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Semiconductor Device Manufacturing: Process > Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor > Insulative Housing Or Support Insulative Housing Or SupportInsulative Housing Or Support patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.04/19/07 - 20070087483 - Heat sink and method for its production A method for producing a heat sink for cooling a semiconductor device including forming plural base members, the base member being each in plate or block-shape, the base member each having paths shaped on one or both sides of surfaces thereof, and the base member each having connecting regions on ... 03/15/07 - 20070059866 - Fan out type wafer level package structure and method of the same To pick and place standard dies on a new base for obtaining an appropriate and wider distance between dies than the original distance of dies on a wafer. The package structure has a larger size of balls array than the size of the die by fan out type package. Moreover, ... 01/04/07 - 20070004094 - Method of reducing warpage in an over-molded ic package A dummy circuit pattern is disclosed on a surface of a substrate for a semiconductor package, the dummy circuit pattern including straight line segments having a length controlled so as not to generate stresses within the line segments above a desired stress. The dummy circuit pattern may be formed of ... 12/07/06 - 20060275954 - Method for removing a cover from a semiconductor wafer A method of removing a cover from a wafer. A wafer, which includes a cover, is put on a support structure. The wafer is flexed to separate a portion of the wafer from the cover, and an impact force is applied to remove the cover from the wafer. ... 11/23/06 - 20060263945 - Methods for forming contact hole, for manufacturing circuit board and for manufacturing electro-optical device A method for forming a contact hole, a method for manufacturing a circuit board and a method for manufacturing an electro-optical device that increase the reliability of electrical coupling via a conductive part and prevent wire-breaking due to projections when forming a contact hole in an interlayer film by using ... 11/23/06 - 20060263944 - System and method for die attach using a backside heat spreader According to one embodiment of the invention, a method of die attach includes providing a chip, forming a heat conductive metal layer outwardly from a backside of the chip, and coupling the chip to a substrate. The heat conductive metal layer has a thickness of at least 0.5 mils. ... 11/16/06 - 20060258056 - Method for producing a chip panel by means of a heating and pressing process using a thermoplastic material The invention relates to a method for producing a chip panel or composite wafer by means of a heating and pressing process, and also to a device for carrying out the method. For carrying out the method, a chip carrier sheet and a transfer sheet are provided in the device. ... 11/02/06 - 20060246630 - Electronic parts packaging structure and method of manufacturing the same In a method of manufacturing an electronic parts packaging structure of the present invention, an electronic parts forming substrate in which a MEMS element is formed in a formation region and a concave portion is provided in a periphery part of the formation region, and a sealing cap in which ... 09/28/06 - 20060216868 - Package structure and fabrication thereof The fabrication and device of package structure with a plurality of conductive contacts are provided herein. At least one chip is attached among the conductive pads on the surface of a wafer. A number of conductive wires are attached on the conductive pads and encapsulated by a layer. The layer ... 09/21/06 - 20060211177 - Structure and process for packaging rf mems and other devices A structure and process for packaging RF MEMS and other devices employs a substrate of silicon, for example, and a cap of glass, for example, having cavities to receive the devices. MEMS or other devices are supported on an upper surface of the substrate, into which metal-filled blind vias are ... 09/14/06 - 20060205119 - Method for manufacturing a semiconductor package with a laminated chip cavity A method for manufacturing a semiconductor package with a laminated chip cavity is disclosed. A board and a metal foil having a layer of adhesive resin are provided. The metal foil is laminated with the board to make the adhesive resin be attached to the board. Next, a through opening ... 08/31/06 - 20060194373 - Methods for assembling semiconductor devices and interposers A method for assembling one or more semiconductor devices with an interposer includes positioning the one or more semiconductor devices within a receptacle that extends through the interposer, on a retention element that extends over at least a portion of the receptacle. Material may be introduced between at least a ... 