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Semiconductor Device Manufacturing: Process > Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor > Encapsulating EncapsulatingEncapsulating patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.03/08/07 - 20070054439 - Multi-chip stack structure A multi-chip stack structure includes at least one first chip having an active surface and an opposed non-active surface, wherein the active surface is formed with a plurality of connecting pads thereon; a plurality of electrical contacts formed around the first chip; an insulating layer formed on the first chip ... 03/01/07 - 20070048905 - Method for encapsulating a component, especially an electric or electronic component, by means of an improved solder seam A method for encapsulating a component by using a chamber in which there is a vacuum or controlled atmosphere, positioning a continuous sealing seam made of a metal or a metal alloy on a wettable surface previously placed on a substrate including at least one component and extending around the ... 02/08/07 - 20070031998 - Method and apparatus for removing encapsulating material from a packaged microelectronic device A method and apparatus for encapsulating microelectronic devices. In one embodiment, the method includes removing a portion of encapsulating material that at least partially surrounds a microelectronic substrate by directing a source of laser radiation toward the encapsulating material. The method can further include exposing a surface of the microelectronic ... 02/01/07 - 20070026576 - Sealing method for electronic devices formed on a common semiconductor substrate and corresponding circuit structure A method for sealing electronic devices formed on a semiconductor substrate includes forming a plurality of first electronic devices adjacent a first portion of the semiconductor substrate, with each first electronic device including a first region comprising at least one first conductive layer projecting from the semiconductor substrate. A first ... 02/01/07 - 20070026575 - No flow underfill device and method A more reliable and easier to manufacture underfill assembly is shown. Underfill layers are shown that are manufacturable separately from an assembly operation. In one example, underfill layers have the ability for pick and place operations during assembly. Another advantage of underfill layers provided includes self aligning holes that aid ... 01/25/07 - 20070020817 - Wafer level incapsulation chip and encapsulation chip manufacturing method A wafer level encapsulation chip and an encapsulation chip manufacturing method. The encapsulation chip includes a device substrate, a circuit module mounted on the device substrate, a bonding layer deposited on a predetermined area of the device substrate, a protection cap forming a cavity over the circuit module and bonded ... 01/25/07 - 20070020816 - Manufacturing process for chip package without core A manufacturing process for chip package without core is disclosed. First of all, a conductive layer with a first surface and a second surface is provided. A first film is formed onto the first surface, and the conductive layer is patterned to form a patterned circuit layer. A solder resistance ... 01/04/07 - 20070004096 - Method for containing a device and a corresponding device A method of enclosing a micromechanical element formed between a base layer and one or more metallization layers includes forming one or more encapsulating layers over the micromechanical element and providing an encapsulating wall surrounding the element extending between the base layer and the one or more encapsulating layers. An ... 01/04/07 - 20070004095 - Packaging method and apparatus A method includes populating a circuit board with components, and encapsulating the circuit board and the components with a material. The method further includes separating the circuit board into a plurality of separate devices. ... 12/28/06 - 20060292753 - Semiconductor device and method of manufacturing a semiconductor device The objective of the invention is to provide a method of manufacturing a semiconductor device that allows individual molding of plural semiconductor chips carried on a surface of the substrate. It includes the following process steps: a process step in which plural semiconductor elements 102 are arranged on the surface ... 12/14/06 - 20060281231 - Semiconductor module An image sensor module is composed of a base, a CCD image sensor, a glass plate, and a frame-shaped moisture permeable member. The base has a depressed chip chamber, in which the CCD image sensor is contained. Top and under surfaces of the moisture permeable member are provided with adhesive ... 12/14/06 - 20060281230 - Technique for manufacturing an overmolded electronic assembly A technique for manufacturing an electronic assembly includes a number of steps. Initially, a backplate with a cavity formed into a first side of the backplate is provided. Next, a substrate with a first side of an integrated circuit (IC) die mounted to a first side of the substrate is ... 12/14/06 - 20060281229 - Method for molding a small form factor digital memory card A method for molding digital storage memory cards such as, for example, multimedia cards (MMC), secure digital cards (SD), and similar small form factor digital memory cards. A PCA subassembly including, for example, a leadframe (TSOP) package for enclosing a flash IC and a (e.g., land grad array) controller package ... 