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Semiconductor Device Manufacturing: Process > Semiconductor Substrate Dicing Semiconductor Substrate DicingSemiconductor Substrate Dicing patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.04/19/07 - 20070087532 - Method for applying a structure of joining material to the back surfaces of semiconductor chips A structure of joining material is applied to the back surfaces of semiconductor chips in manufacturing semiconductor devices. The joining material is applied, in finely metered and structured form via a joining material jet appliance, to the back surfaces of the semiconductor chips of a divided semiconductor wafer. ... 04/05/07 - 20070077732 - Semiconductor device and a manufacturing method of the same The present invention enhances the processing efficiency of assembling of a semiconductor device. After performing resin molding by a through-gate method, the package dicing is performed such that leads and inclined portions of sealing bodies are cut while adhering a dicing tape to front surfaces of a plurality of sealing ... 03/01/07 - 20070048972 - Method and apparatus for breaking semiconductor wafers An apparatus and method for breaking a semiconductor wafer along scribe lines to separate individual die. A scribe line of the wafer is aligned with a straight, elongated pyramid-shaped edge of a precision bending bar, and a compressive force is applied to the surface of the wafer by a compressive ... 02/22/07 - 20070042568 - Semiconductor device with a thinned semiconductor chip and method for producing the thinned semiconductor chip A semiconductor device with a thinned semiconductor chip and a method for producing the latter is disclosed. In one embodiment, the thinned semiconductor chip has a top side with contact areas and a rear side with a rear side electrode. In this case, the rear side electrode is cohesively connected ... 02/01/07 - 20070026640 - Method for adhering protecting tape of wafer and adhering apparatus A method for adhering a protecting tape to a protection surface of a wafer is disclosed. The method comprises: cutting the protecting tape of which one surface is processed to be an adhering surface into predetermined size and shape; storing the protecting tape so as to release tensile force therein; ... 01/04/07 - 20070004180 - Manufacturing method of semiconductor integrated circuit device When reducing the thickness of a semiconductor wafer, so that a crushing layer which is relatively thin and has gettering function of, for example, less than 0.5 □m, less than 0.3 □m or less than 0.1 □m in thickness may be formed at the back surface, and the die strength ... 01/04/07 - 20070004179 - Wafer dividing method A method of dividing a wafer having a plurality of devices, which are formed in a plurality of areas sectioned by streets formed in a lattice pattern on the front surface and test metal patterns which are formed on the streets, comprising: a metal pattern breaking step for forming a ... 01/04/07 - 20070004178 - Manufacturing method of semiconductor device To provide a semiconductor device including a thinned substrate with high yield. After forming a protective layer in a predetermined portion (at least a portion covering a side surface of a substrate) of the substrate, grinding and polishing of the substrate are performed. In other words, an element layer including ... 01/04/07 - 20070004177 - Wafer processing method To prevent cracks from appearing in a wafer when tape is affixed to or peeled off a wafer in a state where the streets break easily preventing damage to or deterioration in the quality of the devices, in a wafer processing method including steps of performing a pre-process on a ... 01/04/07 - 20070004176 - Thin film splitting method A method of fabricating thin films of semiconductor materials by implanting ions in a substrate composed of at least two different elements at least one of which can form a gaseous phase on bonding with itself and/or with impurities includes the following steps: (1) bombarding one face of the substrate ... 01/04/07 - 20070004175 - Semiconductor wafer cutting blade and method The invention provides apparatus and methods for sawing and singulating individual devices from a silicon or glass-bonded semiconductor wafer. Using methods of the invention, wafer device singulation includes a step of sawing kerfs approximately coinciding with the peripheries of numerous devices arranged on a wafer. Kerfs are also sawn into ... 01/04/07 - 20070004174 - Semiconductor wafer sawing system and method The invention provides methods and systems for sawing and singulating individual semiconductor devices manufactured on a wafer. Pursuant to the systems and methods of the invention, a wafer is secured for sawing and is then presented to a saw blade. At least one parameter associated with sawing the wafer is ... 12/28/06 - 20060292832 - Method of working nitride semiconductor crystal In a method of working a crystal, when a nitride semiconductor crystal is worked, voltage is applied between the nitride semiconductor crystal and a tool electrode to cause electrical discharge, so that the crystal is partially removed and worked by local heat generated by the electrical discharge. ... 