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Semiconductor Device Manufacturing: Process > Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor > Metallic Housing Or Support > Possessing Thermal Dissipation Structure (i.e., Heat Sink) Possessing Thermal Dissipation Structure (i.e., Heat Sink)Possessing Thermal Dissipation Structure (i.e., Heat Sink) patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.03/29/07 - 20070072344 - Gel package structural enhancement of compression system board connections A MCM system board uses a stiffener arrangement to enhance mechanical, thermo and electrical properties by incorporating an LGA compression connector in a computer system. The present designs of large scale computing systems (LSCS) in IBM use a MCM that is attached to a system board and held together by ... 02/08/07 - 20070031996 - Packaged integrated circuit having a heat spreader and method therefor An integrated circuit is packaged, in one embodiment, by wire bonding to pads supported by tape. The tape also supports traces that run from the wire bonded location to a pad for solder balls. A heat spreader is thermally connected to the integrated circuit and is located not just in ... 01/25/07 - 20070020813 - Device and method for package warp compensation in an integrated heat spreader A device and method for designing and manufacturing an integrated heat spreader so that the integrated heat spreader will have a flat surface on which to mount a heat sink after being assembled into a package and exposed to the heat of a die. This device and method for designing ... 01/04/07 - 20070004091 - Semiconductor device and manufacturing method thereof A semiconductor device having high reliability and excellent heat radiation and a method for manufacturing the device at low coat. A semiconductor element and a cover as a heat radiation member are bonded through a solder-containing carbon member having a structure that outside solder layers are formed on a surface ... 01/04/07 - 20070004090 - Electronic assembly with backplate having at least one thermal insert A technique for manufacturing an electronic assembly includes a number of steps. Initially, a backplate with a cavity formed into a first side of the backplate is provided. Next, an insert is inserted within the cavity. Then, a substrate, with a first side of an integrated circuit (IC) die mounted ... 12/28/06 - 20060292751 - Technique for manufacturing an overmolded electronic assembly A technique for manufacturing an electronic assembly uses a mold that has a first mold portion and a second mold portion. The first mold portion includes a plurality of spaced mold pins extending from an inner surface. A cavity of the first and second mold portions provides a mold cavity, ... 12/07/06 - 20060275952 - Method for making electronic devices Disclosed are methods for forming an electronic device that comprises a material that functions as an underfill material as well as a thermal interface material simultaneously. The electronic assembly comprising a heat dissipating element, a semiconductor chip, a substrate and a thermally conductive material is also given here, wherein the ... 11/30/06 - 20060270116 - System and method using self-assembled nano structures in the design and fabrication of an integrated circuit micro-cooler Heat sink structures employing carbon nanotube or nanowire arrays to reduce the thermal interface resistance between an integrated circuit chip and the heat sink are disclosed. Carbon nanotube arrays are combined with a thermally conductive metal filler disposed between the nanotubes. This structure produces a thermal interface with high axial ... 11/16/06 - 20060258054 - Method for producing free-standing carbon nanotube thermal pads Methods for producing carbon nanotube thermal pads comprise forming an array of carbon nanotubes on a catalyst layer on a substrate and releasing the array from the substrate. The carbon nanotubes are grown so that they are generally vertically aligned relative to the substrate. Releasing the array can include dissolving ... 10/05/06 - 20060223237 - Method of manufacturing enhanced thermal dissipation integrated circuit package The present invention relates to an integrated circuit package having a thermally conductive element thermally coupled to a semiconductor die and a heat sink, and a method of manufacturing said integrated circuit package. The thermally conductive element is integrated into the package to enhance thermal dissipation characteristics of the package. ... 09/28/06 - 20060216865 - Direct cooling of leds A thermal management system is provided for semiconductor devices such as an LED array, wherein coolant directly cools the LED array. Preferably, the coolant may be selected, among other bases, based on its index of refraction relative to the index associated with the semiconductor device. ... 09/21/06 - 20060211175 - Heatsink apparatus and thermally-conductive intermediate material for dissipating heat in semiconductor packages A semiconductor package comprising a die adjacent a lead frame die pad, said lead frame die pad adapted to dissipate heat from the die. The package further comprises a thermally-conductive material abutting the die and a heatsink abutting the thermally-conductive material, said heatsink facing a direction opposite from the lead ... 09/14/06 - 20060205118 - Chip heat dissipation structure and manufacturing method This invention discloses a manufacturing method and a structure for a chip heat dissipation. This heat dissipation structure includes a bottom plate of circuit structure, a die of central processing unit and a cap. The cover is often used in conducting the waste heat generated from the chip. The cover ... 09/07/06 - 20060199309 - High thermal conductive compounds A multimodal particles having aspect ratios from 1 to about 1.6, for example multimodal diamond powder, is mixed into a suitable base like epoxy, potting compound or adhesive to form a compound with enhanced thermal conductivity. The powder may be hydrogenated in a blanket of hydrogen in an furnace after ... 