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Semiconductor Device Manufacturing: Process > Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor > Including Adhesive Bonding Step Including Adhesive Bonding StepIncluding Adhesive Bonding Step patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.04/19/07 - 20070087481 - Underfill aiding process for a tape A tape having a predetermined area is provided for a chip. A hole is drilled within the predetermined area. The chip is adhered to the predetermined area by underfilling an underfill material between the chip and the tape from one side of the chip. By the hole, the invention provides ... 04/12/07 - 20070082430 - Semiconductor device and manufacturing method thereof A high performance electric device which uses an adhesive layer over a substrate. A color filter is over a substrate, and an adhesive layer is also located over the substrate and color film. An insulating layer is over the adhesive layer, and thin film transistors cover the insulating film and ... 04/05/07 - 20070077688 - Method for manufacturing flexible printed circuit boards A method for manufacturing of flexible printed circuit boards is provided. The method includes the steps of: providing a tape substrate having an electrically insulating layer and an electrically conducting layer; forming a wiring pattern at the electrically conducting layer; attaching a back film on a surface of the tape ... 03/22/07 - 20070065988 - Method for manufacturing substrate with cavity A method for manufacturing a substrate having a cavity is disclosed. The method comprises: (a) forming a first circuit patter on both sides of a seed layer by use of a first dry film, the seed layer being for forming a circuit pattern on both sides; (b) laminating a second ... 03/15/07 - 20070059864 - Method for manufacturing thermal interface material with carbon nanotubes A method for manufacturing a thermal interface material includes the steps of: (a) forming an array of carbon nanotubes on a substrate; (b) submerging the carbon nanotubes in a liquid macromolecular material; (c) solidifying the liquid macromolecular material; and (d) cutting the solidified liquid macromolecular material, to obtain the thermal ... 02/22/07 - 20070042533 - Heat conductive silicone grease composition and cured product thereof Provided is a heat conductive silicone grease composition including (A) 100 parts by mass of an organopolysiloxane containing 2 or more alkenyl groups bonded to silicon atoms within each molecule, (B) an organohydrogenpolysiloxane containing 2 or more hydrogen atoms bonded to silicon atoms within each molecule, in sufficient quantity to ... 02/01/07 - 20070026573 - Method of making a stacked die package A method of making a stacked die package (50) includes attaching and electrically connecting a first integrated circuit (IC) die (52) to a base carrier (56). A plurality of successive layers (54A, 54B and 54C) of an adhesive material (54) is formed on the first die (52). A second die ... 01/25/07 - 20070020811 - Method and apparatus for attaching microelectronic substrates and support members A microelectronic package and method for forming such packages. In one embodiment, the package can be formed by providing a support member having a first surface, a second surface facing opposite the first surface, and a projection extending away from the first surface. A quantity of adhesive material can be ... 01/25/07 - 20070020810 - Thermoplastic/thermoset composition material and method of attaching a wafer to a substrate A process for mounting a wafer on a substrate includes applying a pre-applied die attach on a backside of the wafer with a composition having a thermoplastic portion and a thermoset portion. The composition has a predetermined cure temperature. The process further includes heating the wafer to a temperature sufficient ... 12/28/06 - 20060292750 - Standoffs for centralizing internals in packaging process A semiconductor device, semiconductor die package, mold tooling, and methods of fabricating the device and packages are provided. In one embodiment, the semiconductor device comprises a pair of semiconductor dies mounted on opposing sides of a flexible tape substrate, the outer surfaces of the dies having one or more standoffs ... 12/21/06 - 20060286720 - Method for fabricating nonvolatile semiconductor memory device An adhesion layer composed of a titanium film and a titanium nitride film is formed by CVD on the inner wall of a contact hole formed in a multilayer film composed of an interlayer insulating film, a silicon nitride film, and a silicon dioxide film. Then, a conductive film made ... 12/14/06 - 20060281227 - Bond method and structure using selective application of spin on glass A method for bonding substrate structures. The method includes providing a transparent substrate structure, the transparent substrate structure comprising a face region and an incident light region, providing a spacer structure, the spacer structure comprising a selected thickness of material, the spacer structure having a spacer face region and a ... 11/30/06 - 20060270114 - Semiconductor device and method for manufacturing the same The present invention provides a semiconductor device having a structure that can be mounted on a wiring substrate, as for the semiconductor device formed over a thin film-thickness substrate, a film-shaped substrate, or a sheet-like substrate. In addition, the present invention provides a method for manufacturing a semiconductor device that ... 