11/30/06 - 20060270118 - Surface mount type semiconductor device and method of manufacturing the same A surface mount type semiconductor device comprises a support substrate having mutually opposed first and second surfaces, and having a slit at a central part thereof, a semiconductor element including electrode pads at least a central part thereof, the semiconductor element being mounted on the first surface such that the ... 11/16/06 - 20060258058 - Surface-mounted device with leads A surface-mounted device comprising a semiconductor chip (5) encapsulated in a package (1) and leads (2) projecting from the package so as to bring the semiconductor chip into contact with a substrate (3), which leads are provided at their surface, at the location of one of the pads provided for ... 11/02/06 - 20060246631 - Anti-stiction technique for electromechanical systems and electromechanical device employing same A mechanical structure is disposed in a chamber, at least a portion of which is defined by the encapsulation structure. A first method provides a channel cap having at least one preform portion disposed over or in at least a portion of an anti-stiction channel to seal the anti-stiction channel, ... 10/19/06 - 20060234427 - Underfill dispense at substrate aperture Disclosed are methods for dispensing underfill material in an IC assembly having a die mounted on a substrate with a gap therebetween. One or more aperture is provided in the substrate for receiving underfill material into the gap. Underfill material is dispensed into the gap through the one or more ... 10/19/06 - 20060234426 - Leadframe with encapsulant guide and method for the fabrication thereof A method for fabricating a leadframe with encapsulant guide is provided, including forming a die attach paddle. Leads are formed around at least portions of the die attach paddle, and encapsulant guides are formed angled on a plurality of the leads to push the leads outwardly when an encapsulant flows ... 10/05/06 - 20060223240 - Method of making substrate for integrated circuit A method of making an IC substrate includes the steps of: a) preparing a substrate having a front side and a back side and half-etching the substrate to form a filling space in the front side of the substrate subject to a predetermined depth and area, b) putting the substrate ... 10/05/06 - 20060223239 - Integrated circuit edge protection method and apparatus An apparatus, method, and system for providing a mechanical divider adapted to shield at least a portion of an active surface of an integrated circuit from out-gassing from underfill material. The mechanical divider is attached to a mounting substrate. The underfill material is dispensed on the mounting substrate. The integrated ... 07/27/06 - 20060166408 - Method for encapsulating an electronic component using a foil layer The invention relates to a method for encapsulating an electronic component, in particular a semiconductor, fixed on a carrier, comprising the processing steps of: a) placing at least one foil layer in a mould, b) placing the carrier in contact with the foil layer with the side remote from the ... 07/20/06 - 20060160275 - Device and method for encapsulating with encapsulating material and electronic component fixed on a carrier The invention relates to a device for encapsulating with encapsulating material an electronic component, in particular a semiconductor, fixed on a carrier, comprising: two co-acting mould parts which are displaceable relative to each other between an encapsulating position, in which the mould parts, when closing onto the carrier, occupy a ... 07/06/06 - 20060148136 - Patterned plasma treatment to improve distribution of underfill material A patterned plasma treatment may be provided on the chip and/or the substrate to enhance the distribution of underfill material between the chip and the substrate. The underfill material is typically dispensed after the chip is electrically connected to the substrate. The chip may be electrically connected to the substrate ... 07/06/06 - 20060148135 - Semiconductor memory cell and method of forming same A semiconductor memory cell and forming method thereof utilizes a vertical select transistor to eliminate the problem of a large cell surface area in memory cells of the related art utilizing phase changes. A memory cell with a smaller surface area than the DRAM device of the related art is ... 06/29/06 - 20060141677 - Method of manufacturing a semiconductor device A semiconductor device manufacturing method comprising the steps of providing a matrix substrate having a main surface with plural device areas formed thereon, fixing plural semiconductor chips to the plural device areas respectively, then sealing the plural semiconductor chips all together with resin to form a block sealing member, dividing ... 05/18/06 - 20060105504 - Fabrication method of semiconductor integrated circuit device A method of fabricating a semiconductor integrated circuit device uses a mold which is provided with a plurality of air vents and movable pins which are formed such that the movable pins include grooves in the distal ends thereof which project into the air vents. By clamping the mold in ... 05/11/06 - 20060099742 - Electronic device and method of manufacturing same The electronic device (100) is a chip-on-chip construction on a lead frame (10) comprising a heat sink (13) in an encapsulation (80). The first chip (20) and the second chip (30) are mutually connected by first conductive interconnections (24) and the first chip (20) is connected to the lead frame ... 04/13/06 - 20060079029 - Flexible circuit board processing method It is an object of this invention to provide a flexible circuit board processing method which controls an outflow of a sealing material to be appropriate when packaging a component on a flexible circuit board. There is provided a flexible circuit board processing method for, when packaging a chip component ... 