08/24/06 - 20060189040 - Method of manufacturing an electronic device The existing IC cards have a disadvantage of difficulty of mass production because an IC chip is supplied on a substrate one at a time. The present invention provides a method of manufacturing by placing a positioning jig having a plurality of openings each of which has a size fit ... 08/24/06 - 20060189039 - Fabrication of parascan tunable dielectric chips An embodiment of the present invention provides a method, comprising fabricating a tunable dielectric chip by defining a critical area on a dielectric material via patterning and metallization and encapsulating said critical area. ... 07/13/06 - 20060154405 - Methods of fabrication for flip-chip image sensor packages The present invention provides flip-chip packaging for optically interactive devices such as image sensors and methods of assembly. In a first embodiment of the invention, conductive traces are formed directly on the second surface of a transparent substrate and an image sensor chip is bonded to the conductive traces. Discrete ... 06/29/06 - 20060141676 - Method for producing semiconductor substrate To provide a method for producing a semiconductor substrate able to uniformly and quickly fill through-holes in the semiconductor substrate with conductive material. This method comprises a process for forming through-holes (14) in a substrate (10), a process for disposing solder (42) on one surface of the substrate, and a ... 06/08/06 - 20060121649 - Methods for fabricating stiffeners for flexible substrates Methods for fabricating stiffeners for flexible substrates, including, but not limited to, tapes, films, or other connective structures, which are configured to be secured to other semiconductor device components, are fabricated under control of a program. The stiffeners may be formed by selectively depositing or consolidating unconsolidated material. They may ... 06/08/06 - 20060121648 - Methods and apparatus for addition of electrical conductors to previously fabricated device A conductor carrier provides, separately manufactured, conductive pathways, on a wafer level, which may be coupled to a wafer of fully fabricated integrated circuits. Such conductor carriers include an insulating body having two major surfaces with conductors disposed on each of those surfaces, and conductors disposed within the insulating body ... 06/01/06 - 20060115932 - Method for fabricating semiconductor components with conductive vias A method for fabricating semiconductor components and interconnects includes the steps of providing a substrate, such as a semiconductor die, forming external contacts on opposing sides of the substrate by laser drilling vias through the substrate, and forming conductive members in the vias. The conductive members include enlarged terminal portions ... 05/25/06 - 20060110859 - Electronic device and manufacturing method of the same A technique that makes it possible to enhance the reliability of a module using PCB as its module substrate is provided. Solder connection of a single-chip component 43, an integrated chip component 44, and a semiconductor chip IC2 by Pb-free solder is carried out by heat treatment at a temperature ... 05/18/06 - 20060105503 - Wafer-level sealed microdevice having trench isolation and methods for making the same A microdevice (20) having a hermetically sealed cavity (22) to house a microstructure (26). The microdevice (20) comprises a substrate (30), a cap (40), an isolation layer (70), at least one conductive island (60), and an isolation trench (50). The substrate (30) has a top side (32) with a plurality ... 04/06/06 - 20060073641 - Techniques for manufacturing a circuit board with an improved layout for decoupling capacitors A circuit board module has an IC device, discrete components, and a circuit board structure in electrical communication with the IC device and the discrete component. The circuit board structure includes non-conductive material defining a top surface of the circuit board structure and a bottom surface of the circuit board ... 03/30/06 - 20060068525 - Method of manufacturing a wiring substrate and an electronic instrument A method of manufacturing a wiring substrate having a wiring layer formation step that includes: a first surface processing step in which surface processing is performed on a film formation area of a substrate; a wiring formation step in which a wiring pattern is formed by placing a first liquid ... 03/16/06 - 20060057782 - Thin glass chip for an electronic component and manufacturing method The manufacturing of electronic components on individual substrates made of an insulating material includes molding, in a silicon wafer, an insulating material with a thickness corresponding to the final thickness desired for the substrates, manufacturing the electronic components, and removing the silicon from the rear surface of the wafer after ... 