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Semiconductor Device Manufacturing: Process > Coating With Electrically Or Thermally Conductive Material > To Form Ohmic Contact To Semiconductive Material > Forming Solder Contact Or Bonding Pad > Bump Electrode > Including Fusion Of Conductor > By Wire Bonding By Wire BondingBy Wire Bonding patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.04/19/07 - 20070087553 - Semiconductor component and method for contracting said semiconductor component The semiconductor component has several regularly arranged active cells (1), each comprising at least one main defining line (8). A bonding wire (18, 20) is fixed to at least one bonding surface (14, 16) by bonding with a bonding tool, oscillating in a main oscillation direction (22, 24), for external ... 04/19/07 - 20070087552 - Method for simulating the movement of particles A method for determining the movement of particles, particularly impurities, in a medium, under the influence of a changing interface between two neighboring phases. In a first step, the temporal and/or local evolution of said interface is determined. In a second step, the movement of said particles in dependence of ... 04/19/07 - 20070087551 - Sacrificial inorganic polymer intermetal dielectric damascene wire and via liner The present invention provides a method of forming a rigid interconnect structure, and the device therefrom, including the steps of providing a lower metal wiring layer having first metal lines positioned within a lower low-k dielectric; depositing an upper low-k dielectric atop the lower metal wiring layer; etching at least ... 04/19/07 - 20070087550 - Low-voltage single-layer polysilicon eeprom memory cell The present invention is an electronic memory cell and a method for the cell's fabrication comprising a The first transistor configured to be coupled to a bit line. The first transistor has an essentially zero voltage drop when activated and is configured to control an operation of the memory cell. ... 02/22/07 - 20070042595 - Packaging of electronic chips with air-bridge structures A circuit assembly for fabricating an air bridge structure and a method of fabricating an integrated circuit package capable of supporting a circuit assembly including an air bridge structure. A circuit assembly comprises an electronic chip and a conductive structure embedded in a plurality of materials having a plurality of ... 01/18/07 - 20070015353 - Electrically connecting substrate with electrical device A substrate is electrically connected with an electrical device mounted on the substrate. A ball bond is formed between a first end of a wire and a bonding pad of the substrate. A reverse-motion loop is formed within the wire. A bond is formed between a second end of the ... 01/18/07 - 20070015352 - Method of realizing thermosonic wire bonding between metal wires and copper pads by depositing a thin film to surface of semiconductor chip with copper pads Disclosed is a method of realizing thermosonic wire bonding between metal wires and copper pads by depositing a thin film to surfaces of semiconductor chips with copper pads, where a thin film that provides the effect of self-passivation to prevent oxidization of the copper pads located thereunder is deposited on ... 11/23/06 - 20060264024 - Integrated circuit with substantially perpendicular wire bonds A method for performing a wire-bonding operation in an integrated circuit utilizes a bonding tool. A wire is bonded to a first bond site in the integrated circuit, and terminated at a second bond site in the integrated circuit. The bonding and terminating steps are repeated for a plurality of ... 09/21/06 - 20060211234 - Re-assembly process for mems structures Methods of fabricating an array of aligned microstructures on a substrate are disclosed. The microstructures may be spring contacts or other microelements. The methods disclosed include construction of an alignment substrate, alignment of die elements with the alignment substrate, and fixation of the aligned die elements to a backing substrate. ... 08/24/06 - 20060189119 - Encapsulation of circuit components to reduce thermal cycling stress A method of encapsulating materials to protect circuit components from the stress of thermal cycling includes applying a first substance to cover Wire bonds on a first layer, applying a second substance to wire bonds on a second layer, and curing the first and second substances by application of heat ... 08/03/06 - 20060172524 - Methods and apparatus for integrated circuit ball bonding with substantially perpendicular wire bond profiles Techniques for ball bonding wires in an integrated circuit are provided which allow formation of desired wire bond profile shapes for optimal performance. A wire is ball bonded to a first bond site in the integrated circuit with a bonding tool and at least one bend is formed in the ... 05/25/06 - 20060110908 - Method for forming wiring pattern, method for manufacturing device, device, electro-optic apparatus, and electronic equipment A method for forming a wiring pattern according to an aspect of the invention forms a wiring pattern in a certain area on a substrate by using a droplet discharge technique, and comprises forming a bank surrounding the certain area on the substrate; discharging a first functional liquid containing a ... 05/11/06 - 20060099792 - Tolerance bondwire inductors for analog circuitry Disclosed are wirebonding methods wherein bondwires are positioned using dynamically determined variations in die placement. Preferred methods of the invention include steps for placing a die on the prepared substrate using selected ideal placement coordinates. Deviation of the actual die placement from the selected ideal placement coordinates is monitored, and ... 12/01/05 - 20050266672 - Wire-bonding method for chips with copper interconnects by introducing a thin layer A wire-bonding method for chips with copper interconnects by introducing a thin layer is provided for solving the problem of oxidizing a copper bonding-pad during bonding processing in order not to deteriorate the bonding strength and yield rate thereof. The wire-bonding method of the present invention comprises: a step for ... 11/10/05 - 20050250306 - Method for manufacturing a semiconductor substrate and method for manufacturing an electro-optical device A method is provided including, after joining a wiring substrate and an element substrate, separating a second substrate of the element substrate from a semiconductor element, and electrically coupling an element-side terminal that has been exposed by the separation to a wiring-side terminal disposed outside the semiconductor element by electroless ... 11/03/05 - 20050245062 - Single row bond pad arrangement An integrated circuit chip with its interconnecting pads re-arranged in substantially a straight line. The pads are ordered in the straight line so that wire bond connections to contact terminal of an IC package allows the wire bonds to not interfere with each other by traveling under or over other ... 09/01/05 - 20050191839 - Multiple-ball wire bonds The invention provides a wire bond comprising multiple ball bonds and a method of forming the wire bond to bond a wire to a connection pad of an electronic device. The wire bond comprises a first bump ball formed on the connection pad and a second bump ball formed on ... 07/28/05 - 20050164486 - Semiconductor substrates including i/o redistribution using wire bonds and anisotropically conductive film, methods of fabrication and assemblies including same Methods and apparatus for eliminating wire sweep and shorting while avoiding the use of under-bump metallization and high cost attendant to the use of conventional redistribution layers. An anisotropically conductive (z-axis) conductive layer in the form of a film or tape is applied to the active surface of a die ... ### FreshPatents.com Support |