03/30/06 - 20060068527 - Molded stiffener for thin substrates A stiffener molded to a semiconductor substrate, such as a lead frame, and methods of molding the stiffener to the substrate are provided. The stiffener is molded to the substrate to provide rigidity and support to the substrate. The stiffener material can comprise a polymeric material molded to the substrate ... 03/30/06 - 20060068526 - Acrylic polymer-containing gap filler forming composition for lithography There is provided a gap fill material forming composition for lithography that is used in dual damascene process and is excellent in flattening property and fill property. Concretely, it is a gap fill material forming composition characterized in that the composition is used in manufacture of semiconductor device by a ... 03/23/06 - 20060063312 - Semiconductor device and method for manufacturing the same The semiconductor device 100 comprises a first semiconductor element 113 provided on a face on one side of a flat plate shaped interconnect component 101, an insulating resin 119 covering a face of a side where the first semiconductor element 113 of the interconnect component 101 is provided and a ... 03/23/06 - 20060063311 - Wafer scale integration packaging and method of making and using the same A method of making a microelectronic device comprising: making a device B comprising providing a structure having a first bond pad, depositing a first electrically conductive material having a first reflow temperature over the first bond pad, and depositing a second electrically conductive material having a second reflow temperature over ... 03/09/06 - 20060051901 - Method of producing led bodies with the aid of a cross-sectional restriction Method of producing light-conducting LED bodies of a free-flowing material by introduction into a mold. Here, the volumetric flow of a free-flowing material, at a distance of the electrode plane from the charging point that is greater than 35% of the distance between the charging point and the mold side ... 03/02/06 - 20060046352 - Substrate grooves to reduce underfill fillet bridging An apparatus having and method of forming grooves in the surface of a substrate adjacent and parallel to sidewall locations for circuit chips or die mounted on the surface. The grooves have physical dimensions to retain fill material formed between the packages and the surface of the substrate so that ... 01/26/06 - 20060019432 - Method for manufacturing semiconductor device having shielding case, electronic equipment using the semiconductor device, and shielding case attaching method A shielding case bank has shielding cases that arranged at a pitch twice as large as a pitch of molded articles in a molded article bank. Two shielding case banks are stacked one on the other with displacement from each other by half the pitch so that the shielding cases ... 01/19/06 - 20060014328 - Resin encapsulation molding for semiconductor device According to a resin encapsulation molding method for a semiconductor device, a resin-encapsulated substrate having a semiconductor device that is mounted on the substrate and that has a portion exposed is formed. With the method, a device-mounted substrate on which the semiconductor device is mounted is prepared and then the ... 01/05/06 - 20060003497 - Semiconductor device packages including hermetic packaging elements for at least partially encapsulating conductive elements and other package elements for protecting the portions of semiconductor devices not covered by the hermetic package elements, and A semiconductor device package includes a semiconductor device and at least one conductive element in communication with a contact of the semiconductor device. A hermetic package element encapsulates at least a portion of the conductive element and the contact from which the conductive element protrudes or extends. Another element of ... 01/05/06 - 20060003496 - Modified chip attach process and apparatus A method of packaging a die includes reflowing the solder to electrically connect the die to a substrate at a first temperature, cooling the die and substrate to a second temperature, and placing a heated epoxy in contact with the die and the substrate. The method also includes holding the ... 12/29/05 - 20050287716 - Electronic device package A packaged assembly including an interposer or substrate supporting on a first side thereof a chip that is encased with an encapsulant is described. A second side of the interposer or substrate includes a barrier that blocks the flow of encapsulant to create a uniform encapsulant edge on the second ... 12/29/05 - 20050287715 - Method for encapsulating lead frame packages A method of encapsulating a plurality of IC chips attached to a lead frame strip that includes an outer frame and a plurality of vertical and horizontal connecting bars attached to the outer frame in a manner that defines a plurality of inner frames arranged in a matrix pattern within ... 12/29/05 - 20050287714 - Enhancing epoxy strength using kaolin filler An embodiment of the present invention is a technique to provide a substrate with enhanced strength. A kaolin filler is added to an epoxy resin. The kaolin filler is mixed with the epoxy resin to form a mixture. A substrate is formed from the mixture. The substrate is processed in ... 12/15/05 - 20050277231 - Underfill and encapsulation of semicondcutor assemblies with materials having differing properties and methods of fabrication using stereolithography Polymerized materials for forming the underfill and encapsulation structures for semiconductor package are disclosed. A filler constituent, such as boron nitride, silicates, elemental metals, or alloys, may be added to a liquid photopolymer resin to tailor the physical properties thereof upon curing. The filler constituents may be employed to alter ... 