11/30/06 - 20060270113 - Method and system for reducing simultaneous switching output noise A method and a system for reducing the simultaneous switching output noise in integrated circuit chips. The method includes sending a previous bit pattern and a current bit pattern consecutively on the data bus, wherein the previous bit pattern transitions to the current bit pattern and the number of bits ... 11/16/06 - 20060258053 - Method for manufacturing electronic component-embedded printed circuit board Disclosed herein is a method for manufacturing a component-embedded printed circuit board that is economically advantageous and simple. The method is characterized by stacking boards in which a high density of electronic components are mounted to form a core layer in which the electronic components are embedded, and by subsequently ... 11/02/06 - 20060246627 - Technique for enhancing thermal and mechanical characteristics of an underfill material of a substrate/die assembly During the formation of an underfill material provided between a carrier substrate and a semiconductor chip, a common motion of particles contained in the underfill material is initiated towards the semiconductor chip, thereby adjusting the thermal and mechanical behavior of the underfill material. For instance, by applying an external force, ... 10/26/06 - 20060240597 - Method for fabricating semiconductor device A method for fabricating a semiconductor device, which includes the steps of: removing an abnormal layer formed on a surface of a wiring substrate, the wiring substrate having a first interlayer insulating film formed on a semiconductor substrate, the first interlayer insulating film having a first recess in which a ... 10/05/06 - 20060223235 - Resin-sealing semiconductor package and method and device for manufacturing the same The present invention is characterized in that a powdery or granular resin composition stirred and melted in an agitating pot having a heater, the agitated and melted resin composition is taken out and formed in the form of a package under pressure, and the formed resin composition is fitted to ... 09/28/06 - 20060216864 - Stacked die in die bga package Semiconductor devices and stacked die assemblies, and methods of fabricating the devices and assemblies for increasing semiconductor device density are provided. ... 09/28/06 - 20060216863 - Method of manufacturing semiconductor device A method of manufacturing a semiconductor device includes a step of preparing a first chip having a plurality of first pads and a second chip having a plurality of second pads, a step of forming a first bump electrode on one of the plurality of first pads by a wire ... 09/21/06 - 20060211174 - Flip-chip adaptor package for bare die A board for connecting a bare semiconductor die with a bond pad arrangement which does not conform to a master printed circuit board with a specific or standardized pin out, connector pad, or lead placement arrangement. The board comprises a printed circuit board including first elements, such as minute solder ... 09/14/06 - 20060205117 - Solder masks used in encapsulation, assemblies including the solar mask, and methods A carrier (e.g., a carrier substrate, such as a circuit board, etc.) may be modified to include a solder mask on a surface thereof. The solder mask, which may extend to or beyond an edge of the carrier, includes an opening that exposes at least one contact area of the ... 09/14/06 - 20060205116 - Methods for packaging microfeature devices and microfeature devices formed by such methods Methods for packaging microfeature devices on and/or in microfeature workpieces at the wafer level and microfeature devices that are formed using such methods are disclosed herein. In one embodiment, a method comprises providing a workpiece including a substrate having a plurality of microelectronic dies on and/or in the substrate. The ... 09/14/06 - 20060205115 - Radio frequency identification (rfid) tag lamination process using liner A method of constructing an RFID unit can include using a protective layer to hold an integrated circuit chip module to a substrate layer with an antenna unit while a conductive adhesive has not yet fully set. ... 08/31/06 - 20060194371 - Method of manufacturing semiconductor device It is an object of the present invention to provide a technology to manufacture a semiconductor sheet or a semiconductor chip with a high yield using a circuit having a thin film transistor. A manufacturing method for a semiconductor device comprises: attaching a flexible base material to an element layer ... 08/31/06 - 20060194370 - Radio frequency module and fabrication method thereof The present invention relates to a RF module and a fabrication method thereof, wherein the packaging steps of a SAW component and a module is carried out simultaneously, thereby simplifying the fabrication process and reducing the size of the module. In the invention, a chip component is mounted on a ... 08/24/06 - 20060189036 - Methods and systems for adhering microfeature workpieces to support members Methods and systems for adhering microfeature workpieces to support members are disclosed. A method in accordance with one embodiment of the invention includes disposing a first adhesive on a surface of a microfeature workpiece, and disposing a second adhesive on a surface of a support member. The method can further ... 08/24/06 - 20060189035 - Placement of absorbing material in a semiconductor device A semiconductor device is provided that includes a hermetically sealed housing having a top member and a bottom member. A semiconductor die is enclosed within the housing and absorbing material is positioned under the semiconductor die. ... 