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Semiconductor Device Manufacturing: Process > Making Device Or Circuit Responsive To Nonelectrical Signal > Responsive To Electromagnetic Radiation > Contact Formation (i.e., Metallization) Contact Formation (i.e., Metallization)Contact Formation (i.e., Metallization) patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.08/17/06 - 20060183268 - Salicide process for image sensor A self-aligned silicide (salicide) process is used to form a metal salicide for a CMOS image sensor consistent with a conventional CMOS image sensor process flow. An insulator layer is deposited over the pixel array of the image sensor. Portions of the insulator layer are removed using a photoresist mask ... 06/29/06 - 20060141663 - Method for forming metal interconnection of semiconductor device A method for forming a metal interconnection of a semiconductor device avoids over-etching and under-etching through the use of the “self-stop” function of a nitridation layer, to prevent the occurrence of openings and voids in a copper interconnection and to obtain a constant trench depth. The method includes forming nitride ... 07/14/05 - 20050153476 - Flexible display and method of manufacturing the same Provided is a flexible display including a plastic substrate and a protective layer formed on the plastic substrate. Accordingly, the plastic substrate is protected from a thermal damage due to a thermal treatment, and sufficient thermal treatment for forming a polysilicon layer can be performed. Also, a polysilicon layer having ... ### FreshPatents.com Support |