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Semiconductor Device Manufacturing: Process > Making Device Or Circuit Responsive To Nonelectrical Signal > Responsive To Electromagnetic Radiation > Including Integrally Formed Optical Element (e.g., Reflective Layer, Luminescent Layer, Etc.) Including Integrally Formed Optical Element (e.g., Reflective Layer, Luminescent Layer, Etc.)Including Integrally Formed Optical Element (e.g., Reflective Layer, Luminescent Layer, Etc.) patent applications listed are from June 2005 to current and include Date, Patent Application Number, Patent Title, Patent Abstract summary and are linked to the corresponding patent application page.03/08/07 - 20070054436 - Method of manufacturing optical film To provide a method of manufacturing an optical film formed on a plastic substrate. There is provided a method of manufacturing an optical film including the steps of laminating a separation layer and an optical filter on a first substrate, separating the optical filter from the first substrate, attaching the ... 02/01/07 - 20070026564 - Method for forming microlenses of different curvatures and fabricating process of solid-state image sensor A method for forming microlenses of different curvatures is described, wherein a transparent photosensitive layer is formed on a substrate having a planar upper surface. A photomask is used to pattern the photosensitive layer, wherein the photomask has at least two patterns of different transparencies thereon such that at least ... 01/18/07 - 20070015305 - Semiconductor device with micro-lens and method of making the same A semiconductor device including a semiconductor substrate having a photosensor formed therein; a first layer overlying the substrate, the first layer includes a portion having a generally concave shaped surface being the negative shaped of a micro-lens to be formed there over; a second layer overlying the first layer, the ... 11/23/06 - 20060263926 - Light block for pixel arrays Imager devices are formed with light block material between microlenses to enhance the characteristics of image acquisition. The light block material may be deposited over the lenses, and then partially removed to expose central portions of the lenses. The invention is applicable to, among other things, imager devices having pixel ... 08/24/06 - 20060189024 - Microlens structure for image sensors A microlens structure and a method of fabrication thereof are provided. The method comprises forming a layer of microlens material over a substrate, which has photo-sensitive elements formed therein. The microlens material, which comprises a photo-resist material, is exposed in accordance with a desired pattern a plurality of times. The ... 08/24/06 - 20060189023 - Three dimensional structure formed by using an adhesive silicon wafer process A method of making a MEMS device including providing a first substrate with an insulator layer thereon. A holder is attached to the insulator layer, and the first substrate is thinned. Thereafter, cavities are formed in the first substrate and the first substrate is flipped over and bonded to an ... 08/10/06 - 20060177958 - Method for producing an imaging device The invention relates to a method for making an imagery device comprising at least one matrix of pixels made of a photon detecting semiconducting material (43), deposited on a substrate in which electronic devices are integrated and with metallic surfaces (42), in which a material capable of improving bond of ... 07/06/06 - 20060148123 - Method for fabricating cmos image sensor A method for fabricating a CMOS image sensor includes forming a metal pad on a pad region of a semiconductor substrate having an active region and the pad region, forming an insulating film on an entire surface of the semiconductor substrate including the metal pad, forming an opening to expose ... 07/06/06 - 20060148122 - Cmos image sensor and method for manufacturing the same A CMOS image sensor and a method for manufacturing the same are provided, in which a pad opening is formed simultaneously with the formation of a microlens. The CMOS image sensor includes a nitride layer for passivation deposited on an oxide layer, wherein a sacrificial microlens having a microlens structure ... 05/18/06 - 20060105490 - Microlens manufacturing method The present invention provides a method for manufacturing a microlens in a semiconductor substrate having a first surface and a second surface, comprising the steps of preparing the semiconductor substrate, forming a first resist layer approximately cylindrical in form on the first surface of the semiconductor substrate, reflowing the first ... 01/19/06 - 20060014314 - Image sensor with light guides An image sensor device and fabrication method thereof. An image sensing array is formed in a substrate, wherein the image sensing array comprises a plurality of photosensors with spaces therebetween. A first dielectric layer with a first refractive index is formed overlying the spaces but not the photosensors. A conformal ... 01/12/06 - 20060008940 - Method for fabricating photodiode of cmos image sensor A method for fabricating a photodiode of a CMOS image sensor is disclosed, to improve a charge accumulation capacity in the photodiode, which includes the steps of defining a semiconductor substrate as an active area and a field area by forming an STI layer; firstly implanting impurity ions for formation ... 01/05/06 - 20060003484 - Using deuterated source gasses to fabricate low loss gesion sion waveguides The present invention provides a method of manufacturing optical devices which includes the steps of providing a substrate and forming at least one optical layer on the substrate. The optical layer is formed by a chemical vapor deposition (CVD) process which includes a deuterated source gas. The present invention also ... 12/29/05 - 20050287696 - Waveguiding structures with embedded microchannels and method for fabrication thereof The invention provides a method for fabricating planar waveguiding structures with embedded microchannels. The method includes the step of depositing, over a planar template having at least one indented feature comprising a ridge of a first optical material and a narrow trench adjacent thereto, a second optical material, and the ... 12/01/05 - 20050266603 - Image sensor comprising a pixel array having an optical element positioned relative to each pixel A method for manufacturing an image sensor including an array of pixels and an imaging lens exit pupil for focusing rays of light onto the array of pixels is provided. Each pixel includes a light sensitive region and at least one optical element associated therewith. The method includes positioning the ... 07/21/05 - 20050158908 - Process for fabricating a homogenously mixed powder/pelletized compound for use in light emitting devices The present invention comprises a process of mixing a luminous substance in powder form to a transferable grade molding compound in a pelletized or powder form, such as a clear epoxy, to derive a homogeneous mixture that can be pressed and sintered into solid pellets. The solid pellets are further ... 07/14/05 - 20050153474 - Vertical optical path structure for infrared photodetection Provided are a SiGe vertical optical path and a method for selectively forming a SiGe optical path normal structure for IR photodetection. The method comprises: forming a Si substrate surface; forming a Si feature, normal with respect to the Si substrate surface, such as a trench, via, or pillar; and, ... 07/07/05 - 20050148110 - Method for producing a luminescence diode chip A method for producing a luminescence diode chip, in which provision is made of a semiconductor body is provided having an epitaxially grown semiconductor layer sequence having an active zone and a radiation coupling-out area, the active zone emitting an electromagnetic radiation during operation of the luminescence diode, a large ... 06/30/05 - 20050142689 - Method of forming an image sensor with large radius micro-lenses A solid state image sensor having micro-lenses connected to each other by filling separations between trapezoidal separated sections of a protection layer with photoresist and a manufacturing method thereof comprises trapezoidal separated sections of the protection layer which is formed on a predetermined lower layer of a semiconductor substrate and ... ### FreshPatents.com Support |