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Semiconductor Device Manufacturing: Process > Chemical Etching > Vapor Phase Etching (i.e., Dry Etching) > Utilizing Electromagnetic Or Wave Energy > Photo-induced Etching Photo-induced EtchingPhoto-induced Etching patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.08/17/06 - 20060183336 - Method of optimized stitching for digital micro-mirror device A method of providing a reticle layout for a die having at least three patterns, namely a right pattern, a center pattern, and a left pattern, where the center pattern is oversized relative to the photolithography step size. To avoid the non-uniformity effects resulting from stitching the center pattern, the ... 08/03/06 - 20060172543 - Graded junction termination extensions for electronic devices A graded junction termination extension in a silicon carbide (SiC) semiconductor device and method of its fabrication using ion implementation techniques is provided for high power devices. The properties of silicon carbide (SiC) make this wide band gap semiconductor a promising material for high power devices. This potential is demonstrated ... 05/25/06 - 20060110926 - Control of photoelectrochemical (pec) etching by modification of the local electrochemical potential of the semiconductor structure relative to the electrolyte A method for locally controlling an electrical potential of a semiconductor structure or device, and hence locally controlling lateral and/or vertical photoelectrochemical (PEC) etch rates, by appropriate placement of electrically resistive layers or layers that impede electron flow within the semiconductor structure, and/or by positioning a cathode in contact with ... 08/04/05 - 20050170658 - Methods for preparing ball grid array substrates via use of a laser The present invention relates to the use of a laser to remove surface contamination and oxidation from a ball grid array substrate. The laser etching can be configured to cover the entire substrate or pinpointed to the epoxy molding compound/solder resist (EMC/SR) interfaces. Additionally, a laser can be used to ... ### FreshPatents.com Support |