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Semiconductor Device Manufacturing: Process > Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor > Insulative Housing Or Support > And Encapsulating And EncapsulatingAnd Encapsulating patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.01/25/07 - 20070020815 - Process for exposing solder bumps on an underfill coated semiconductor A process for applying a solvent-free underfill onto a bumped semiconductor comprises: providing an underfill in a compressible state on a semiconductor, contacting the underfill with a compliant surface and applying sufficient pressure to expose the bumps, optionally hardening the underfill to a solid state, and removing the compliant surface. ... 12/28/06 - 20060292752 - Method for fabricating board on chip (boc) semiconductor package with circuit side polymer layer A method for fabricating a BOC package includes the steps of providing a semiconductor die having planarized bumps encapsulated in a polymer layer, and providing a substrate having a plurality of conductors and an opening. The method also includes the steps of attaching the die to the substrate in a ... 11/16/06 - 20060258057 - Electronic part manufacturing method and base sheet An insulating sheet including resin is attached to a conductor portion composed of a wiring pattern and a columnar conductor from above. Then pressure and heat are applied to the insulating sheet using the columnar conductor as a stopper to form a layer of resin having a uniform thickness with ... 06/22/06 - 20060134836 - Method of marking a low profile packaged semiconductor device A semiconductor device (10) is made by mounting the bottom surfaces (31, 44, 54) of a semiconductor die (14) and a lead (15, 17) on a tape (12) and over a hole (19) in the tape. A vacuum is drawn through the hole to secure the die in place when ... 02/09/06 - 20060030081 - Method for fabricating semiconductor package with circuit side polymer layer A semiconductor package includes a substrate, a die attached and wire bonded to the substrate, and a die encapsulant encapsulating the die. The die includes a circuit side having a pattern of die contacts, planarized wire bonding contacts bonded to the die contacts, and a planarized polymer layer on the ... 02/09/06 - 20060030080 - Removable flash integrated memory module card and method of manufacture A removable Flash integrated memory module card has a plastic shell and an integral Flash memory module. On the backside of the card, there are exposed contact pads. When the card is inserted into a card-hosting device, the card can communicate with the device through the exposed pads. The manufacturing ... 12/01/05 - 20050266618 - Plasma processing method and method for fabricating electronic component module using the same According to this plasma processing method, a surface of a micro gap provided between a first subject to be processed and a second subject to be processed is processed. According to this plasma processing method, the first and second subjects to be processed are disposed within a process chamber. Then, ... 10/06/05 - 20050221538 - Resin encapsulated semiconductor device and the production method A semiconductor device having both high strength and high thermal radiation that is capable of being applied to mounting on automobiles experiencing many thermal cycles, and a manufacturing method thereof are provided. A circuit board 1a for a resin encapsulated semiconductor module device has a configuration where a silicon nitride ... 09/08/05 - 20050196907 - Underfill system for die-over-die arrangements A system may include a first integrated circuit die, no-flow underfill material, and a second integrated circuit die. A first side of the first integrated circuit die may include a first plurality of electrical contacts, and the underfill material may contact the first side of the first integrated circuit die. ... ### FreshPatents.com Support |