08/10/06 - 20060177970 - Methods of adhering microfeature workpieces, including a chip, to a support member Methods and systems for adhering microfeature workpieces to support members are disclosed. A method in accordance with one embodiment of the invention includes disposing a first adhesive on a surface of a microfeature workpiece, and disposing a second adhesive on a surface of a support member. The method can further ... 07/20/06 - 20060160274 - Methods relating to forming interconnects Methods relating to forming interconnects through injection of conductive materials, to fabricating semiconductor component assemblies, and to resulting assemblies. A semiconductor component substrate, such as a semiconductor die or other substrate, has dielectric material disposed on a surface thereof, surrounding but not covering interconnect elements, such as bond pads, on ... 07/06/06 - 20060148134 - Method of fabricating semiconductor device for reducing parasitic capacitance between bit lines and semiconductor device fabricated thereby In a method of fabricating a semiconductor device capable of reducing parasitic capacitance between bit lines and a semiconductor device fabricated by the method, the semiconductor device includes a semiconductor substrate having buried contact landing pads and direct contact landing pads. A lower interlayer insulating layer is disposed on the ... 06/29/06 - 20060141670 - Method of forming fine metal pattern and method of forming metal line using the same There are provided a method of forming a fine metal pattern and a method of forming a metal line using the same. In the method of forming a fine metal pattern, a substrate is prepared where a first interlayer insulating layer is formed. A via plug is formed on the ... 06/15/06 - 20060128067 - Semiconductor device package A semiconductor package that includes two circuit boards and at least one semiconductor device which is disposed between the two circuit boards and connected to external connectors disposed on at least one of the circuit boards. ... 06/15/06 - 20060128066 - Flexible carrier and release method for high volume electronic package fabrication Methods and apparatus are provided for use in manufacturing a device packaging comprising the steps of: positioning a metal substrate such as spring steel on a magnetic plate so as to expose a surface of the metal substrate; placing a first tape layer on the exposed surface of a metal ... 06/15/06 - 20060128065 - Adhesive sheet, dicing tape intergrated type adhesive sheet, and semiconductor device producing method The invention provides an adhesive sheet which can be stuck to a wafer at low temperatures of 100° C. or below, which is soft to the extent that it can be handled at room temperature, and which can be cut simultaneously with a wafer under usual cutting conditions; a dicing ... 06/08/06 - 20060121646 - Wafer-level underfill process making use of sacrificial contact pad protective material A method for connecting electronic components, such as, an integrated circuit die and a package substrate, is described. According to one aspect of the invention, a contact pad protective material is applied on one or more of the contact pads on an integrated circuit die. The underfill material is applied ... 05/04/06 - 20060094163 - Low resistance and inductance backside through vias and methods of fabricating same A backside contact structure and method of fabricating the structure. The method includes: forming a dielectric isolation in a substrate, the substrate having a frontside and an opposing backside; forming a first dielectric layer on the frontside of the substrate; forming a trench in the first dielectric layer, the trench ... 05/04/06 - 20060094162 - Thin film probe sheet and semiconductor chip inspection system In the highly accurate thin film probe sheet which is used for the contact to electrode pads disposed in high density with narrow pitches resulting from the increase in integration degree of semiconductor chips and for the inspection of semiconductor chips, a large spatial region in which a metal film ... 04/06/06 - 20060073639 - Electronic parts packaging structure and method of manufacturing the same There is provided a electronic parts packaging structure that includes a mounted body on which an electronic parts is mounted, the electronic parts having a connection pad, which has an etching stopper film (a copper film, a gold film, a silver film, or a conductive past film) as an uppermost ... 03/30/06 - 20060068524 - Protective tape separation method, and apparatus using the same The invention relates to an apparatus for separating a protective tape joined to a semiconductor wafer. Before joining a separation tape to a protective tape on a surface of a semiconductor wafer held, from its back side, by a ring frame via a dicing tape while pressing the separation tape ... 03/23/06 - 20060063309 - Method for manufacturing semiconductor device In the case where an integrated circuit formed of a thin film is formed over a substrate and peeled from the substrate, a fissure (also referred to as crack) is generated in the integrated circuit in some cases. The present invention is to restrain the generation of a fissure by ... 03/16/06 - 20060057780 - Manufacturing apparatus of semiconductor devices, and method of manufacturing semiconductor devices A method for manufacturing semiconductor devices, comprises: mounting a substrate on a bonding stage; pressing the substrate to the bonding stage by blowing a compressed air from the upper face side of the substrate; causing the bonding stage to adsorb the substrate by exhausting air from the lower face side ... 