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Semiconductor Device Manufacturing: Process > Bonding Of Plural Semiconductor Substrates > Having Enclosed Cavity Having Enclosed CavityHaving Enclosed Cavity patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.02/22/07 - 20070042565 - Fluidic mems device A method of manufacturing a fluidic MEMS package includes attaching a cover plate with a plurality of openings to a substrate with a plurality of bond rings with breaches such that the cover plate, the substrate and the bond rings define a plurality of respective inner cavities. The cover plate, ... 02/01/07 - 20070026636 - Wide and narrow trench formation in high aspect ratio mems Methods have been provided for forming both wide and narrow trenches on a high-aspect ratio microelectromechanical (MEM) device on a substrate including a substrate layer (126), an active layer (128), and a first sacrificial layer (130) disposed at least partially therebetween. The method includes the steps of forming a first ... 01/18/07 - 20070015341 - Method of making mems wafers A wafer level package for a MEMS device is made by bonding a MEMS wafer and a lid wafer together to form a hermetically sealed cavity. One or more vias filled with conductive or semiconductive material is etched one of the wafers to form one or more rods extending through ... 03/30/06 - 20060068564 - Micromachined electromechanical device A method for fabricating a MEMS device comprises providing a substrate having a back side, a front side opposite to the back side and a periphery portion. A desired microstructure is formed on the back side of the substrate. The substrate is then supported for rotation. A precursor solution is ... ### FreshPatents.com Support |