11/17/05 - 20050255637 - Method for assembling semiconductor die packages with standard ball grid array footprint Apparatus and methods for forming semiconductor assemblies. An interposer includes a perimeter wall surrounding at least a portion of an upper surface thereof to form a recess. An array of electrical connection pads is located within the recess. A semiconductor die can be flip chip attached to the interposer by ... 11/10/05 - 20050250255 - Over-passivation process of forming polymer layer over ic chip A method for forming a semiconductor chip or wafer includes following steps. A semiconductor substrate is provided, and then a polymer layer is deposited over the semiconductor substrate, wherein the polymer layer comprises polyimide. The polymer layer with a temperature profile having a peak temperature between 200 and 320 degrees ... 11/03/05 - 20050245005 - Wafer edge ring structures and methods of formation An elevated containment structure in the shape of a wafer edge ring surrounding a surface of a semiconductor wafer is disclosed, as well as methods of forming and using such a structure. In one embodiment, a wafer edge ring is formed using a stereolithography (STL) process. In another embodiment, a ... 10/20/05 - 20050233504 - Device transfer method and display apparatus A device transfer method and a display apparatus are provided. A device transfer method and a display apparatus are provided by or in which, in transferring devices arranged on a substrate onto another substrate, it is possible to easily strip the substrate after the transfer of the devices, to lower ... 10/20/05 - 20050233503 - Method for the production of structured layers on substrates A method for the patterned coating of a substrate with at least one surface is provided. The method is suitable for the rapid and inexpensive production of precise patterns. The method includes the steps of: producing at least one negatively patterned first coating on the at least one surface, depositing ... 09/29/05 - 20050214981 - Circuit device and manufacturing method thereof A method of manufacturing a circuit device includes the steps of preparing a conductive foil, forming conductive patterns in convex shapes by forming an isolation trench on a surface of the conductive foil, covering the surface of the conductive foil with a resin film so as to form the resin ... 09/08/05 - 20050196908 - System and method for forming mold caps over integrated circuit devices A compression molding method for forming a mold cap over an integrated circuit structure is provided. A film is positioned adjacent a first die structure such that a mold block coupled to the film is located in a die cavity in the first die structure. The mold block comprises mold ... 08/18/05 - 20050181545 - Methods of encapsulating selected locations of a semiconductor die assembly using a thick solder mask A solder mask includes an opening through which intermediate conductive elements may be positioned between bond pads of a semiconductor die exposed through an aligned opening in a carrier substrate to which the solder mask is secured and corresponding contact areas of the carrier substrate. An assembly is formed by ... 08/18/05 - 20050181544 - Microelectronic packages and methods therefor A microelectronic package includes a microelectronic element having faces and contacts and a flexible substrate spaced from and overlying a first face of the microelectronic element. The package also includes a plurality of conductive posts extending from the flexible substrate and projecting away from the first face of the microelectronic ... 08/18/05 - 20050181543 - Semiconductor package module and manufacturing method thereof A process for fabricating a multi-chip package module is disclosed. A substrate, at least a first chip and at least a second chip are provided. The backside of the first chip is attached to a die pad on a substrate. A wire-bonding operation is carried out to electrically connect the ... 08/11/05 - 20050176181 - Method for edge sealing barrier films An edge-sealed barrier film composite. The composite includes a substrate and at least one initial barrier stack adjacent to the substrate. The at least one initial barrier stack includes at least one decoupling layer and at least one barrier layer. One of the barrier layers has an area greater than ... 08/11/05 - 20050176180 - Die encapsulation using a porous carrier A process for encapsulating an integrated circuit die (403) using a porous carrier (101). In one example, an adhesive structure (e.g. tape) is applied to a porous carrier. Integrated circuit die is then placed on the adhesive structure. The integrated circuit die is then encapsulated to form an encapsulated structure ... 08/04/05 - 20050170562 - Insert molding electronic devices An apparatus and methods are provided for housing an electronic device. In one embodiment, an electronic device is positioned on a housing base and a housing lid is over-molded onto at least a portion of the base and the electronic device. An interface of the electronic device remains exposed for ... 08/04/05 - 20050170561 - Fabrication method of semiconductor package with photosensitive chip A fabrication method of a semiconductor package with a photosensitive chip is provided. A substrate having a core is prepared. An interposer is mounted on the substrate, with a peripheral portion of the substrate exposed from the interposer. A molding process is performed and the substrate is clamped between an ... ### FreshPatents.com Support |