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Semiconductor Device Manufacturing: Process > Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor > Including Contaminant Removal Or Mitigation Including Contaminant Removal Or MitigationIncluding Contaminant Removal Or Mitigation patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.07/27/06 - 20060166407 - Hermetic packaging A method of hermetically packaging an electronic device (8), in an enclosure (2) comprising mutually inter-engageable first and second housing members (4, 6), comprising the steps of securing the electronic device (8) to the first housing member (4), engaging the first (4) and second (6) housing members such that an ... 07/06/06 - 20060148132 - Method of fabricating a vacuum sealed microdevice package with getters One embodiment of the invention relates to a microdevice package containing getters for maintaining a constant vacuum level within the sealed microdevice package. A stacked wafer assembly, containing a plurality of microdevice packages, is formed by aligning a bottom cover wafer with a center wafer. The bottom cover wafer includes ... 04/13/06 - 20060079026 - Method of the film substrate, a method of the semiconductor device using the same, a method of the display device using the same, and a method of the electric device using the same A method of manufacture is provided in which position deviations during mounting are eliminated, and in which fine connections on the order of a 30 μm pitch can be stabilized. A low cost device can thus be realized by cost reductions that accompany smaller ICs. Mounting is performed in a ... 03/23/06 - 20060063308 - Method for cleaning semiconductor device having dual damascene structure A method to clean a dual damascene structure includes forming a photoresist pattern on an interlayer dielectric; forming a dual damascene structure by etching the interlayer dielectric using the photoresist pattern as an etch mask; removing the photoresist pattern by an ashing process; and cleaning the dual damascene structure with ... 07/21/05 - 20050158914 - Process for manufacturing microelectronic, microoptoelectronic or micromechanical devices The specification teaches a technique for manufacturing microelectronic, microoptoelectronic or micromechanical devices (microdevices) in which a contaminant absorption layer improves the life and operation of the microdevice. In an embodiment, a process for manufacturing the devices includes efficiently integrating a getter material. ... ### FreshPatents.com Support |