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Semiconductor Device Manufacturing: Process > Packaging (e.g., With Mounting, Encapsulating, Etc.) Or Treatment Of Packaged Semiconductor > Assembly Of Plural Semiconductive Substrates Each Possessing Electrical Device Assembly Of Plural Semiconductive Substrates Each Possessing Electrical DeviceAssembly Of Plural Semiconductive Substrates Each Possessing Electrical Device patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.04/05/07 - 20070077685 - Production method of semiconductor chip Provided is a method for producing a semiconductor chip, comprising applying a photothermal conversion layer on a light-transmitting support, provided that upon irradiation of radiation energy, the photothermal conversion layer converts the radiation energy into heat and decomposes due to the heat; laminating the semiconductor wafer and the light-transmitting support ... 03/29/07 - 20070072341 - Die package and method for making the same The present invention relates to a die package and method for making the same. The method of the invention comprises the steps of: (a) providing a plate, having a first surface and a second surface; (b) forming a plurality of first dice on the plate, the first dice having a ... 03/22/07 - 20070065984 - Thermal enhanced package for block mold assembly A heat spreader (20) is added to a package to enhance thermal and advantageously electrical performance. In manufacture, a heat spreader precursor (24) is advantageously placed over a group of dies and secured after bonding (e.g., wire or tape bonding or flip-chip bonding) and before matrix/block mold. For example, a ... 03/22/07 - 20070065983 - Decoupling capacitor closely coupled with integrated circuit An integrated circuit module, decoupling capacitor assembly and method are disclosed. The integrated circuit module includes a substrate and integrated circuit die mounted on the substrate and having die pads and an exposed surface opposite from the substrate. A plurality of substrate bonding pads are positioned on the substrate adjacent ... 03/22/07 - 20070065982 - Controlling overspray coating in semiconductor devices A manufacturing method, in which two device bars are bonded prior to facet coating to form a stacked bar pair. In one embodiment, each of the device bars has a p-side and an n-side, each side having a plurality of bonding pads, with at least some bonding pads located at ... 03/15/07 - 20070059861 - Systems and methods for transferring small lot size substrate carriers between processing tools In a first aspect, a method of managing work in progress within a small lot size semiconductor device manufacturing facility is provided. The first method includes providing a small lot size semiconductor device manufacturing facility having (1) a plurality of processing tools; and (2) a high speed transport system adapted ... 02/08/07 - 20070031992 - Apparatuses and methods facilitating functional block deposition A guiding feature used to assist deposition of a functional block into a recessed region formed in a substrate. A template is used to create the guiding feature on a substrate. The template comprises a first feature configured to create a corresponding recessed region in a substrate and a second ... 01/25/07 - 20070020808 - Low profile, chip-scale package and method of fabrication Disclosed is a semiconductor device that includes an electrically insulating, sheet-like substrate with first and second surfaces, at least one opening, and a certain thickness. On the first surface are a plurality of electrically conductive routing strips and a plurality of contact pads; at least one of the contact pads ... 12/28/06 - 20060292744 - Three dimensional device integration method and integrated device A device integration method and integrated device. The method may include the steps of directly bonding a semiconductor device having a substrate to an element; and removing a portion of the substrate to expose a remaining portion of the semiconductor device after bonding. The element may include one of a ... 12/21/06 - 20060286715 - Manufacturing method of semiconductor integrated circuit device During probe testing using a prober having probe needles formed by using a manufacturing technology for a semiconductor integrated circuit device, reliable contact is ensured between the probe needles and test pads. A pressing tool having at least one hole portion formed therein and extending therethrough between the main and ... 12/14/06 - 20060281222 - Manufacturing method of semiconductor integrated circuit device By using a membrane probe formed by using a manufacturing technique for semiconductor integrated circuit devices, the yield of probing collectively performed on a plurality of chips is to be enhanced. A probe card is formed by using a plurality of pushers, each pusher being formed of a POGO pin ... 12/14/06 - 20060281221 - Enhanced routing grid system and method Routing systems and methods are provided having various strategies for optimizing and evaluating possible routes for netlist connections. In one embodiment, a data structure or matrix provides cost related data weighted to evaluate the impact proposed a connection or segment will have upon an attribute of interest such as, for ... 12/07/06 - 20060275950 - Method of manufacturing a flexible display device A method of manufacturing a flexible display includes the steps of coating an adhesive on a first surface of a flexible substrate or a supporter, adhering the first surface of the flexible substrate to the supporter using the adhesive, and forming a thin film pattern on a second surface of ... 