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Semiconductor Device Manufacturing: Process > Making Passive Device (e.g., Resistor, Capacitor, Etc.) > Resistor ResistorResistor patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.12/21/06 - 20060286762 - Method for non-volatile memory fabrication A method for non-volatile memory fabrication is provided, in which a substrate is provided, a bottom electrode is formed on the substrate, a solution with precursors of Zr and Sr is coated on the bottom electrode, the solution on the bottom electrode surface is dried and then fired to form ... 10/19/06 - 20060234462 - Method of operating a multi-terminal electronic device A method of operating a multi-terminal electronic device. The device includes an active material in electrical communication with three or more electrical terminals. The active material is able to undergo a transformation from one state to another state, where the two states differ in resistance. The method includes the step ... 09/14/06 - 20060205171 - Chip resistor and method for manufacturing same A chip resistor (R1) includes a resistor element (1) having a first surface (1a) and a second surface (1b) opposite to the first surface. Two main electrodes (21), spaced from each other, are provided on the first surface (1a), while two auxiliary electrodes (22), spaced from each other, are provided ... 07/06/06 - 20060148189 - Method for forming resistors in semiconductor integrated circuit devices Disclosed is a method for forming resistors in semiconductor integrated circuit device, comprising the steps of: depositing a pad oxide on a semiconductor substrate; depositing silicon nitride on the pad oxide; depositing photoresist on entire surface of the substrate; transferring patterns of trenches to the photoresist to form photoresist pattern, ... 06/29/06 - 20060141730 - Process for manufacturing integrated resistive elements with silicidation protection In a process for the fabrication of integrated resistive elements with protection from silicidation, at least one active area (15) is delimited in a semiconductor wafer (10). At least one resistive region (21) having a predetermined resistivity is then formed in the active area (15). Prior to forming the resistive ... 06/22/06 - 20060134876 - Sram cell A method for forming a resistor of high value in a semiconductor substrate including forming a stack of a first insulating layer, a first conductive layer, a second insulating layer, and a third insulating layer, the third insulating layer being selectively etchable with respect to the second insulating layer; etching ... 05/04/06 - 20060094198 - Integrated analog circuit using switched capacitor technology An integrated analog circuit using switched capacitor technology includes an integrated capacitor device that includes a first electrode device, a second electrode device, and a dielectric region formed between the first and second electrode devices. The dielectric region is made from or with an organic material. ... 05/04/06 - 20060094197 - Method of trimming semiconductor elements with electrical resistance feedback A method of trimming down the volume of a semiconductor resistor element using electrical resistance feedback. After forming conductive material disposed between a pair of electrodes, a voltage is applied to the electrodes to produce an electrical current through the conductive material sufficient to heat and melt away a portion ... 04/27/06 - 20060088973 - Methods of fabricating integrated circuit devices having resistors with different resistivities and devices formed thereby Methods of forming integrated circuit devices include forming patterned layers having different resistivities on semiconductor substrates. These methods include forming a first electrically conductive layer having a first resistivity on first and second portions of a semiconductor substrate. The first portion of the semiconductor substrate may include a memory cell ... 03/30/06 - 20060068558 - Process and installation for doping an etched pattern of resistive elements A process for selectively doping predetermined resistive elements on an electronic chip is provided. The resistive elements are arranged in a pattern, and there are three phases in the process. The first phase electrically charges selected elements of the pattern. The second phase adds doping atoms to the charged elements ... 03/02/06 - 20060046418 - Method of adjusting resistors post silicide process A method of fabricating a resistor in which the resistance value of the resistor is measured and adjusted after silicidation is provided. The method of the present invention begins with first providing at least one resistor, e.g., polysilicon, having a resistance value on a surface of a semiconductor substrate. The ... 02/23/06 - 20060040459 - Method to produce thin film resistor with no resistor head using dry etch A method of fabricating a thin film resistor (100) without a hardmask or resistor head. The resistor material (104), e.g., NiCr, is deposited. The resistor material (104) is patterned and sputter etched to form the resistor body without first depositing a hardmask material. For example, a sputter etch chemistry comprising ... 