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Semiconductor Device Manufacturing: Process > Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor > Including Adhesive Bonding Step > Electrically Conductive Adhesive Electrically Conductive AdhesiveElectrically Conductive Adhesive patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.02/08/07 - 20070031995 - Mounting structure, electro-optical device, and electronic apparatus A mounting structure is provided. The mounting structure includes: a substrate; a line formed on the substrate; an electronic component in which a terminal having a protrusion protruded to the substrate and made of an elastic material and a conductive member disposed on the protruded surface of the protrusion and ... 01/25/07 - 20070020812 - Circuit board structure integrated with semiconductor chip and method of fabricating the same A circuit board structure integrated with semiconductor chip and a method of fabricating the same are proposed. A supporting plate formed with at least one cavity is provided and a semiconductor chip having a plurality of conductive contacts is embedded in the cavity. An anisotropic conductive film (ACF) layer and ... 01/04/07 - 20070004089 - Stacked memory and manufacturing method thereof To mount a TSOP on an interposer substrate, leads provided to the TSOP are joined to pads of the interposer substrate by a thermosetting conductive resin, and the TSOP exclusive of the leads is joined to ground layers formed in the interposer substrate by a thermosetting conductive resin. The interposer ... 12/21/06 - 20060286721 - Breakable interconnects and structures formed thereby Methods of forming a microelectronic structure are described. Embodiments of those methods include placing an anisotropic conductive layer comprising at least one compliant conductive sphere on at least one interconnect structure disposed on a first substrate, applying pressure to contact the compliant conductive spheres to the at least one interconnect ... 08/10/06 - 20060177971 - Anisotropically conductive connector, production process thereof and application product thereof Disclosed herein are an anisotropically conductive connector, by which positioning, and holding and fixing to a circuit device can be conducted with ease even when the pitch of electrodes of the circuit device to be connected is small, and moreover good conductivity can be achieved as to all conductive parts, ... 05/11/06 - 20060099739 - Semiconductor device and method of manufacture thereof, circuit board and electronic instrument A method of manufacturing a semiconductor device includes (a) interposing an adhesive between a surface of a substrate on which an interconnect pattern is formed and a surface of a semiconductor chip on which electrodes are formed; and (b) applying pressure between the semiconductor chip and the substrate, and covering ... 03/09/06 - 20060051897 - Technique for attaching die to leads A semiconductor die assembly comprising a semiconductor die with bond pads, a plurality of leads which extend across the semiconductor die and terminates over their respective bond pads, and an alpha barrier preferably positioned between the leads and the semiconductor die. Electrical connection is made between the leads and their ... 02/16/06 - 20060035412 - Semiconductor attachment method An improved semiconductor attachment method that works with mixed assemblies on printed circuit boards or ceramic substrates maintains reliability and reduces the amount of lead-based solders used. A soft solder layer, which may be high in lead content, is deposited on the terminations of a semiconductor die. The soft solder ... ### FreshPatents.com Support |