11/23/06 - 20060263934 - Chip-type micro-connector and method of packaging the same The chip-type micro-connector includes a package substrate, a micro-connector disposed on the package structure, a plurality of chips, and a cap layer disposed on the micro-connector and the chips. The micro-connector includes a connection substrate, a plurality of connecting wires disposed in the connection substrate, and a plurality of contact ... 11/23/06 - 20060263933 - Use of configurable mixed-signal building block functions to accomplish custom functions A method for producing a chip is disclosed. A first step of the method may involve fabricating the chip only up to and including a first metal layer during a first manufacturing phase such that an input/output (I/O) region of the chip has a plurality of slots, where each of ... 11/16/06 - 20060258048 - Integrated capacitor for wafer level packaging applications A capacitor design, which incorporates a material set that is adaptable to standard substrate or electronic packaging fabrication methods, uses copper as a base and electrode, mesoporous nanocomposite materials or other adhesion promoting materials combined with a high dielectric material specific to the application's capacitance requirements. This capacitor is then ... 11/16/06 - 20060258047 - Method for laser cutting and method of producing function elements At least one exemplary embodiment is directed to a method of cutting a member by irradiating the member with a laser beam including the steps of forming an internal processing area in the depth direction of the member by focusing the laser beam inside the member and forming a melt ... 11/09/06 - 20060252181 - Method of forming a stack of packaged memory dice A stacked assembly of integrated circuit semiconductor devices includes a stack of integrated circuit semiconductor devices supported by a printed circuit board (PCB). One or more multiconductor insulating assemblies provide an interface between terminals of the integrated circuit semiconductor devices and external circuitry. ... 10/26/06 - 20060240594 - Method of making stacked chip electronic package having laminate carrier A method of making a multi-chip electronic package which utilizes an organic, laminate chip carrier and a pair of semiconductor chips positioned on an upper surface of the carrier in a stacked orientation. The organic, laminate chip carrier is comprised of a plurality of conductive planes and dielectric layers and ... 09/14/06 - 20060205113 - Radio frequency identification (rfid) tag lamination process A method of constructing an RFID unit can include using a protective layer to hold an integrated circuit chip module to a substrate layer with an antenna unit while a conductive adhesive has not yet fully set. ... 09/07/06 - 20060199305 - Method for fabricating ultra-high tensile-stressed film and strained-silicon transistors thereof A method for fabricating an ultra-high tensile-stressed nitride film is disclosed. A PECVD process is first performed to deposit a transitional silicon nitride film over a substrate. The transitional silicon nitride film has a first concentration of hydrogen atoms. The transitional silicon nitride film is subjected to UV curing process ... 08/03/06 - 20060172459 - Semiconductor multi-package module having inverted second package stacked over die-up flip-chip ball grid array (bga) package A semiconductor multi-package module has stacked first and second packages, each of which includes a die attached to a substrate, in which the second package is inverted, in which the first and second substrates are interconnected by wire bonding, and in which the first package includes a flip-chip ball grid ... 08/03/06 - 20060172458 - Placement method of an electronic module on a substrate and device produced by said method The aim the disclosed process is to ensure maximum precision both at the level of the manufacturing of an electronic assembly from a chip with small dimensions as well as the level of the placement of such an assembly on an insulating substrate. This aim is achieved by a placement ... 07/06/06 - 20060148130 - Memory chip and semiconductor device using the memory chip and manufacturing method of those In a wafer, a plurality of basic chips F is arranged therein. The basic chip F has a memory capacity of i-mega bytes. By dicing, a memory chip including four basic chips F is cut out of the wafer. The memory chip has a memory capacity of 4×i-mega bytes. A ... 06/22/06 - 20060134828 - Package that integrates passive and active devices with or without a lead frame According to an embodiment of the invention, a component package comprises a plurality of components and mold compound. The plurality of components are disposed on a zero plane of a removable substrate. The removal substrate is operable to hold the plurality of components in position. At least one of the ... 06/01/06 - 20060115928 - Methods for assembling a stack package for high density integrated circuits Methods for assembling a stack package for a high density IC module on a PCB include the steps of assembling a first layer of the stack package on the PCB, assembling a second layer of the stack package on the first layer and assembling a third layer of the stack ... 06/01/06 - 20060115927 - Attachment of flip chips to substrates An anisotropic conductive layer is formed between a substrate and a flip chip having multiple contacts. Insulating layers are formed on the lateral surfaces of the electrical contacts. When the flip chip is attached to a substrate, the insulating layers reduce the chance of an electrical path being formed in ... 