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Semiconductor Device Manufacturing: Process > Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor > Metallic Housing Or Support > And Encapsulating And EncapsulatingAnd Encapsulating patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.03/29/07 - 20070072347 - Method of assembly for multi-flip chip on lead frame on overmolded ic package A multichip module package uses bond wire with plastic resin on one side of a lead frame to package an integrated circuit and flip chip techniques to attach one or more mosfets to the other side of the lead frame. The assembled multichip module 30 has an integrated circuit controller ... 03/29/07 - 20070072346 - Method of resin-seal-molding electronic component and apparatus therefor A mold for resin-seal-molding an electronic component is constituted by a first mold and a second mold. At a mold face (PL face) of the molds, a substrate supply-set surface having a flat shape without a step is provided. A pot block is joined with and separated from a side ... 01/25/07 - 20070020814 - Methods of underfilling and encapsulating semiconductor assemblies with materials having selected properties using stereolithography Methods of forming semiconductor packages include immersing a semiconductor device assembly in a liquid photopolymerizable resin including a plurality of discrete particles dispersed therethrough, and selectively at least partially curing portions of the resin adjacent at least one semiconductor die of the semiconductor device assembly. In some embodiments, the semiconductor ... 01/11/07 - 20070010046 - Semiconductor device and method for manufacturing the same In a method of manufacturing a semiconductor device of the invention, a rigid substrate which supports one or more semiconductor elements on a surface of the substrate and is clamped between an upper mold and a lower mold of an encapsulation mold at a time of resin encapsulation is provided, ... 12/21/06 - 20060286722 - Methods for making microwave circuits Disclosed are methods for making microwave circuits using thickfilm components. In an embodiment, the method includes depositing a dielectric over a ground plane, and then forming a conductor on the dielectric. The conductor is formed by depositing a conductive thickfilm on the dielectric and then “subsintering” the conductive thickfilm. In ... 11/23/06 - 20060263943 - Leadframe alteration to direct compound flow into package A leadframe comprising a downset formed adjacent to an edge of the leadframe so as to direct the molding compound to flow evenly inside the mold cavity. The downset has an upward slope extending from the edge of the frame and levels off with the rest of the frame at ... 11/16/06 - 20060258055 - Wiring board and method of manufacturing the same A wiring board has a circuit pattern that includes metal foil attached to an insulating layer, and a built-up circuit pattern disposed on top of the metal foil circuit pattern. The built-up circuit pattern is an increased thickness laminate of cold spray processed metal material. Even when a power semiconductor ... 10/26/06 - 20060240601 - Selective smile formation under transfer gate in a cmos image sensor pixel A pixel includes a photodiode and a transfer transistor. The transfer transistor is formed between the photodiode and a floating node and selectively operative to transfer a signal from the photodiode to the floating node. The transfer transistor has a bird's beak structure formed at the interface of its transfer ... 09/28/06 - 20060216867 - Method of manufacturing a semiconductor device In the manufacture of a semiconductor device, a molding die is used having a resin sealing member forming section positioned over the main surface of a wiring substrate so as to cover a semiconductor chip mounted on the wiring substrate, and a resin flowing path crossing one side of the ... 08/31/06 - 20060194372 - Mold cleaning sheet and manufacturing method of a semiconductor device using the same A cleaning sheet with frame for cleaning a molding die comprising a cleaning heat main body that covers the entire mating surface of a molding die and a reinforcing frame which can be disposed along the peripheral edge to the outside of the plural cavities of the mating surface of ... 08/03/06 - 20060172466 - Semiconductor device and a method of manufacturing the same A semiconductor device having improved performance and improvement manufacturing yield is provided. After a semiconductor integrated circuit including a phase change memory and a nonvolatile memory other than a phase change memory is formed in a semiconductor substrate, an inspection step such as a probe inspection is performed. In accordance ... 06/29/06 - 20060141675 - Method of manufacturing heat spreader having vapor chamber defined therein A method for manufacturing a vapor chamber-based heat spreader includes the following steps: (1) providing a mold, the mold having a surface; (2) electrodepositing a layer of metal coating on the surface of the mold; (3) removing the mold from the coating layer, wherein the coating layer defines therein a ... 