12/28/06 - 20060292831 - Spacer die structure and method for attaching A semiconductor spacer structure comprises in order a backgrinding tape layer, a spacer adhesive layer, a semiconductor spacer layer, an optional second spacer adhesive layer, a dicing tape layer. In a first method a spacer wafer having first and second sides, a backgrinding tape layer and a spacer adhesive layer ... 12/28/06 - 20060292830 - Chip dicing A semiconductor structure and method for chip dicing. The method includes (a) providing a semiconductor substrate and (b) forming first and second device regions in and at top of the substrate. The first and second device regions are separated by a semiconductor border region of the substrate. The method further ... 12/28/06 - 20060292829 - Apparatus and method of wafer dicing A wafer dicing method includes the following steps. First, the wafer is adhered on an adhesive material. Next, the adhesive material is disposed on a frame. Then, the frame is clamped by a fixture, for fixing the wafer. Afterwards, a roller rotates against the adhesive material, for applying a force ... 12/28/06 - 20060292828 - Wafer and method of cutting the same A method of cutting a wafer. First, the first substrate and the second substrate are provided. Next, several alignment marks are formed on the backside of the second substrate to form two reference coordinate axes. Then, the first substrate and the second substrate are assembled to form a wafer. The ... 12/28/06 - 20060292827 - Chemical die singulation technique A method is provided for manufacturing a semiconductor device from a substrate (200) having an active surface (204) and a non-active surface (206). The method comprises depositing a backing material (104) onto the non-active surface of the substrate (206) in a pattern (500), the pattern (500) having at least a ... 12/21/06 - 20060286773 - Wafer dicing process for optical electronic packing A wafer dicing process for optical electronic packing is provided. The process includes: providing a first wafer (glass wafer) and a second wafer (interposer wafer); etching the second wafer to form a reference plane coordinate; laminating the first wafer on the second wafer, providing a third wafer (CMOS wafer); laminating ... 12/21/06 - 20060286772 - Method of cross-section milling with focused ion beam (fib) device A method of milling a cross section of a wafer and a milling device. The method includes a coarse scanning of at least two milling frames and a fine scanning of at least one milling frame. The milling device is adapted to cross-section milling of a wafer, said milling includes ... 12/07/06 - 20060276009 - Method for cutting junction board, and chip A junction board cutting method includes, upon cutting a junction board formed by bonding a second main surface of a first substrate having a first main surface provided with chip areas and scribe areas demarcating the chip areas from one another and the second main surface, and a fourth main ... 11/30/06 - 20060270195 - Method for manufacturing semiconductor device It is an object to improve a yield of a step of cutting off a substrate. A substrate is cut off by using an ablation process. An ablation process uses a phenomenon in which a molecular bond in a portion irradiated with a laser beam, that is, a portion which ... 11/30/06 - 20060270194 - Semiconductor package and method for forming the same Semiconductor packages (100) that prevent the leaching of gold from back metal layers (118) into the solder (164) during the die attachment process and methods for fabricating the same are provided. A method in accordance with the invention comprises providing a semiconductor wafer stack (110) including a plurality of metal ... 11/09/06 - 20060252232 - Circuit device and method of manufacturing thereof A circuit device of preferred embodiments of the present invention includes: a circuit element with electrodes formed in a peripheral part thereof; connecting portions connected to surfaces of the electrodes; and redistribution lines which are continuous to the respective connecting portions and extended in parallel to the main surface of ... 10/19/06 - 20060234476 - Electronic component and method for its production An electronic component includes a semiconductor die which exhibits on its active top side above an active surface area a self-supporting electrically conductive cover layer which is supported by through lines and forms a hollow space to the active surface area. A method for producing the electronic component includes additional ... 10/19/06 - 20060234475 - Method for manufacturing semiconductor device Disclosed herein is a method for manufacturing a semiconductor device. According to the present invention, a dummy contact hole is formed in a scribe lane by employing a direct polyimide etching (‘DPE’) process reducing the two steps of a masking process to one step and a passivation layer filling up ... 09/28/06 - 20060216911 - Wafer laser processing method A wafer laser processing method for forming a groove in a wafer having a protective film on the processing surface of a substrate along a predetermined processing line, comprising a first step for forming a first groove in the protective film along the dividing lines by applying a first pulse ... 