REGISTER now for FREE 
|
FREE patent keyword monitoring and additional FREE benefits. REGISTER now for FREE
|
|
|
Semiconductor Device Manufacturing: Process > Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor > Incorporating Resilient Component (e.g., Spring, Etc.) Incorporating Resilient Component (e.g., Spring, Etc.)Incorporating Resilient Component (e.g., Spring, Etc.) patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.04/05/07 - 20070077687 - Method of producing circuit carriers with integrated passive components The present invention relates to a method for producing an electrical subassembly comprising a circuit carrier and at least one passive component which is integrated into the circuit carrier and comprises an electrically functional material. For providing an improved method for manufacturing an electrical subassembly comprising a circuit carrier and ... 04/05/07 - 20070077686 - Packaging method for preventing chips from being interfered and package structure thereof A package structure for preventing chips from being interfered is disclosed. The package structure includes a substrate and a chip. The substrate has a metal layer with a conducting trace area and a shielding area, and a dielectric layer having a plurality of via holes formed therein. The dielectric layer ... 03/29/07 - 20070072342 - Depopulation of a ball grid array to allow via placement The present invention provides an apparatus and methods for the functionality of an integrated circuit. An exemplary embodiment according to an aspect of the present invention includes a ball grid array having open spaces therein. Within the open spaces, pairs of opposite polarity vias are clustered to minimize current path ... 01/25/07 - 20070020809 - Semiconductor device and method of producing high contrast identification mark A semiconductor device (50) includes a semiconductor die (20) having a first surface (14) for forming electronic circuitry. A coating layer (16) formed on a second surface (15) of the semiconductor die has a color that contrasts with the color of the semiconductor die. The coating layer is patterned to ... 12/21/06 - 20060286719 - Semiconductor packages and methods of manufacturing thereof Described are semiconductor package devices with improved reliability and methods of manufacturing thereof. In one embodiment, a package device is disclosed that includes a chip having an active surface and a coupling surface opposite the active surface, where the chip has one or more integrated circuits and bumps. The device ... 08/24/06 - 20060189034 - Thin film processing method and thin film processing apparatus A thin film processing method for processing the thin film by irradiating an optical beam to the thin film. A unit of the irradiation of the optical beam includes a first and a second optical pulse irradiation to the thin film, and the unit of the irradiation is carried out ... 08/10/06 - 20060177969 - Method for interconnecting semiconductor components with substrates and contact means A semiconductor component includes a substrate having a plurality of compliant contact bumps formed over a surface thereof. A semiconductor chip has a plurality of contact regions formed over a surface thereof. The compliant contact bumps of the substrate are electrically connected with the contact regions of the semiconductor chip ... 07/06/06 - 20060148133 - Method of forming a mems device A method of forming a MEMS device first releases structure, relative to a substrate, to form a space between the structure and the substrate. The process then adds material to the space between the structure and the substrate to substantially stabilize the structure relative to the substrate. Then, at some ... 05/18/06 - 20060105498 - Wafer stack separator An integrated circuit wafer container and separator combination. The separator comprises a substantially flat main area and a plurality of elevated projections in the periphery thereof. The elevated projections sustain the weight of the wafer stacks, avoid vacuum adhesion, and minimize contact with wafers. ... 01/05/06 - 20060003493 - Integrated metallic contact probe storage device A mass storage device includes a probe that has a cantilever having a first end region operatively connected to a substrate and a second end region rotated in a direction such that the second end region is opposed to the first end region. A tip is disposed on the second ... 12/22/05 - 20050282314 - Printed circuit boards and methods for fabricating the same Printed circuit boards and methods for fabricating the same. A via in a printed circuit board electrically connects to trace lines of the PCB, such that only one plating line is required to electrically connect a plating bus and the plating through hole. Thus, in an electroplating step, current can ... 08/18/05 - 20050181541 - Method of producing a cof flexible printed wiring board The present invention provides a COF flexible printed wiring board whose insulating layer is not melt-adhered to a heating tool, to thereby enhance reliability and productivity of a semiconductor chip mounting line, and also provides a method of producing the COF flexible printed wiring board. The COF flexible printed wiring ... ### FreshPatents.com Support |