02/23/06 - 20060040458 - Method to produce thin film resistor using dry etch A method of fabricating a thin film resistor (100). The resistor material (104), e.g., NiCr, is deposited. A hard mask material (106), e.g., TiW, may be deposited over the resistor material (104). The resistor material (104) and hard mask material (106) are patterned and sputter etched to form the resistor ... 02/02/06 - 20060024901 - Method for fabricating a high-frequency and high-power semiconductor module A method for fabricating a high-frequency and high-power semiconductor module uses two stages respectively adopting a thick-film process to form resistors or elements of high impedance, and a thin film process to form precise circuit wires or elements. ... 01/19/06 - 20060014355 - Semiconductor device and method of manufacturing the same Embodiments of the present invention include semiconductor devices that can be made with relatively low resistance, and methods of forming the semiconductor devices. A resistance reducing layer is formed between a polysilicon layer and a metal layer. As a result, an interface resistance between the polysilicon layer and the metal ... 01/12/06 - 20060009003 - Methods for nanowire growth The present invention is directed to methods to produce, process, and exploit nanomaterials, and particularly elongated nanowire materials. The invention provides a method for producing nanowires that includes providing a thin film of a catalyst material with varying thickness on a substrate, heating the substrate and thin film, such that ... 12/29/05 - 20050287756 - Semiconductor device with resistor element and its manufacture method A first well is formed in the surface layer of a semiconductor substrate, the first layer being of a first conductivity type, the first well being of a second conductivity type opposite to the first conductivity type. A pair of current input/output ports are connected to the first well, the ... 12/01/05 - 20050266651 - Integrated via resistor A method of forming a resistor in an integrated circuit, comprising etching a first via in a first layer of dielectric material, depositing a layer of metal adjacent the first layer of dielectric material, depositing a second layer of dielectric material adjacent the layer of metal, and etching a second ... 11/24/05 - 20050260822 - Method of manufacturing semiconductor device Disclosed herein is a method of manufacturing a semiconductor device, and more specifically, to a method of manufacturing a semiconductor device having a capacitor and a resistor in which a thin film resistor and a capacitor are formed at the same time, a thin film resistor is formed on a ... 11/17/05 - 20050255662 - Semiconductor device with load resistor and fabrication method A semiconductor device with a load resistor is manufactured such that a contact is formed at both ends of the load resistor, and at least one contact is formed between the contacts, in order to prevent impurities from being generated within each contact while the contacts are being generated by ... 10/20/05 - 20050233537 - Method and system for high-speed, precise micromachining an array of devices A method and system for high-speed, precise micromachining an array of devices are disclosed wherein improved process throughput and accuracy, such as resistor trimming accuracy, are provided. The number of resistance measurements are limited by using non-measurement cuts, using non-sequential collinear cutting, using spot fan-out parallel cutting, and using a ... 10/06/05 - 20050221572 - High tolerance tcr balanced high current resistor for rf cmos and rf sige bicmos applications and cadenced based hierarchical parameterized cell design kit with tunable tcr and esd resistor ballasting feature A resistor device structure and method of manufacture therefore, wherein the resistor device structure invention includes a plurality of alternating conductive film and insulative film layers, at least two of the conductive film layers being electrically connected in parallel to provide for high current flow through the resistor device at ... 07/21/05 - 20050158960 - Resistor and method for fabricating the same An inexpensive fine resistor which do not require dimensional classifications of discrete substrates, eliminating a process of replacing a mask according to a dimensional ranking of each discrete substrate as in the prior art. The resistor includes discrete substrate made into pieces by dividing an insulated substrate sheet along a ... 06/02/05 - 20050118774 - Method of manufacturing chip resistor In manufacturing a chip resistor by dividing a chip resistance substrate which includes an insulator, resistance film formed on a surface of the insulator, and a plurality of conductive strips disposed on the resistance film at fixed intervals, grooves are formed by removing a predetermined width of the resistance film ... ### FreshPatents.com Support |