09/14/06 - 20060205182 - Method for manufacturing semiconductor device A method of dicing a semiconductor wafer includes providing an interconnect layer providing a protective film on the interconnect layer on the side of a device-forming surface of a silicon wafer, irradiating the protective film with a laser beam to provide a trenched portion that extends through the interconnect layer ... 09/07/06 - 20060199354 - Method and system for high-speed precise laser trimming and electrical device produced thereby A method and system are provided for high-speed, laser-based, precise laser trimming at least one electrical element along a trim path. The method includes generating a pulsed laser output with a laser, the output having one or more laser pulses at a repetition rate. A fast rise/fall time, pulse-shaped q-switched ... 08/31/06 - 20060194416 - Method for producing single crystal ingot from which semiconductor wafer is sliced A method of manufacturing single-crystal semiconductor blocks is characterized in that a plurality of single-crystal semiconductor blocks of a relatively small diameter desired by users are cut out from a single-crystal semiconductor block of a relatively large diameter. With this method, there can also be obtained a secondary effect that ... 08/24/06 - 20060189101 - Dbg system and method with adhesive layer severing An array of grooves (23) is formed in a first side (12) of a wafer (10) during a wafer processing method. A back grinding tape (16) is adhered to the first side. An amount of material is removed from the second side (20) of the wafer. An adhesive layer (30) ... 08/24/06 - 20060189100 - Method for cutting a wafer using a protection sheet The method for dicing a wafer comprising the steps of: reducing a thickness of a wafer to at least 0.1 mm or less; forming a protection sheet tightly on one side of the wafer, the protection sheet having a Vickers hardness of 2 or more; and dicing the wafer by ... 08/24/06 - 20060189099 - Method of cutting integrated circuit chips from wafer by ablating with laser and cutting with saw blade A method of cutting an integrated circuit chip from a wafer having a plurality of integrated circuit chips is provided. An upper portion of the wafer is ablated using two laser beams to form two substantially parallel trenches that extend into the wafer from a top surface of the wafer ... 08/24/06 - 20060189098 - Substrate removal process for high light extraction leds A method for fabricating light emitting diode (LEDs) comprises providing a plurality of LEDs on a substrate wafer, each of which has an n-type and p-type layer of Group-III nitride material formed on a SiC substrate with the n-type layer sandwiched between the substrate and p-type layer. A conductive carrier ... 08/17/06 - 20060183298 - Method for manufacturing a ceramic/metal substrate The invention relates to a novel method for producing a metal/ceramic substrate, which is characterized by applying at least one metal area to at least one top surface of a ceramic layer. At least one metal area is applied to at least one surface side of a ceramic layer, wherein ... 07/27/06 - 20060166465 - Method of dividing wafer To eliminate necessity of separation of a resist film in dicing by etching and thus improve productivity and die strength of a device, thickness of the resist film is adjusted such that when street-correspondent-areas are separated by etching, resist films coated on portions other than the street-correspondent-areas are not remained. ... 07/27/06 - 20060166464 - Method and device for machining a wafer, in addition to a wafer comprising a separation layer and a support layer A process and an apparatus are described for the treatment of wafers, in particular for the thinning of wafers. A wafer with a carrier layer and an interlayer arranged between the carrier layer and the wafer is also described, in which the interlayer is a plasmapolymeric layer that adheres to ... 07/20/06 - 20060160330 - Semiconductor device and manufacturing method thereof A method of manufacturing a semiconductor device includes: preparing a semiconductor element having a first metal layer made of first metal on a surface thereof, and a metal substrate made of second metal, the metal substrate having a fourth metal layer made of fourth metal on a surface thereof, and ... 07/13/06 - 20060154447 - Method for manufacturing semiconductor device A method for manufacturing a semiconductor device comprises the steps of forming protruded electrodes on a plurality chip areas of a semiconductor wafer having the plurality of chip areas and boundary regions formed among the chip areas, both being provided in a surface of the semiconductor wafer, forming a surface-side ... 07/06/06 - 20060148210 - Laser beam processing machine A laser beam processing machine comprising a chuck table for holding a workpiece, a laser beam application means for applying a laser beam to the workpiece held on the chuck table, and a processing-feed means for moving the chuck table and the laser beam application means relative to each other, ... 