etching-inhibiting coating. In a process of forming a circuit pattern by etching with the etching solution, an etching-inhibiting coating is selected ... 05/18/06 - 20060105579 - Etchant for etching metal wiring layers and method for forming thin film transistor by using the same The present invention discloses an etchant for etching at least two different metal layers, the etchant comprising hydrogen peroxide (H2O2) and one of carboxylic acid, carboxylate salt, and acetyl group (CH3CO—). The present invention also discloses a method of fabricating a metal wiring on a substrate, the method comprising forming ... 03/02/06 - 20060046501 - Screening of electroless nickel/immersion gold-plated substrates with black pad defect A method, comprising immersing a package substrate used as part of a semiconductor device in a potassium iodide and iodine solution. The device comprises a substrate, a nickel layer abutting the substrate and comprising a black pad defect, and a gold layer abutting the nickel layer. The method also comprises ... 02/02/06 - 20060024974 - Surface treatment for oxidation removal in integrated circuit package assemblies Disclosed herein is a process for assembling an integrated circuit, as well as the assembly resulting from the process, employing a surface treatment of bondpad surfaces. In one aspect, a method of assembling an integrated circuit includes providing a substrate having electrical terminals on a first side of the substrate ... 12/01/05 - 20050266695 - Novel aqueous based metal etchant The present invention provides an aluminum etchant solution for etching an aluminum surface in the presence of solder bumps. The etchant solution includes about 42% to about 80% phosphoric acid; about 0.1% to about 6% nitric acid; about 5% to about 40% acetic acid; about 0.005% to about 5% of ... ### FreshPatents.com Support |