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Semiconductor Device Manufacturing: Process > Semiconductor Substrate Dicing > By Electromagnetic Irradiation (e.g., Electron, Laser, Etc.) By Electromagnetic Irradiation (e.g., Electron, Laser, Etc.)By Electromagnetic Irradiation (e.g., Electron, Laser, Etc.) patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.10/05/06 - 20060223285 - Semiconductor wafer treatment method A semiconductor wafer treatment method for dividing an adhesive tape, which has been stuck to the entire back of a semiconductor wafer, along divided streets of the semiconductor wafer. Before division of the adhesive tape by application of laser beams, the state of the divided streets is detected, and laser ... 10/05/06 - 20060223284 - Semiconductor wafer coat layers and methods therefor Formulations and processes for forming wafer coat layers are disclosed. In one embodiment, an organic surface protectant is incorporated into a wafer coat formulation deposited onto a semiconductor wafer prior to the laser scribe operation. Upon removal of the wafer coat layer, the organic surface protectant remains on the bumps ... 09/14/06 - 20060205184 - Partially transparent photovoltaic modules A photovoltaic cell comprising a supporting substrate, a front contact layer on the substrate, a layer or layers of semiconductor material and a back contact layer comprising a metal, the back contact having areas without metal thereby permitting the passage of light through the cell. ... 09/14/06 - 20060205183 - Wafer laser processing method and laser beam processing machine A wafer laser processing method for forming grooves along dividing lines on a wafer, which has a plurality of areas that are sectioned by the dividing lines formed in a lattice pattern on the front surface of a substrate and in which a device is formed in the above respective ... 07/20/06 - 20060160332 - Method and system for high-speed precise laser trimming, scan lens system for use therein and electrical device produced thereby A method, system and scan lens system are provided for high-speed, laser-based, precise laser trimming at least one electrical element. The method includes generating a pulsed laser output having one or more laser pulses at a repetition rate. Each laser pulse has a pulse energy, a laser wavelength within a ... 07/20/06 - 20060160331 - Laser processing method and laser processing apparatus A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface ... 07/06/06 - 20060148213 - Method of manufacturing display device Y-scribe lines are successively formed substantially in parallel in a first direction of a work that constitutes a display device. An X-scribe line is formed in a second direction that intersects the first direction of the work. The X-scribe line is formed between the Y-scribe lines and is spaced apart ... 07/06/06 - 20060148212 - Method for cutting semiconductor substrate Multiphoton absorption is generated, so as to form a part which is intended to be cut 9 due to a molten processed region 13 within a silicon wafer 11, and then an adhesive sheet 20 bonded to the silicon wafer 11 is expanded. This cuts the silicon wafer 11 along ... 06/22/06 - 20060134886 - Manufacturing method of semiconductor device Island-like semiconductor films and markers are formed prior to laser irradiation. Markers are used as positional references so as not to perform laser irradiation all over the semiconductor within a substrate surface, but to perform a minimum crystallization on at least indispensable portion. Since the time required for laser crystallization ... 06/15/06 - 20060128120 - Short-wavelength laser dicing apparatus for a diamond wafer and dicing method thereof The present invention discloses a short-wavelength laser dicing apparatus for a diamond wafer and a dicing method thereof, wherein a diamond wafer is disposed on a working table; the diamond wafer has multiple scribed lines; a control device is used to position the working table and a short-wavelength laser so ... 05/25/06 - 20060110894 - Manufacturing method of semiconductor laser devices and manufacturing apparatus of the same The present invention is to provide a semiconductor laser device manufacturing method for realizing highly reliable semiconductor laser devices. The semiconductor laser device manufacturing method includes: cutting a wafer into bar-shaped wafers by scanning an electron beam on the front side of the wafer on which a semiconductor laser structure ... 05/18/06 - 20060105546 - Wafer dividing method A method of dividing a wafer having a plurality of micro electro mechanical systems and a plurality of streets for partitioning the micro electro mechanical systems formed on the front surface of a wafer substrate, the method comprising a protective tape affixing step for affixing a protective tape to the ... 