06/29/06 - 20060141750 - Semiconductor integrated device and method for manufacturing same A method for manufacturing a semiconductor integrated device includes steps of forming an integrated circuit element on a semiconductor substrate, forming internal wiring, forming a groove along a scribe line on a back surface of the semiconductor substrate to expose a portion of the internal wiring, forming a metal film ... 06/22/06 - 20060134885 - Method of machining substrate and method of manufacturing element A method of machining a substrate etches a substrate according to a predetermined length and depth from an intersection between a first predetermined dividing line and a second predetermined dividing line, which cross each other in a T-shaped line, along the second predetermined dividing line of the predetermined dividing lines ... 06/22/06 - 20060134884 - Wafer structure, chip structure, and fabricating process thereof A chip fabricating process with the following steps is provided. Firstly, an under ball metal (UBM) layer is formed on a plurality of bump pads and wire pads of a wafer. Then, a portion of the thickness of the UBM layer on the wire pads is removed so as to ... 06/15/06 - 20060128119 - Semiconductor device fabrication method According to the present invention, there is provided a semiconductor device fabrication method comprising: forming a circuit pattern of a semiconductor element and a ground pad connected to a ground interconnection of said circuit pattern, in a semiconductor chip region divided into a plurality of portions on a main surface ... 06/08/06 - 20060121697 - Substrate dividing method A substrate dividing method which can thin and divide a substrate while preventing chipping and cracking from occurring. This substrate dividing method comprises the steps of irradiating a semiconductor substrate 1 having a front face 3 formed with functional devices 19 with laser light while positioning a light-converging point within ... 06/01/06 - 20060115962 - Method for manufacturing semiconductor device The inventive method for manufacturing a semiconductor device is a method for manufacturing a semiconductor device using irradiation with laser light to partition a substrate having semiconductor layers formed thereon, with gallium contained in at least one of the substrate and the semiconductor layers, wherein the method comprises: forming grooves ... 05/18/06 - 20060105545 - Methods for dicing a released cmos-mems multi-project wafer Simple but practical methods to dice a CMOS-MEMS multi-project wafer are proposed. On this wafer, micromachined microstructures have been fabricated and released. In a method, a photoresist is spun on the full wafer surface, and this photoresist is thick enough to cover all cavities and structures on the wafer, such ... 05/18/06 - 20060105544 - Protective film agent for laser dicing and wafer processing method using the protective film agent A protective film agent for laser dicing according to the present invention comprises a solution having, dissolved therein, a water-soluble resin and at least one laser light absorber selected from the group consisting of a water-soluble dye, a water-soluble coloring matter, and a water-soluble ultraviolet absorber. The protective film agent ... 05/04/06 - 20060094210 - Semiconductor wafer processing method and processing apparatus A method of processing a semiconductor wafer having circuits which are formed in a plurality of rectangular areas sectioned by streets arranged in a lattice pattern on the front surface, comprising: a grinding step of grinding the back surface of the semiconductor wafer to a predetermined thickness; and an oxide ... 05/04/06 - 20060094209 - Wafer processing method To divide into individual devices efficiently in dicing a wafer without causing quality of the devices to lower, a wafer processing method includes steps of coating a rear surface of the wafer with a resist film, exposing and sensitizing portions of the resist film other than regions corresponding to the ... 05/04/06 - 20060094208 - Method for reducing semiconductor die warpage An anti-warpage backgrinding tape (11) is secured to the circuit side (12) of a semiconductor wafer (14). The backside (16) of the wafer is background. The backside of the wafer is secured to dicing tape (18) so that the anti-warpage backgrinding tape is exposed. The wafer is diced to create ... 04/27/06 - 20060088982 - System method and apparatus for dry-in, dry-out, low defect laser dicing using proximity technology A substrate processing system includes a first, movable surface tension gradient device, a dicing device and a system controller. The first, movable surface tension gradient device is capable of supporting a first process within a first meniscus. The first meniscus being supported between the first surface tension gradient device and ... 04/27/06 - 20060088981 - Wafer packaging and singulation method A method includes providing a micro device wafer having micro devices supported by a wafer substrate and a multi-device lid substrate coupled to and spaced from the wafer substrate. The method further includes sawing through the multi-device lid substrate to a depth between the wafer substrate and the lid substrate. ... 