06/22/06 - 20060134835 - Method for making a neo-layer comprising embedded discrete components A stackable neo-layer comprising one or more embedded discrete electrical components is provided. A plurality of conductive traces, some of which terminate at a peripheral edge of the layer, are formed on sacrificial substrate in a series of process steps and discrete electrical components such as thick film components or ... 06/15/06 - 20060128069 - Package structure with embedded chip and method for fabricating the same A package structure with embedded chip and a fabrication method thereof are proposed. A carrier board is provided, and at least one semiconductor chip is mounted on the carrier board. A core board having a cavity corresponding in position to the semiconductor chip and an insulating layer are pressed on ... 06/08/06 - 20060121647 - Carrier-free semiconductor package and fabrication method thereof A carrier-free semiconductor package and a fabrication method thereof are provided. The fabrication method includes the steps of: providing a carrier having a plurality of electrical contacts formed thereon; mounting at least one chip on the carrier; electrically connecting the chip to the electrical contacts via a plurality of bonding ... 05/18/06 - 20060105502 - Assembly process An assembly process. The process includes providing a conductive substrate comprising opposing first and second surfaces, recessing the conductive substrate, forming a plurality of traces in the first surface, disposing an electronic device electrically connecting the traces, forming a patterned mask layer covering parts of the second surface of the ... 04/20/06 - 20060084203 - Method for fabricating quad flat non-leaded package The present invention discloses a method for fabricating a quad flat non-leaded package. A lead frame is disposed on a lower mold equipped with a resilient film. The lead frame includes at least a package unit comprising a chip pedestal and a plurality of pins spatially disposed around the chip ... 03/09/06 - 20060051900 - Method of manufacturing a semiconductor device A method of manufacturing a semiconductor device has: preparing a semiconductor wafer having electrode pads formed on the main surface; forming contact portions, which connect to the electrode pads, on the main surface; forming a sealing resin over the main surface; grinding the top face of the sealing resin for ... 02/16/06 - 20060035414 - Process and lead frame for making leadless semiconductor packages A process for making a plurality of leadless packages is disclosed. Firstly, chips are attached onto a lead frame with a first metal layer formed thereon. After a wire bonding step and an encapsulating step are conducted, a portion of each lead of the lead frame is etched away to ... 02/02/06 - 20060024865 - Method for shielding printed circuit board circuits A method for shielding one or more circuits (21, 21′) of a printed circuit board includes depositing a layer of dielectric material (43) over a printed circuit board substrate (22) and the printed circuits (21, 21′), creating a trench-like opening (44) in the dielectric layer (43) such that the trench-like ... 01/26/06 - 20060019431 - Encapsulation of conductive lines of semiconductor devices A method of encapsulating conductive lines of semiconductor devices and a structure thereof. An encapsulating protective material comprising TaN, Ta, Ti, TiN, or combinations thereof is disposed over conductive lines of a semiconductor device. The encapsulating protective material protects the conductive lines from harsh etch chemistries when a subsequently deposited ... 01/05/06 - 20060003495 - Method for fabricating an electronic component embedded substrate A method for fabricating an electronic component embedded substrate including an electronic component that is embedded within a buildup layer is disclosed. The method includes a first buildup layer lamination step of laminating plural first buildup layers on a core substrate such that the total thickness of the first buildup ... 01/05/06 - 20060003494 - Stacked package electronic device An electrical component includes a substrate, a first integrated circuit attached to the substrate, a metal portion coupled to the first integrated circuit, and a second integrated circuit attached to the first integrated circuit. The metal portion is sandwiched between the first integrated circuit and the second integrated circuit. ... 12/29/05 - 20050287713 - Method for fabricating semiconductor packages A method for fabricating semiconductor packages is proposed. A plurality of substrates are prepared each having a chip thereon. Length and width of each substrate are equal to predetermined length and width of the semiconductor package. A carrier having a plurality of openings is prepared. A protruded portion is formed ... 07/14/05 - 20050153483 - Carrier, method of manufacturing a carrier and an electronic device The carrier (30) comprises a first etch mask (14), a first metal layer (11), an intermediate layer (12), a second metal layer (13) and a second etch mask (17). Both the first and the second etch mask (14, 17) can be provided in one step by means of electrochemical plating. ... 06/23/05 - 20050136571 - Encapsulating a device An encapsulation for an electrical device is disclosed. A cap support is provided in the non-active regions of the device to prevent the package from contacting the active components of the device due to mechanical stress induced in the package. ... ### FreshPatents.com Support |