05/11/06 - 20060099735 - Method for wafer level stack die placement A method for wafer level stack die placement is disclosed. At first, a wafer including a plurality of dice is provided. The wafer is adhered to a photosensitive adhesive tape. The wafer is attached on a die carrier to fix at least one die from the wafer on the die ... 05/11/06 - 20060099734 - Cpu power delivery system A central processing unit (CPU) is disclosed. The CPU includes a CPU die; and a voltage regulator die bonded to the CPU die in a three dimensional packaging layout. ... 04/13/06 - 20060079020 - Semiconductor device and a method of assembling a semiconductor device A semiconductor device includes a base substrate; a first fixing layer provided on the base substrate; a first semiconductor chip fixed on the first fixing layer; a first substrate provided above the first semiconductor chip; a plurality of first connection members isolated from the first semiconductor chip, electrically connecting to ... 03/16/06 - 20060057774 - Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packages A microelectronic package and method for forming such a package. In one embodiment, the package can include a microelectronic substrate having first connection sites, and a support member having second connection sites and third connection sites, with the third connection sites accessible for electrical coupling to other electrical structures. A ... 03/16/06 - 20060057773 - Method for producing a stack of chips, a stack of chips and method for producing a chip for a multi-chip stack A method for producing a stack of at least two chips that are electrically interconnected, a stack of chips and a method for producing a chip for a multi-chip stack. A capillary channel is routed in a provided chip from its lower to its upper side. The channel is sufficiently ... 03/09/06 - 20060051893 - Thin substrate support A device for supporting a semiconductor substrate device comprises a sample-holder attached to a treatment chamber including a cooling system and electrical connection means. The device further comprises an intermediate element fixed to the sample-holder by electrostatic means or by means of clamps and electrically and thermally connected to the ... 02/02/06 - 20060024864 - Substrate processing method A substrate processing method includes a first step of exposing a silicon substrate surface to mixed gas plasma of an inert gas and hydrogen, and a second step of conducting any of oxidation processing, nitridation processing and oxynitridation processing to said silicon substrate surface by plasma processing after said first ... 02/02/06 - 20060024863 - Chip package structure and process for fabricating the same A process for fabricating a chip package structure with the following steps is provided. First, a chip having an active surface is provided. A plurality of solder bumps is disposed on the active surface. Then, a polymer material including flux is placed on the surface of the solder bumps by ... 01/12/06 - 20060008943 - Mounting semiconductor chips To mount semiconductor chips (3), the chips are placed in a liquid (5), and drops (51) of the liquid containing no more than one semiconductor chip are positioned on a substrate (2). On the substrate are molecules of a first type (1), on the semiconductor chips (3) are molecules of ... 12/29/05 - 20050287704 - Carrier for substrate film The invention relates to a carrier for supporting a substrate film during the chip-substrate assembly and bonding process. The carrier provides enhanced rigidity to the substrate film. The degree of rigidity and/or flexibility provided can be controlled by selection of the carrier dimensions, configuration and material choice. Advantages of embodiments ... 12/29/05 - 20050287703 - Multi-chip semiconductor connector assembly method In one exemplary embodiment, a multi-chip connector is formed to have a first conductive strip that is attached to a first semiconductor die and a second conductive strip that is attached to a second semiconductor die. ... 12/22/05 - 20050282310 - Encapsulation of multiple integrated circuits In one embodiment, a device includes but is not limited to: a first integrated circuit affixed to a substrate; an electronic circuit component affixed to the substrate; a first encapsulation structure encasing the first integrated circuit; a second integrated circuit affixed to the first encapsulation structure; and a second encapsulation ... 12/01/05 - 20050266610 - Manufacturing methods for semiconductor structures having stacked semiconductor devices Methods of manufacturing a semiconductor structure are provided. The method comprises the steps of providing a first substrate having a first surface, providing a semiconductor device, electrically and physically coupling the semiconductor device to the first surface of said first substrate, providing a second substrate having a first surface, a ... 11/24/05 - 20050260793 - Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and ... 11/24/05 - 20050260792 - Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and ... 11/10/05 - 20050250247 - Method for internal electrical insulation of a substrate for a power semiconductor module A method for internal electrical insulation of a substrate for a power semiconductor module having a framelike insulating housing with a cap and having an insulating substrate. The substrate has conductor tracks and power semiconductor components mounted thereon. The power semiconductor components are connected to connection elements, e.g., further conductor ... 