03/16/06 - 20060057779 - Silicone-based adhesive sheet, method of bonding a semiconductor chip to a chip attachment component, and a semiconductor device A silicone-based adhesive sheet has either a layer of clay-like curable silicone composition on one side and a layer of slower curing clay-like curable silicone composition than the first composition layer on the other side, or a cured silicone layer on one side and a layer of clay-like curable silicone ... 01/19/06 - 20060014321 - Manufacturing method of semiconductor device and manufacturing method of lead frame Improvement in the reliability of a semiconductor device is aimed at. By heating a lead frame, after preparing a lead frame with a tape, until a resin molding is performed, at the temperature 160 to 300° C. (preferably 180 to 300° C.) for a total of more than 2 minutes ... 01/12/06 - 20060008948 - Method of processing a semiconductor wafer for manufacture of semiconductor device A method of processing a semiconductor wafer that has a first surface and a second surface opposite to the first surface. The method includes forming grooves of a predetermined depth on the second surface on which circuit patterns are formed, attaching a first surface of a protective tape to the ... 12/29/05 - 20050287708 - Semiconductor chip package manufacturing method including screen printing process A method for manufacturing a semiconductor chip package may include screen printing an adhesive on a substrate using a screen printing mask. The adhesive may be heated during a first curing process. A semiconductor chip may be attached to the adhesive on the substrate. The adhesive may be heated during ... 10/27/05 - 20050239235 - Method for manufacturing an adhesive substrate with a die-cavity sidewall A method for manufacturing an adhesive substrate with a die-cavity sidewall is disclosed. A region for forming die-cavity sidewall is defined on one surface of the substrate. The substrate is laminated with a sacrificial film, a partially cured resin is formed between the substrate and the sacrificial film. And then, ... 10/20/05 - 20050233499 - Semiconductor device and manufacturing method of the same Provided is a technology capable of improving a production yield of a semiconductor device having, for example, IGBG as a semiconductor element. After formation of an interconnect on the surface side of a semiconductor substrate, a supporting substrate covering the interconnect is bonded onto the interconnect. Then, a BG tape ... 10/06/05 - 20050221535 - Method for making self-coplanarity bumping shape for flip chip A stud bump structure for electrical interconnection between a pair of members includes a base portion, and a stem portion. The base portion is affixed to a pad or trace in one of the pair of members to be interconnected (such as an integrated circuit chip), and the stem end ... 09/29/05 - 20050214979 - Semiconductor package and method for manufacturing the same A semiconductor package has a substrate made of WCu, WAg, MoCu or MoAg. A plurality of leads are fixed to the substrate by hermetic sealing without an intervening nickel plating layer. A cover is bonded to the substrate with a seal ring which is directly bonded to the substrate by ... 09/22/05 - 20050208709 - Screen-printing metal mask plate and method of resin-sealing vibrating part A squeegee is slid over a metal mask plate so as to fill a sealing resin in a resin inflow space through a through hole, and the sealing resin, deposited on an outer surface of an electronic part that includes a vibrating part, is thermally set. A through hole that ... 09/22/05 - 20050208708 - Adhesive assembly for a circuit board An apparatus and method for an adhesive assembly for securing a printed circuit board to a substrate. The assembly provides a printing tool with a plurality of apertures defined therethrough. Preferably, the apertures have a top opening with a larger area than a bottom opening. The printing tool is placed ... 09/15/05 - 20050202598 - Process for producing optical semiconductor device The invention provides a process for producing an optical semiconductor device, which comprises: (1) forming a resin layer on one or more optical semiconductor elements each mounted on a conductor; and (2) press-molding the resin layer formed in step (1), wherein the optical semiconductor elements each have a vertical section ... 09/01/05 - 20050191792 - Component for fabricating an electronic device and method of fabricating an electronic device A component for fabricating the electronic device comprises a substrate and a conductive film provided on the substrate, in which the adhesion of the conductive film to the substrate is not greater than 0.1 N/cm. The adhesion of the conductive film to the substrate is weak enough to enable the ... 07/21/05 - 20050158915 - Semiconductor device and method of fabricating the same A method of fabricating a semiconductor device includes hardening resin at a temperature that is less than or equal to the boiling point of the resin and until the hardening reaction ratio of the resin has reached at least 80%, the resin being disposed between a wiring board which has ... 06/23/05 - 20050136570 - Process for producing optical semiconductor device The invention provides a process for producing an optical semiconductor device, which comprises: (1) forming a resin layer on one or more optical semiconductor elements each mounted on a conductor; and (2) press-molding the resin layer formed in step (1). ... ### FreshPatents.com Support |