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Semiconductor Device Manufacturing: Process > Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor > Making Plural Separate Devices > Using Strip Lead Frame Using Strip Lead FrameUsing Strip Lead Frame patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.12/14/06 - 20060281225 - Wafer level bumpless method of making a flip chip mounted semiconductor device package A wafer level bumpless method of making flip chip mounted semiconductor device packages is disclosed. The method includes the steps of solder mask coating a semiconductor die wafer frontside, processing the solder mask coating to reveal a plurality of gate contact and a plurality of source contacts, patterning a lead ... 11/23/06 - 20060263940 - Method of forming a semiconductor package and leadframe therefor A leadframe for a semiconductor package is formed with an indentation on a bottom surface. A side of the indentation is used to form a mold-lock that assists in securing the leadframe to the encapsulation material of the semiconductor package. ... 08/31/06 - 20060194369 - Carrier for substrate film The invention relates to a carrier for supporting a substrate film during the chip-substrate assembly and bonding process. The carrier provides enhanced rigidity to the substrate film. The degree of rigidity and/or flexibility provided can be controlled by selection of the carrier dimensions, configuration and material choice. Advantages of embodiments ... 02/16/06 - 20060035410 - Solderless component packaging and mounting An apparatus and method for providing three-dimensional carrier mounting of one or more electronic components. In accordance with one embodiment, the device mounting apparatus of the present invention includes an elastically resilient plastic substrate having component mounting surfaces in at least two dimensions. At least one press-fit component insertion cavity ... 11/24/05 - 20050260795 - Method for fabricating leadless packages with mold locking characteristics A method for fabricating leadless packages with mold locking characteristics is disclosed. A provided leadless leadframe has a plurality of units in a matrix, each unit includes an improved die pad with a plurality of indentations, such as semi-vias in the sidewall thereof and a plurality of leads around the ... 11/03/05 - 20050245002 - Method of manufacturing a semiconductor device and used for the same In a lead frame, through holes are formed outside suspending leads and trenches are formed on a back surface along the suspending leads so as to communicate with the through holes. When sealing resin is injected into cavities of a resin molding die, air enters the through holes through air ... ### FreshPatents.com Support - Terms & Conditions |