11/03/05 - 20050245001 - Shielded laminated structure with embedded chips A laminated structure that can be used as an add-on card removably disposed on an electronic device, such as a mobile phone. The laminated structure has a number of layers laminated together for embedding one or more RF-chips. Advantageously, one or more layers are made of FR4 boards, each of ... 10/13/05 - 20050227412 - Flexible multi-chip module and method of making the same A semiconductor package including a flexible multichip module having multiple chips on flexible appendages with the flexible appendages folded so that the semiconductor chips are arranged in aligned and stacked positions. ... 09/29/05 - 20050214976 - Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and ... 09/29/05 - 20050214975 - Method of fabricating the planar encapsulated surface A method of fabricating the planar encapsulated surface is described. The substrate is provided, wherein a plurality of packaging units are formed thereon. The lower surface of the substrate is etched to form a trench between every two packaging units. The encapsulation adhesive material is filled to cover the lower ... 09/15/05 - 20050202592 - Semiconductor stacked die devices and methods of forming semiconductor stacked die devices Semiconductor devices and methods of forming semiconductor devices are described. In one embodiment, at least one conductive structure is formed within a plurality of semiconductor substrates. At least portions of one of the conductive structures have oppositely facing, exposed outer surfaces. Individual substrates are stacked together in a die stack ... 09/01/05 - 20050191790 - Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and ... 09/01/05 - 20050191789 - Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and ... 08/18/05 - 20050181537 - Method for producing an electrical circuit An electrical circuit is formed by forming and patterning a conductive layer on a substrate, forming and patterning a conductive layer on another substrate, depositing a dielectric layer on at least a portion of one of conductive layers, mounting an integrated circuit (IC) between the substrates, coupling the IC to ... 08/11/05 - 20050176176 - Ball transferring method and apparatus Balls are sucked onto a carrier board so as to be temporarily arranged in a ball arrangement region of the board, and then the balls are transferred and bonded onto an objective substance with their positions being adjusted. Gas blow is applied to the temporarily arranged balls or alternatively the ... 08/11/05 - 20050176175 - Method of manufacturing hybrid integrated circuit device A method of manufacturing a hybrid integrated circuit device includes the steps of forming a plurality of units each including a conductive pattern on a surface of a board made of metal, forming grooves along boundaries of the respective units of the board, electrically connecting circuit elements to the conductive ... 08/11/05 - 20050176174 - Methodof making an integrated circuit General purpose methods for the fabrication of integrated circuits from flexible membranes formed of very thin low stress dielectric materials, such as silicon dioxide or silicon nitride, and semiconductor layers. Semiconductor devices are formed in a semiconductor layer of the membrane. The semiconductor membrane layer is initially formed from a ... 08/04/05 - 20050170557 - Methods for depositing, releasing and packaging micro-electromechanical devices on wafer substrates A method for forming a MEMS device is disclosed, where a final release step is performed just prior to a wafer bonding step to protect the MEMS device from contamination, physical contact, or other deleterious external events. Without additional changes to the MEMS structure between release and wafer bonding and ... 07/07/05 - 20050148112 - Method of manufacturing an electronic device, and electronic device According to the invention, at least one further cavity (7) is formed in a portion of the carrier plate (4) surrounded by the cavity (6) before the encapsulation (3) is deposited, which further cavity (7) becomes at least substantially filled with a portion of the encapsulation (3) during the deposition ... 06/23/05 - 20050136569 - Plastic lead frames utilizing reel-to-reel processing Reel-to-reel manufacturing methods and systems are disclosed herein. In general, one or more plastic parts (e.g., plastic substrate) can be transported on a carrier for manufacturing of a final product based initially on the part or substrate. A reel-to-reel mechanism is provided comprising one or more reels associated with the ... 06/09/05 - 20050124092 - Patterning method The invention relates to a method for creating a pattern on a substrate comprising a first alignment structure, using an elastomeric stamp comprising a patterning structure and a second alignment structure. The method comprises a moving step for moving the elastomeric stamp towards the substrate, and a deformation step for ... 06/02/05 - 20050118749 - Composition for forming anti-reflective coating There is provided a composition for forming anti-reflective coating for use in a lithography process with irradiation light from F2 excimer laser (wavelength 157 nm) which has a high effect of inhibiting reflected light and causes no intermixing with resist layers, and an anti-reflective coating prepared from the composition, and ... ### FreshPatents.com Support |