08/03/06 - 20060172465 - Device packages Devices such as amplifiers are built on a heat sink having a perimeter wall surrounding active electronic devices. Surprisingly formation of wire bonds to such devices tends to be degraded if they have an aspect ratio greater than 2:1. This problem is overcome by forming wire bonds before such walls ... 06/29/06 - 20060141671 - Thermal interface structure with integrated liquid cooling and methods A method and device for thermal conduction is provided. A thermal interface device and method of formation is described that includes advantages such as improved interfacial strength, and improved interfacial contact. Embodiments of thermal conduction structures are shown that provide composite thermal conduction and circulated liquid cooling. Embodiments are further ... 04/06/06 - 20060073640 - Diamond substrate formation for electronic assemblies Electronic assemblies and methods for forming assemblies including a diamond substrate are described. One embodiment includes providing a diamond support and forming a porous layer of SiO2 on the diamond support. A diamond layer is formed by chemical vapor deposition on the porous layer so that the porous layer is ... 03/23/06 - 20060063310 - Method for attaching a semiconductor die to a substrate and heat spreader Disclosed are embodiments of a method of attaching a die to a substrate and a heat spreader to the die in a single heating operation. A number of conductive bumps extending from the die may also be reflowed during this heating operation. Other embodiments are described and claimed. ... 02/16/06 - 20060035413 - Thermal protection for electronic components during processing A method and device for cooling an electronic component during its manufacture, repair, or rework. There is a cooling unit in thermal communication with the electronic component which extracts heat therefrom. ... 01/26/06 - 20060019430 - Semiconductor device with improved heat dissipation, and a method of making semiconductor device A semiconductor device includes a semiconductor chip, a heat dissipation member for dissipating heat generated by the semiconductor chip, and a coupling member which thermally couples the semiconductor chip to the heat dissipation member, wherein the coupling member is made of metal and deformable to absorb a stress generated between ... 01/26/06 - 20060019429 - Method for manufacturing plastic ball grid array package with integral heatsink A plastic ball grid array semiconductor package employs a metal heat spreader having supporting arms embedded in the molding cap, in which the embedded supporting arms are not directly affixed to the substrate or in which any supporting arm that is affixed to the substrate is affixed using a resilient ... 01/19/06 - 20060014324 - Method and apparatus for cutting away excess synthetic resin from synthetic resin package of electronic component A method is provided for cutting excess synthetic resin 7, which projects from a resin package 6 of an electronic component, at the root connected to the package, the excess synthetic resin being produced in molding the resin package. The excess synthetic resin 7 is cut by laying a thin ... 01/19/06 - 20060014323 - Thermal interface material with fluid A thermal interface material is provided to insert into a gap (49) between a heat sink (20) and a heat source (30) in order to dissipate heat from the heat source. The gap has air (51) therein. The thermal interface material may include a fluid (11) and a number of ... 12/29/05 - 20050287709 - Process for manufacturing leadless semiconductor packages including an electrical test in a matrix of a leadless leadframe A process for manufacturing a plurality of leadless semiconductor packages includes an electrically testing step to test encapsulated chips in a matrix of a leadless leadframe. Firstly, a leadless leadframe having at least a packaging matrix is provided. The packaging matrix defines a plurality of units and a plurality of ... 11/10/05 - 20050250250 - Diamond composite heat spreader having thermal conductivity gradients and associated methods A diamond composite heat spreader having a variable thermal conductivity gradient can improve control of heat transfer based on a specific application. A diamond-containing region of the heat spreader can contain diamond particles such that the diamond concentration and/or the diamond particle size a varied to produce a desired thermal ... 10/06/05 - 20050221537 - Plastic packaging with high heat dissipation and method for the same The present invention provides a high heat dissipation plastic package and a method for making the same that provides an inexpensive, thin high heat dissipation plastic package with good bonding precision and minimal bleeding of adhesive resin. A Cu foil resin film is formed by bonding an adhesive resin to ... 10/06/05 - 20050221536 - Method of manufacturing radiating plate and semiconductor apparatus using the same A method of manufacturing a radiating plate using In as a thermal conducting bonding material 20 provided between a semiconductor device and a radiating plate 14 and serving to bond a back surface of the semiconductor device to the radiating plate, includes the steps of carrying out a cleaning treatment ... 07/21/05 - 20050158916 - Thermal conductive board, method of manufacturing the same, and power module with the same incorporated therein A sheet-like thermally conductive resin composition containing 70 to 95 wt. % inorganic filler and 5 to 30 wt. % thermosetting resin composition, a lead frame as a wiring pattern, and an electrically conductive heat sink with a metal pole placed therein are superposed, heated and compressed, and thus are ... 07/07/05 - 20050148115 - Programmed material consolidation methods for fabricating heat sinks Programmed material consolidation processes for fabricating heat sinks include the selective consolidation of previously unconsolidated material. The heat dissipation element of the heat sink that has been fabricated by such processes can have non-linear or convoluted passageways therethrough to enhance air flow. An optical recognition may be used in conjunction ... ### FreshPatents.com Support |