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Semiconductor Device Manufacturing: Process > Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor > Metallic Housing Or Support Metallic Housing Or SupportMetallic Housing Or Support patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.03/29/07 - 20070072343 - Semiconductor constructions comprising multi-level patterns of radiation-imageable material The invention includes a semiconductor construction having a wire bonding region associated with a metal-containing layer, and having radiation-imageable material over the metal-containing layer. The radiation-imageable material can be configured as a multi-level pattern having a first topographical region with a first elevational height and a second topographical region with ... 03/22/07 - 20070065989 - Method for manufacturing an adhesive substrate with a die-cavity sidewall A method for manufacturing an adhesive substrate with a die-cavity sidewall is disclosed. A region for forming die-cavity sidewall is defined on one surface of the substrate. The substrate is laminated with a sacrificial film, a partially cured resin is formed between the substrate and the sacrificial film. And then, ... 11/30/06 - 20060270115 - Chip type solid electrolytic capacitor having a small size and a simple structure In a chip type solid electrolytic capacitor including a capacitor element and a packaging resin covering the capacitor element, the packaging resin has a mount surface and a side surface adjacent to the mount surface. A terminal is electrically connected to the capacitor element and coupled to the packaging resin. ... 11/02/06 - 20060246628 - Chipcard with contact areas and method for producing contact areas A chip card with a chip module having an integrated circuit and, for external contacting, has on a main face a contact zone with a number of contact areas which are spaced apart from one another and are electrically connected to the integrated circuit. At least one contact area is ... 10/05/06 - 20060223236 - Method of manufacturing flexible circuit substrate Connection pads and alignment marks are formed on a long metal thin plate that is carried in a longitudinal direction, and then an insulating layer for covering the connection pads is formed. Then, via holes, which are aligned and arranged on the connection pads by utilizing the alignment marks, are ... 06/01/06 - 20060115931 - Semiconductor package substrate with embedded chip and fabrication method thereof A semiconductor package substrate with embedded chip and a fabrication method thereof are provided. A first insulating layer is applied on a metallic board, and formed with at least one opening for exposing a portion of the metallic board. At least one semiconductor chip is mounted on the exposed portion ... 05/25/06 - 20060110854 - Methods and systems for providing mems devices with a top cap and upper sense plate A method for fabricating a MEMS device having a top cap and an upper sense plate is described. The method includes producing a device wafer including an etched substrate, etched MEMS device components, and interconnect metal, a portion of the interconnect metal being bond pads and adding a metal wraparound ... 05/18/06 - 20060105500 - Process for fabricating chip embedded package structure A process for fabricating a chip embedded package structure is provided. A stiffener is disposed on a tape. A chip is disposed on the tape inside a chip opening of the stiffener such that an active surface of the chip faces the tape. Through holes are formed passing the tape ... 05/18/06 - 20060105499 - Chip packaging systems and methods An automated process for performing MEMS packaging including automatically attaching a die to a chip carrier, resulting in a chip carrier assembly, automatically moving the chip carrier assembly into a vacuum chamber, wherein the vacuum chamber includes one or more lids therein, automatically securing a lid to the chip carrier ... 04/13/06 - 20060079027 - Semiconductor device and its manufacturing method A manufacturing method of a thin and small-sized semiconductor device, which is integrated into an electronic instrument. A silicon wafer is prepared, and oxide films are formed on the main face and the rear face of the wafer. An insulating film is selectively formed on the main face of the ... 03/09/06 - 20060051898 - Electronic assemblies having a low processing temperature Embodiments relate to electronic assemblies and methods for forming electronic assemblies. One method includes providing a die and a copper heat spreader that are to be coupled to one another through a thermal interface material. A layer of tin is formed on the copper heat spreader. The heat spreader and ... 02/23/06 - 20060040428 - Conductive structures for microfeature devices and methods for fabricating microfeature devices Methods for fabricating conductive structures on and/or in interposing devices and microfeature devices that are formed using such methods are disclosed herein. In one embodiment, a method for fabricating interposer devices having substrates includes forming a plurality of conductive sections on a first substrate in a first pattern. The method ... 01/19/06 - 20060014322 - Methods and apparatuses relating to block configurations and fluidic self-assembly processes An apparatus and methods of making an electronic assembly. The electronic assembly comprises a functional block having at least one asymmetric feature. The functional block comprises an integrated circuitry to perform a function pertaining to the electronic assembly. The electronic assembly further comprises a substrate having a receptor site to ... 11/17/05 - 20050255635 - Microelectronic assembly having a thermally conductive member with a cavity to contain a portion of a thermal interface material A thermally conductive member is placed adjacent a microelectronic die with a thermal interface material between the microelectronic die and a wetting layer formed on a surface of the thermally conductive member. The thermal interface material is heated to cause reflow thereof. The first portion of the thermal interface material ... 09/08/05 - 20050196902 - Method of fabricating film carrier A method of fabricating a film carrier. The method comprises the steps of providing a film; forming a plurality of sprocket holes in the film; forming a metallic layer on the film; patterning the film in an etching operation to form a plurality of openings; and, patterning the metallic layer ... ### FreshPatents.com Support |