04/27/06 - 20060088980 - Method of singulating electronic devices A method of singulating electronic devices, including aligning a saw blade over a lid street disposed on a lid substrate that is disposed over a device substrate. An electronic device that includes a bond pad is disposed on the device substrate, wherein the lid street is disposed over the bond ... 04/20/06 - 20060084241 - Apparatus for controlled fracture substrate singulation An apparatus and a system for separating dice from a substrate are described herein. ... 04/20/06 - 20060084240 - Apparatus and method for packaging circuits Methods for forming an edge contact on a die and edge contact structures are described. The edge contacts on the die do not increase the height of the die. The edge contacts are positioned on the periphery of a die. The edge contacts are positioned in the saw streets. Each ... 04/20/06 - 20060084239 - Wafer dividing method A method of dividing a wafer having a plurality of dividing lines formed in a lattice pattern on the front surface, into individual chips along the dividing lines, the method comprising: a deteriorated layer forming step for forming a deteriorated layer in the inside of the wafer by applying a ... 04/13/06 - 20060079072 - Method for precision integrated circuit die singulation using differential etch rates A preprocessed semiconductor substrate such as a wafer is provided with a metal etch mask which defines singulation channels on the substrate surface. An isotropic etch process is used to define a singulation channel with a first depth extending into the semiconductor substrate material A second anisotropic etch process is ... 04/06/06 - 20060073677 - Wafer dividing method and dividing apparatus A method of dividing a wafer whose strength is reduced along a plurality of dividing lines formed in a lattice pattern on the front surface, along the dividing lines, comprising the steps of: a tape affixing step for affixing a protective tape to one side of the wafer; a wafer ... 04/06/06 - 20060073676 - Pre-process before cutting a wafer and method of cutting a wafer A pre-process before cutting a wafer is described. The wafer comprises a plurality of scribe lines and a plurality of dies defined by the scribe lines, and a material layer covers the wafer. A pre-processing step is performed to remove the material layer on the scribe lines close to the ... 03/30/06 - 20060068567 - Method for chip singulation The present invention is related to a method for singulating chips from a stack of layers, such as the layers on a wafer or substrate. The stack of layers includes a front end of line (FEOL) layer upon the substrate layer, with the substrate layer having a first surface and ... 03/23/06 - 20060063357 - Singulation method used in image sensor packaging process and support for use therein A singulation method used in a process for making a plurality of image sensor packages is disclosed. Firstly, a semi-finished product including a plurality of package structures formed on a substrate is placed on a support having a plurality of cavities for receiving the package structures. Then, the semi-finished product ... 03/09/06 - 20060051938 - Wafer back side coating to balance stress from passivation layer on front of wafer and be used as die attach adhesive A method for balancing layer-caused compressive or tensile stress in a semiconductor die, die wafer or similar substrate uses a stress-balancing layer (SBL) attached to the opposite side from the stress-causing layer before the die or wafer is significantly warped are provided. The SBL may also serve as, or support, ... 03/02/06 - 20060046436 - Manufacturing method of stack-type semiconductor device A manufacturing method of a semiconductor device capable of mounting semiconductor elements having different functions without increasing the area of the semiconductor device, wherein a part of a wiring is formed at the side surface of a semiconductor element, and bump electrodes are formed so as to be nearly on ... 03/02/06 - 20060046435 - Laser beam processing apparatus for processing semiconductor wafer in production of semiconductor devices, laser beam processing method executed therein, and such semiconductor wafer processed thereby In a laser beam processing apparatus that processes a semiconductor wafer having a multi-layered wiring structure formed thereon, scribe lines defined thereon, and at least one alignment mark formed on any one of the scribe lines, a laser beam generator system generates a laser beam, and a movement system relatively ... 03/02/06 - 20060046434 - Method for reducing lead precipitation during wafer processing A method for preventing lead precipitation during wafer processing is disclosed. The method includes singulating a semiconductor wafer having a plurality of solder bumps and applying cold deionized (DI) water to the semiconductor wafer during singulation. Application of the cold DI water reduces or prevents lead precipitation during the singulation ... 02/23/06 - 20060040472 - Method for separating semiconductor substrate A method of separating a semiconductor substrate having an implementation member attached thereon includes a dividing process for at least the implementation member on the semiconductor substrate along a separation line, a placing process for film member on a same side as the implementation member, a forming process area by ... 