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Semiconductor Device Manufacturing: Process > Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor > Having Light Transmissive Window Having Light Transmissive WindowHaving Light Transmissive Window patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.12/28/06 - 20060292749 - Photochromic substrate container A semiconductor wafer, substrate, or reticle storage or shipping device that includes a photochromic indicator of exposure to undesired electromagnetic radiation. The present invention includes the incorporation of a photochromic material into the plastic used to fabricate at least a portion of a semiconductor wafer, disk, or reticle shipping or ... 12/28/06 - 20060292748 - Package having bond-sealed underbump A package for containing microelectromechanical devices includes a first substrate wafer, and a second substrate wafer made of an optical quality material. An underbump is interposed between the first and second substrate wafers. The underbump is composed of a standoff region and a localized bond region. The first and second ... 12/28/06 - 20060292747 - Top-surface-mount power light emitter with integral heat sink A light emitting apparatus is disclosed. The light emitting apparatus includes a substrate, a heat sink, a dielectric layer, conductive traces, a reflector, and at least one photonic device. The substrate has a top surface and a bottom surface, a portion of the top surface defining a mounting pad. The ... 09/21/06 - 20060211173 - Package of image sensor device and formation thereof A package of CMOS image sensor device and the formation thereof are provided. The package includes a soft layer between an image sensor device and a substrate. The image sensor device has multitudes of conductive structures distributed around a photo-sensing zone. The substrate has multitudes of conductive pads distributed around ... 03/02/06 - 20060046351 - Methods for packaging image sensitive electronic devices The invention provides methods for packaging for electronic devices that are light or other radiation-sensitive, such as image sensors including CCD or CMOS chips. In one embodiment of the invention, an image sensor package is assembled by surrounding a chip with a barrier of transfer mold compound and covering the ... 02/09/06 - 20060030079 - Wafer level package structure of optical-electronic device and method for making the same A wafer level package structure of optical-electronic device and method for making the same are disclosed. The wafer level package structure of optical-electronic device is provided by employing a substrate whose surfaces have several optical sensitive areas and divided into individual package devices. The manufacture steps first involve providing a ... 10/20/05 - 20050233498 - Mems device wafer-level package A method and system in which a semiconductor wafer having a plurality of dies is inspected through a visual inspection and/or an electrical test. If certain of the dies on the wafer pass the inspection, then windows are mounted or affixed above those certain dies while they are still a ... 08/25/05 - 20050186710 - Integrated circuit package provided with cooperatively arranged illumination and sensing capabilities An integrated circuit package includes an angled one-piece substrate having a light source fixed to one area and a sensor die fixed to a second area, such that the light source is directed to illuminate the field of view of the sensor die when a surface of interest is imaged. ... ### FreshPatents.com Support |