05/11/06 - 20060099774 - Method of laser processing a gallium nitride substrate A method of laser processing a gallium nitride substrate, for forming a dividing groove along dividing lines that section devices formed on a gallium nitride substrate, the method comprising the step of applying a pulse laser beam having a wavelength of 200 to 365 nm along the dividing lines that ... 04/27/06 - 20060088984 - Laser ablation method A combination of specific laser pulse durations and repetition rates are incorporated into a semiconductor wafer laser scribing/dicing process. The disclosed combination can reduce factors that contribute to thermal effects, explosive melting and evaporation, and laser/plasma interactions, thereby reducing problems with microcracks, delamination, and particles that can affect semiconductor die ... 03/16/06 - 20060057823 - Method for manufacturing a moulded mmc multi media card package obtained with laser cutting A method is provided for manufacturing a fully moulded Multi Media Card package obtained by laser cutting wherein at least some edges and the corners around the package have rounded profile and a sufficient smoothness for a safe handling. The method includes providing a rounded groove on a substrate back ... 03/16/06 - 20060057822 - Chip dicing A semiconductor structure and method for chip dicing. The method comprises the steps of (a) providing a semiconductor substrate; (b) forming first and second device regions of first and second chips, respectively, in and at top of the semiconductor substrate, wherein the first and second chips are separated by a ... 02/23/06 - 20060040473 - Laser processing method and laser processing apparatus A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface ... 01/12/06 - 20060009008 - Method for the laser processing of a wafer A method for the laser processing of a wafer having a plurality of devices which are composed of a laminate consisting of an insulating film and a functional film on the front surface of a substrate, the method comprising applying a pulse laser beam along streets for sectioning the plurality ... 12/15/05 - 20050277270 - Wafer processing method A wafer processing method for carrying out processing by applying a laser beam along streets formed on a wafer, comprising a step of applying a laser beam at an incident angle of a predetermined inclination angle to the normal line of a processing surface of the wafer while the wafer ... 10/27/05 - 20050239270 - Method for producing a semiconductor element A method for producing a semiconductor component, in particular a thin-film component, a semiconductor layer being separated from a substrate by irradiation with a laser beam having a plateaulike spatial beam profile. Furthermore, the semiconductor layer, prior to separation, is applied to a carrier with an adapted thermal expansion coefficient. ... 10/13/05 - 20050227456 - Cutting thin layer(s) from semiconductor material(s) An apparatus for cutting at least one thin layer from a substrate or ingot forming element for an electronic or optoelectronic or optical component or sensor. This apparatus includes a device for directing a pulse of energy into the substrate or forming element wherein the pulse has a duration shorter ... 09/22/05 - 20050208737 - Steam oxidation apparatus The steam oxidation apparatus 78 is an apparatus used for forming the current confinement structure into the surface-emitting laser element by subjecting the high-Al-content layer to steam oxidation, and is equipped with a reactor 42 for the steam oxidation, a steam-accompanied inert gas system for supplying a steam-accompanied inert gas ... 09/15/05 - 20050202651 - Methods and apparatus relating to singulating semiconductor wafers and wafer scale assemblies Methods relating to the singulation of dice from semiconductor wafers. Trenches or channels are formed in the bottom surface of a semiconductor wafer, corresponding in location to the wafer streets. The trenches may be formed by etching or through an initial laser cut. The wafer is then singulated along the ... 08/18/05 - 20050181581 - Laser processing method and laser processing apparatus A laser beam machining method and a laser beam machining device capable of cutting a work without producing a fusing and a cracking out of a predetermined cutting line on the surface of the work, wherein a pulse laser beam is radiated on the predetermined cut line on the surface ... 08/04/05 - 20050170616 - Wafer dividing method A method of dividing, along dividing lines, a wafer having function elements formed in areas sectioned by the dividing lines formed in a lattice pattern on the front surface, which comprises: a protective member affixing step for affixing a protective member to the front surface of the wafer; a polishing ... 07/14/05 - 20050153525 - Method and apparatus for cutting devices from substrates A method and system for cutting a wafer comprising a semiconductor substrate attached to an array of integrated devices includes placing the wafer on a stage such as a movable X-Y stage including a vacuum chuck having a porous mounting surface, and securing the wafer during and after cutting by ... ### FreshPatents.com Support |