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Semiconductor Device Manufacturing: Process > Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor > Making Plural Separate Devices > Substrate Dicing > Utilizing A Coating To Perfect The Dicing Utilizing A Coating To Perfect The DicingUtilizing A Coating To Perfect The Dicing patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.11/23/06 - 20060263941 - Method of manufacturing semiconductor device and method of manufacturing bonding sheet A method of manufacturing a semiconductor device includes the steps of: preparing a bonding sheet having one or more holes that penetrate from a first surface to an opposite second surface thereof, and a semiconductor wafer having a semiconductor element; affixing the bonding sheet to a predetermined surface of the ... 11/02/06 - 20060246626 - Methods for applying front side and edge protection material to electronic devices at the wafer level, devices made by the methods, and systems including the devices Methods for applying a dielectric protective layer to a wafer in wafer-level chip scale package manufacture. A flowable dielectric protective material with fluxing capability is applied over the active surface of an unbumped semiconductor wafer to cover active device areas, bond pads, test socket contact locations, and optional pre-scribed wafer ... 05/11/06 - 20060099738 - Semiconductor device and method for manufacturing the same, and electric appliance The present invention provides a semiconductor device having a plurality of functions and a method for manufacturing the semiconductor device. The semiconductor device comprises a thin film integrated circuit, a first substrate having a sensor or an antenna, and a second substrate having an antenna, wherein the thin film integrated ... 03/16/06 - 20060057778 - Fabricating method of wafer protection layers A fabricating method of wafer protection layers and a wafer structure are provided. The fabricating method includes providing a wafer first. The wafer includes pluralities of chips and has an active surface, a corresponding reverse surface and a plurality of pre-cut trenches on the active surface. On the active surface, ... 03/02/06 - 20060046350 - Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed thereby Methods for creating redistribution layers for only selected dice, such as known good dice, to form relatively thin semiconductor component assemblies and packages, and the assemblies and packages created by the methods, are disclosed. A sacrificial layer is deposited on a support substrate. An etch stop layer having a lower ... 01/26/06 - 20060019428 - Method of and mechanism for peeling adhesive tape bonded to segmented semiconductor wafer An adhesive tape peeling mechanism has an adhering section and a porous member. The adhering section adheres to a segmented semiconductor wafer bonded to adhesive tape. The porous member is provided on the surface adhering to the semiconductor wafer of the adhering section. The porous member is divided into at ... 01/12/06 - 20060008947 - Semiconductor device A method of manufacturing a semiconductor device includes the steps of, (1) preparing a conductive substrate having a main surface and a back surface opposite to the main surface, (2) forming at the main surface of the conductive substrate a plurality of first grooves, which are parallel to each other, ... 10/13/05 - 20050227415 - Method for fabricating encapsulated semiconductor components A semiconductor component includes a thinned semiconductor die having protective polymer layers on up to six surfaces. The component also includes contact bumps on the die embedded in a circuit side polymer layer, and terminal contacts on the contact bumps in a dense area array. A method for fabricating the ... 09/08/05 - 20050196901 - Device mounting method and device transport apparatus A device can be easily mounted on a circuit board. The device mounting method comprises a step in which devices 1 that are diced on a dicing sheet and have connection terminals 11 formed on the side not having the dicing sheet are collectively transferred to a transfer substrate on ... 09/08/05 - 20050196900 - Substrate protection system, device and method A substrate protection system and method are described that, in a preferred embodiment, protect the integrated circuit dies on a semiconductor wafer from damage. A layer of material may be formed over the substrate and the devices formed thereon. ... 06/30/05 - 20050142696 - Method of backside grinding a bumped wafer A method for backside grinding a bumped wafer is disclosed. A wafer has a plurality of bumps formed on the active surface thereof. Prior to grinding the back surface of the wafer, a hot-melt adhesive layer is formed on the active surface of the wafer so as to be adhered ... 06/09/05 - 20050124094 - Method of producing an electronic component An electronic component includes a semiconductor chip that has an active upper side with integrated circuits and a passive rear side. The rear side and the side border regions of the semiconductor chip also form the outer package sides of the electronic component. At least the corner regions and the ... ### FreshPatents.com Support |