02/09/06 - 20060030127 - Method of fabricating semiconductor device A semiconductor device has a resin package layer on a principal surface of a semiconductor chip, on which a number of bump electrodes are formed, wherein the semiconductor device has a chamfer surface or a stepped surface on a top edge part such that the external shock or stress applied ... 02/09/06 - 20060030126 - Method for producing semiconductor elements A method for producing semiconductor elements comprises forming a hydrogen-correlated doping in a treatment region The treatment region comprises at least part of a region which (i) lies outside an inner contiguous zone containing an integrated semiconductor circuit arrangement but not the respective associated separating zones and (ii) lies within ... 02/09/06 - 20060030125 - Laser separation of encapsulated submount In a light emitting package fabrication process, a plurality of light emitting chips (10) are attached on a sub-mount wafer (14). The attached light emitting chips (10) are encapsulated. Fracture-initiating trenches (30, 32) are laser cut into the sub-mount wafer (14) between the attached light emitting chips (10) using a ... 02/02/06 - 20060024920 - Method for positioning dicing line of wafer A method for positioning a dicing line includes the steps of: bonding an adhesive tape on a semiconductor layer of a wafer; detecting an image of the wafer by an imaging device on the basis of a light transmitted through the wafer; and determining the dicing line of the wafer ... 02/02/06 - 20060024919 - Method and apparatus for micro-electro mechanical system package A method of manufacturing a multi-substrate semiconductor package. The method includes providing a first substrate with a plurality of first dies present thereon and forming a plurality of electrical contacts on an upper surface of a lateral extension portion of at least one of the plurality of first dies on ... 12/29/05 - 20050287769 - Substrate production apparatus for producing a substrate for a display device A substrate production apparatus for producing a substrate for a display device is disclosed. The substrate production apparatus includes a first production apparatus including a first scriber to scribe a first mother substrate into at least one first model substrate and at least one second model substrate, a first grinder ... 12/29/05 - 20050287768 - Method and apparatus for cleaving brittle materials An apparatus for cleaving a section of a bar of brittle material is provided. The apparatus comprises a support adapted to hold the section of the bar in a position to be cleaved, a blade, an actuator coupled to the blade for driving the blade at least partially through the ... 12/08/05 - 20050272225 - Semiconductor processing The invention provides a method for increasing the usable surface area of a semiconductor wafer having a substantially planar surface and a thickness dimension at right angles to said substantially planar surface, the method including the steps of selecting a strip thickness for division of the wafer into a plurality ... 12/08/05 - 20050272224 - Method for dividing substrate The present invention aims at providing a method for dividing a substrate that is capable of dividing each substrate into chips in the same square-like form without causing chip breaking and capable of forming all cleaved facets flat. In the method for dividing a substrate of the present invention, an ... 12/01/05 - 20050266660 - Method for the production of indiviual monolithically integrated semiconductor circuits A method for the production of individual integrated circuit arrangements from a wafer composite is disclosed, whereby the wafer is fixed with the component side (FS) on a support, the individual circuit arrangements (21) are separated on the support body by the etching of separating trenches (27) and individually lifted ... 11/24/05 - 20050260829 - Manufacturing method of a semiconductor device The reliability of a thin semiconductor device is to be improved. A tape having a ring affixed to an outer periphery thereof is affixed to a main surface of a semiconductor wafer, and, in this state, a back surface of the semiconductor wafer is subjected to grinding and polishing to ... 11/17/05 - 20050255675 - Apparatus for supporting wafers for die singulation and subsequent handling and in-process wafer structure A method and apparatus for singulating a semiconductor substrate such as a wafer into individual components are disclosed. The peripheral edge of the substrate (termed the “edge bead ring” or “EBR”) where no components are fabricated is used as a support ring in place of a conventional film frame to ... 11/17/05 - 20050255674 - Semiconductor device including semiconductor memory element and method for producing same A wafer, in which a plurality of rectangular regions are defined on the face of the wafer by streets arranged in a lattice pattern, and a semiconductor memory element is disposed in each of the rectangular regions, is divided along the streets to separate the rectangular regions individually, thereby forming ... 