03/16/06 - 20060057781 - Plastic leadframe and compliant fastener Packaging assembly method and systems include the use of a plastic substrate and one or more compliant fasteners, which can be connected to the plastic substrate, such that the compliant fastener provides an electrical connection to one or more electrical components. A plastic leadframe can therefore be formed, which is ... 02/16/06 - 20060035416 - Integrated circuits and packaging substrates with cavities, and attachment methods including insertion of protruding contact pads into cavities A packaging substrate (310) includes a semiconductor interposer (120) and at least one other intermediate substrate (110), e.g. a BT substrate. The semiconductor interposer has first contact pads (136C) attachable to dies (124) above the interposer, and second contact pads (340) attachable to circuitry below the interposer. Through vias (330) ... 02/16/06 - 20060035415 - Frame structure and semiconductor attach process for use therewith for fabrication of image sensor packages and the like, and resulting packages A semiconductor package such as an image sensor package, and methods for fabrication. A frame structure includes an array of frames, each having an aperture therethrough, into which an image sensor die in combination with a cover glass, filter, lens or other components may be installed in precise mutual alignment. ... 01/19/06 - 20060014327 - Method of fabricating pcb including embedded passive chip Disclosed is a method of fabricating a PCB including an embedded passive chip, in which the passive chip is mounted on the PCB and an insulator is then laminated on the PCB, or in which a blind hole for receiving the passive chip is formed in the PCB and the ... 01/12/06 - 20060008949 - Electronic package having a folded flexible substrate and method of manufacturing the same An electronic package is provided and its method of construction. A microelectronic die is mounted to a flexible substrate. A mold cap is injection-molded over the die. The mold cap has a curved convex edge surface around which the flexible substrate wraps. Folding of the flexible substrate is controlled by ... 12/22/05 - 20050282315 - High-reliability solder joint for printed circuit board and semiconductor package module using the same A printed circuit board and a semiconductor package module using the same in which solder joint reliability (SJR) is improved. The printed circuit board includes: a first terminal exposed to the external of the printed circuit board in a print circuit pattern to be connected to a solder ball of ... 12/15/05 - 20050277230 - Process for producing a chip arrangement provided with a molding compound A semiconductor device includes a semiconductor chip with a plurality of bonding pads at an upper surface and a passivation layer overlying the upper surface. A rewiring layer electrically coupling ones of the bonding pads to corresponding ones of a plurality of contact pads. The rewiring layer is formed by ... 11/17/05 - 20050255636 - Microtools for package substrate patterning An improved microtool for patterning package substrates is enclosed. The microtool comprises a base portion including a pattern to pattern a substrate and an electroless nickel layer deposited over the base portion. The base portion may comprise pure nickel, a nickel alloy, or copper. The electroless nickel layer increases the ... 11/10/05 - 20050250254 - Method of manufacturing a semiconductor device and a fabrication apparatus for a semiconductor device A method of manufacturing a semiconductor device able to reduce the number of manufacturing steps and attain the rationalization of a manufacturing line is disclosed. The semiconductor device is a high-frequency module assembled by mounting chip parts (22) and semiconductor pellets (21) onto each of wiring substrates (2) formed on ... 11/10/05 - 20050250253 - Processes for hermetically packaging wafer level microscopic structures A process for packaging and sealing a microscopic structure device is provided. The process for the present invention includes the steps of depositing a capping layer of sacrificial material patterned by lithography over the microscopic structure supported on a substrate, depositing a support layer of a dielectric material patterned by ... 11/03/05 - 20050245004 - Method for manufacturing wiring substrate and method for manufacturing electronic device A method for manufacturing a wiring substrate includes the steps of (a) providing a surface-active agent in first and second areas of a substrate, (b) irradiating a vacuum ultraviolet radiation to the second area of the substrate to thereby break down an interatomic bond in the second area of the ... 10/27/05 - 20050239237 - Method for producing a bga chip module and bga chip module BGA chip module and method for producing the BGA chip module by providing a carrier, forming holes at points at which bonding points of the BGA chip module are to be produced, forming metallization areas on an upper side of the carrier and covering the holes, connecting bonding points of ... 