11/17/05 - 20050255673 - Apparatus and method for semicondutor chip detachment An apparatus and method is provided for detaching a semiconductor chip from an adhesive tape on which it is mounted. The apparatus comprises a platform adapted to contact the adhesive tape at a position of the chip and a retaining force generator coupled to the platform for drawing the adhesive ... 11/10/05 - 20050250296 - Method of fabricating semiconductor device A method of fabricating semiconductor device is described. There is provided a method of fabricating a semiconductor device including, sticking a first protective tape on a first surface of a semiconductor substrate, polishing a second surface of the semiconductor substrate faced to the first surface, sticking a second protective tape ... 11/10/05 - 20050250295 - Semiconductor device manufacturing method and ring-shaped reinforcing member A ring-shaped reinforcing ring (13) formed of, for example, silicon, is adhered to one surface of a thinly processed semiconductor substrate (11). The reinforcing ring (13) is adhered thereto with an organic adhering material layer (14) formed of a metal or alloy with a relatively low melting point or polyimide ... 11/03/05 - 20050245050 - Implementation of protection layer for bond pad protection A method of protecting a bond pad during die-sawing comprising the following steps. A substrate having a bond pad formed thereover is provided. A bond pad protection layer is formed over the bond pad. The substrate is die-sawed and the bond pad protection layer is removed by heating. ... 10/27/05 - 20050239269 - Method for releasing stress of embedded chip and chip embedded structure A method for releasing stress of an embedded chip and a chip embedded structure are proposed. Cutting processes are performed to a semiconductor chip before it is embedded in a circuit board to form cut-way portions at edges of the chip so as to allow stress to be released when ... 10/27/05 - 20050239268 - Integrated circuit with removable scribe street trim and test pads A method comprises forming a pad in a scribe street adjacent to an integrated circuit (“IC”), electrically connecting the pad to the IC, and sawing the scribe street. A wafer is also disclosed as comprising an IC, a scribe street and a pad formed in the scribe street. ... 10/06/05 - 20050221586 - Methods and apparatus for laser dicing An apparatus and method of dicing a microelectronic device wafer by laser ablating at least an interconnect layer portion of the microelectronic device wafer in the presence of an anion plasma, wherein the anion plasma reacts with debris from the laser ablation to form a reaction gas. ... 10/06/05 - 20050221585 - Use of a u-groove as an alternative to using a v-groove for protection against dicing induced damage in silicon The present disclosure relates that by modifying chip die dicing methodology to a U-groove profile from a V-groove profile by modifying the second etch step to be a dry etch instead of a wet etch results in a direct cost savings by eliminating a more expensive process step, as well ... 09/29/05 - 20050215032 - Dicing film having shrinkage release film and method of manufacturing semiconductor package using the same The present invention relates to a dicing film having an adhesive film for dicing a wafer and a die adhesive film, which are used for manufacturing a semiconductor package, and a method of manufacturing a semiconductor package using the same. More particularly, the present invention relates to a dicing film ... 09/22/05 - 20050208736 - Dicing die-bonding film The invention relates to a dicing die-bonding film having a pressure-sensitive adhesive layer (2) on a substrate material (1) and a die-bonding adhesive layer (3) on the pressure-sensitive adhesive layer (2), wherein the adhesion of the pressure-sensitive adhesive layer (2) to the die-bonding adhesive layer (3), as determined under the ... 09/22/05 - 20050208735 - Semiconductor device and manufacturing method of the same The invention is directed to an improvement of cutting accuracy in a cutting process when a semiconductor device attached with a supporting member is manufactured. The invention provides a manufacturing method of a semiconductor device where a semiconductor wafer attached with a glass substrate is cut with moving a rotation ... 09/08/05 - 20050196940 - Water jet processing method A water jet processing method for cutting a workpiece having a first group composed of first plural cutting lines extending in a predetermined direction and a second group composed of second plural cutting lines formed perpendicular to the plural cutting lines of the first group along the plural cutting lines ... 09/08/05 - 20050196939 - Method and apparatus of fabricating a semiconductor device by back grinding and dicing A method and apparatus of fabricating a semiconductor device by back grinding and dicing is disclosed. The method may include at least adhering a protection tape for back grinding on a front surface of a semiconductor wafer, back grinding a rear surface of the semiconductor wafer while the protection tape ... 09/08/05 - 20050196938 - Novel method to make corner cross-grid structures in copper metallization A new method to prevent cracking at the corners of a semiconductor die during dicing is described. Dummy metal structures are fabricated at the corners of the die to prevent cracking. The design for the dummy metal structures can be generated automatically by a computer program. ... 08/25/05 - 20050186761 - Group encapsulated dicing chuck A semiconductor wafer saw and method of using the same for dicing semiconductor wafers are disclosed comprising a wafer saw including variable lateral indexing capabilities and multiple blades. The wafer saw, because of its variable indexing capabilities, can dice wafers having a plurality of differently sized semiconductor devices thereon into ... 08/25/05 - 20050186760 - Semiconductor element and method for producing the same A plurality of Group III nitride compound semiconductor layers are formed on a substrate for performing the formation of elements and the formation of electrodes. The Group III nitride compound semiconductor layers on parting lines are removed by etching or dicing due to a dicer so that only an electrode-forming ... 08/04/05 - 20050170614 - Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and ... 08/04/05 - 20050170613 - Wafer dividing method A method of dividing, along dividing lines, a wafer having function elements formed in areas sectioned by the dividing lines formed in a lattice pattern on the front surface, comprising: a frame holding step for affixing the back surface of the wafer to a dicing tape mounted on an annular ... 07/28/05 - 20050164472 - Method for separating electronic components from a composite The invention relates to a method of singulating thin chips from a sawn wafer, comprising the steps of glueing the wafer first onto a carrier and sawing it then into individual chips on said carrier. Subsequently, the chips are detached from the carrier individually or in groups. The method is ... 07/21/05 - 20050158967 - Semiconductor chip singulation method A method to singulate a circuit die from an integrated circuit wafer is achieved. The method comprises providing an integrated circuit wafer containing a circuit die. The integrated circuit wafer is cut through by performing a single, continuous cut around the perimeter of the circuit die to thereby singulate the ... 07/07/05 - 20050148159 - Process of cutting electronic package The present invention provides a cutting process for cutting connected electronic package structures. The connected electronic package structures are connected through a mother carrier. Each electronic package structures includes at least an electronic component and a carrier unit, while the mother carrier includes at least a plurality of carrier units ... 07/07/05 - 20050148158 - Method of dividing a substrate into a plurality of individual chip parts The present invention relates to a method for dividing a substrate into a number of individual chip parts, comprising the steps of: forming a number of chip parts in the substrate, comprising, for each chip part, of arranging recesses in the substrate for containing fluid; arranging one or more breaking ... 06/30/05 - 20050142814 - Method of manufacturing a semiconductor device by using a matrix frame A method of manufacturing a semiconductor device includes providing a matrix frame which includes a plurality of die pads, mounting a semiconductor chip on the respective die pads, and sealing the semiconductor chip in blocks. After the semiconductor chip is sealed by the sealing resin, inner leads which are extended ... 06/23/05 - 20050136622 - Methods and apparatus for laser dicing An apparatus and method of dicing a microelectronic device wafer by laser ablating at least an interconnect layer portion of the microelectronic device wafer in the presence of an anion plasma, wherein the anion plasma reacts with debris from the laser ablation to form a reaction gas. ... 06/16/05 - 20050130392 - Method of dicing a wafer A method of dicing a wafer is disclosed. A wafer with an active surface and a back surface is provided. Prior to dicing the wafer, a removable layer is formed on the back surface of the wafer. The removable layer is attached to a tape, such as a sawing tape. ... 06/09/05 - 20050124140 - Pre-fabrication scribing Singulating a wafer into individual die using a pre-scribing technique. Embodiments of the invention relate to scribing a wafer prior to the fabrication process in order to help preserve the integrity of the fabricated devices during singulation. ... 06/09/05 - 20050124139 - Process of producing multicrystalline silicon substrate and solar cell There is provided a process of producing a multicrystalline silicon substrate having excellent characteristics as a solar cell substrate. A multicrystalline silicon ingot made by directional solidification 10 is cut such that a normal line of a principal surface 14 of a multicrystalline silicon substrate 13 is substantially perpendicular to ... 06/02/05 - 20050118790 - Method for dicing semiconductor wafers A method is disclosed for dicing a wafer having a base material with a diamond structure. The wafer first undergoes a polishing process, in which a predetermined portion of the wafer is polished away from its back side. The wafer is then diced through at least one line along a ... ### FreshPatents.com Support |