10/20/05 - 20050233502 - Methods of fabrication for flip-chip image sensor packages The present invention provides flip-chip packaging for optically interactive devices such as image sensors and methods of assembly. In a first embodiment of the invention, conductive traces are formed directly on the second surface of a transparent substrate and an image sensor chip is bonded to the conductive traces. Discrete ... 10/13/05 - 20050227417 - Packaging assembly utilizing flip chip and conductive plastic traces Packaging assembly methods and systems are disclosed herein. Initially, a plastic substrate can be provided. Thereafter, the plastic substrate can be configured as a conductive plastic trace assembly. One or more dies can be connected to the conductive plastic trace assembly, along with discrete metal components, so that the conductive ... 09/08/05 - 20050196906 - Microelectronic or optoelectronic package having a polybenzoxazine-based film as an underfill material Microelectronic and optoelectronic packaging embodiments are described with underfill materials including polybenzoxazine, having the general formula: ... 09/08/05 - 20050196905 - Semiconductor device featuring fine windows formed in oxide layer of semiconductor substrate thereof, and production method for manufacturing such semiconductor device A semiconductor device includes a semiconductor substrate, and an oxide layer formed thereon. The oxide layer has a window which is formed by forming a peeling-prevention layer on the oxide layer, forming a KrF-ray sensitive photoresist layer on the peeling-prevention layer, forming an opening in the KrF-ray sensitive photoresist layer, ... 09/08/05 - 20050196904 - aerodynamic memory module cover Adjacent integrated circuit chips in processor-based systems may be covered with a metal foil cover. The cover may make air flow over the chips more aerodynamic, improving thermal heat transfer and cooling. This may improve performance and reduce power consumption, all without significantly increasing the size of the components. ... 09/01/05 - 20050191793 - Semiconductor packaging techniques for use with non-ceramic packages A method for attaching at least one IC die to a non-ceramic IC package including a leadframe and a base, the IC package being configured for receiving the at least one IC die, includes attaching the IC die to an upper surface of a thermal carrier in a manner which ... 08/25/05 - 20050186713 - Multi-layer flexible printed circuit board and manufacturing method thereof This invention provides a method for easily making a barrier for preventing overflow of interlayer insulating resin in a cable-fitted multi-layer FPC that uses bumps for connecting the layers, and a barrier having a structure that can easily be made. In a method for manufacturing a multi-layer flexible printed circuit ... 08/25/05 - 20050186712 - Method and apparatus for fabricating self-assembling microstructures A method and apparatus for assembling microstructures onto a substrate through fluid transport. The microstructures being shaped blocks self-align into recessed regions located on a substrate such that the microstructure becomes integral with the substrate. The improved method includes a step of transferring the shaped blocks into a fluid to ... 08/18/05 - 20050181542 - Single mask via method and device A method of connecting elements such as semiconductor devices and a device having connected elements such as semiconductor devices. A first element having a first contact structure is bonded to a second element having a second contact structure. A single mask is used to form a via in the first ... 08/11/05 - 20050176179 - Electronic device and method of manufacturing the same In the present invention, an etching hole 21 is formed in a polysilicon film 14 as a cavity-wall member. Through the etching hole 21, hydrofluoric acid is injected, so as to dissolve a silicon oxide film 13, thereby forming a cavity 22. In the cavity 22, a detecting unit 12 ... 08/04/05 - 20050170560 - Method of manufacturing an electronic device A method of manufacturing an electronic device (10) is proposed that comprises an insulating body (2) with at a surface a conductive pattern (1). According to the invention, a carrier (3) is provided with a first layer (4) and a second layer (5), which layers (4, 5) comprise different materials. ... 07/21/05 - 20050158918 - Masking layer in substrate cavity A package that resists creation of particles in a package cavity. The package is ideally suited for use with microelectromechanical devices. A package according to one embodiment of the present invention contains a mechanical device (302), for example a micromirror device, attached to the floor (304) of the package substrate ... ### FreshPatents.com Support |